{"id":"https://openalex.org/W4249565978","doi":"https://doi.org/10.1109/iccad.2007.4397355","title":"The effect of process variation on device temperature in finFET circuits","display_name":"The effect of process variation on device temperature in finFET circuits","publication_year":2007,"publication_date":"2007-11-01","ids":{"openalex":"https://openalex.org/W4249565978","doi":"https://doi.org/10.1109/iccad.2007.4397355"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2007.4397355","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2007.4397355","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103231030","display_name":"Jung Hwan Choi","orcid":"https://orcid.org/0009-0009-4976-9930"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jung Hwan Choi","raw_affiliation_strings":["School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103408759","display_name":"Jayathi Y. Murthy","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jayathi Murthy","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031161187","display_name":"Kaushik Roy","orcid":"https://orcid.org/0000-0002-0735-9695"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kaushik Roy","raw_affiliation_strings":["School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7184,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.77206652,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"747","last_page":"751"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process-variation","display_name":"Process variation","score":0.7968162298202515},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.7221518754959106},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.6381171941757202},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5628127455711365},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.5085140466690063},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4939654469490051},{"id":"https://openalex.org/keywords/monte-carlo-method","display_name":"Monte Carlo method","score":0.4604405164718628},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4233246445655823},{"id":"https://openalex.org/keywords/logic-gate","display_name":"Logic gate","score":0.41460901498794556},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4081859886646271},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27792173624038696},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.273506224155426},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21293333172798157},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1859968602657318},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.150445818901062},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.12040314078330994},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07253402471542358}],"concepts":[{"id":"https://openalex.org/C93389723","wikidata":"https://www.wikidata.org/wiki/Q7247313","display_name":"Process variation","level":3,"score":0.7968162298202515},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.7221518754959106},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.6381171941757202},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5628127455711365},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5085140466690063},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4939654469490051},{"id":"https://openalex.org/C19499675","wikidata":"https://www.wikidata.org/wiki/Q232207","display_name":"Monte Carlo method","level":2,"score":0.4604405164718628},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4233246445655823},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.41460901498794556},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4081859886646271},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27792173624038696},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.273506224155426},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21293333172798157},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1859968602657318},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.150445818901062},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.12040314078330994},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07253402471542358},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad.2007.4397355","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2007.4397355","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.75,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1489111899","https://openalex.org/W1517992858","https://openalex.org/W1596180985","https://openalex.org/W1661368752","https://openalex.org/W2028429291","https://openalex.org/W2119821681","https://openalex.org/W2143024227","https://openalex.org/W2153197104","https://openalex.org/W2160580687","https://openalex.org/W2162935501","https://openalex.org/W2403892707","https://openalex.org/W4235029849","https://openalex.org/W4254506919","https://openalex.org/W6643039856","https://openalex.org/W6713345230"],"related_works":["https://openalex.org/W2080140894","https://openalex.org/W3156288925","https://openalex.org/W2965236686","https://openalex.org/W2385771124","https://openalex.org/W1519912902","https://openalex.org/W2357840701","https://openalex.org/W2364814511","https://openalex.org/W2383951343","https://openalex.org/W3215142653","https://openalex.org/W1487051936"],"abstract_inverted_index":{"With":[0],"technology":[1],"scaling,":[2],"devices":[3],"are":[4],"increasingly":[5],"prone":[6],"to":[7,24,75],"process":[8,25,66,109],"variations.":[9],"These":[10],"variations":[11,34,45,50,92],"cause":[12],"a":[13,119],"large":[14],"spread":[15],"in":[16,28,31,46,51,130,136],"leakage":[17,79,97],"power,":[18],"since":[19,93],"it":[20],"is":[21,103],"extremely":[22],"sensitive":[23],"variations,":[26],"which":[27],"turn":[29],"results":[30,83],"larger":[32,90],"temperature":[33,44,63,77,91,95],"across":[35],"different":[36],"dies.":[37],"In":[38],"this":[39],"paper,":[40],"we":[41],"investigate":[42],"the":[43],"FinFET":[47,139],"circuits":[48,88],"considering":[49],"following":[52],"parameters":[53],"(i)":[54],"channel":[55,113],"length":[56,114],"and":[57,78,99,115,118],"(ii)":[58],"body":[59,116],"thickness.":[60],"We":[61],"estimate":[62],"variation":[64,110],"under":[65,107],"fluctuation":[67],"by":[68],"Monte":[69],"Carlo":[70],"simulation":[71],"with":[72],"thermal":[73,126],"models":[74],"solve":[76],"power":[80,98],"self-consistently.":[81],"The":[82],"show":[84],"that":[85,106],"high":[86],"activity":[87,123],"exhibit":[89],"increased":[94],"increments":[96],"vice":[100],"versa.":[101],"It":[102],"also":[104],"shown":[105],"moderate":[108],"(3sigma=10%":[111],"for":[112],"thickness)":[117],"nominal":[120],"primary":[121],"input":[122],"of":[124,134],"0.4,":[125],"runaway":[127],"can":[128],"occur":[129],"more":[131],"than":[132],"15%":[133],"chips":[135],"28":[137],"nm":[138],"technology,":[140],"severely":[141],"degrading":[142],"manufacturing":[143],"yield.":[144]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}