{"id":"https://openalex.org/W4235066485","doi":"https://doi.org/10.1109/iccad.2007.4397329","title":"3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits","display_name":"3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits","publication_year":2007,"publication_date":"2007-11-01","ids":{"openalex":"https://openalex.org/W4235066485","doi":"https://doi.org/10.1109/iccad.2007.4397329"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2007.4397329","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2007.4397329","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081772659","display_name":"Pingqiang Zhou","orcid":"https://orcid.org/0000-0001-9515-9302"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pingqiang Zhou","raw_affiliation_strings":["CS Department, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CS Department, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102025379","display_name":"Yuchun Ma","orcid":"https://orcid.org/0000-0003-3160-6681"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuchun Ma","raw_affiliation_strings":["CS Department, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CS Department, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054608515","display_name":"Zhouyuan Li","orcid":"https://orcid.org/0000-0003-2830-4076"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhouyuan Li","raw_affiliation_strings":["Advanced Technology Group, Synopsys, Inc., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Technology Group, Synopsys, Inc., Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068224304","display_name":"Robert P. Dick","orcid":"https://orcid.org/0000-0001-5428-9530"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert P. Dick","raw_affiliation_strings":["EECS Department, Northwestern University, Evanston, IL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EECS Department, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004722925","display_name":"Li Shang","orcid":"https://orcid.org/0000-0003-3944-7531"},"institutions":[{"id":"https://openalex.org/I204722609","display_name":"Queen's University","ror":"https://ror.org/02y72wh86","country_code":"CA","type":"education","lineage":["https://openalex.org/I204722609"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Li Shang","raw_affiliation_strings":["ECE Department, Queen's University, Kingston, ONT, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ECE Department, Queen's University, Kingston, ONT, Canada","institution_ids":["https://openalex.org/I204722609"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103038285","display_name":"Hai Zhou","orcid":"https://orcid.org/0000-0003-4824-7179"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hai Zhou","raw_affiliation_strings":["EECS Department, Northwestern University, Evanston, IL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EECS Department, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111768666","display_name":"Xianlong Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xianlong Hong","raw_affiliation_strings":["CS Department, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CS Department, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101929509","display_name":"Qiang Zhou","orcid":"https://orcid.org/0000-0003-1348-8861"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiang Zhou","raw_affiliation_strings":["CS Department, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CS Department, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":70,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"590","last_page":"597"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.9775359034538269},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.7631955146789551},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5989004373550415},{"id":"https://openalex.org/keywords/simulated-annealing","display_name":"Simulated annealing","score":0.5282451510429382},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.4920022189617157},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.47189223766326904},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.45213666558265686},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.440912127494812},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.41943126916885376},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.36906325817108154},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.3388633728027344},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.2645097076892853},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2287941575050354},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2160385251045227},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.1613599956035614}],"concepts":[{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.9775359034538269},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.7631955146789551},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5989004373550415},{"id":"https://openalex.org/C126980161","wikidata":"https://www.wikidata.org/wiki/Q863783","display_name":"Simulated annealing","level":2,"score":0.5282451510429382},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4920022189617157},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.47189223766326904},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.45213666558265686},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.440912127494812},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.41943126916885376},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.36906325817108154},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.3388633728027344},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.2645097076892853},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2287941575050354},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2160385251045227},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.1613599956035614},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad.2007.4397329","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2007.4397329","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1494160854","https://openalex.org/W1527137186","https://openalex.org/W1538951169","https://openalex.org/W1541633348","https://openalex.org/W1666750238","https://openalex.org/W1990935421","https://openalex.org/W2068306188","https://openalex.org/W2106904411","https://openalex.org/W2114542420","https://openalex.org/W2125653639","https://openalex.org/W2141235761","https://openalex.org/W2143034719","https://openalex.org/W2153770483","https://openalex.org/W2154462472","https://openalex.org/W2158921969","https://openalex.org/W3140686304","https://openalex.org/W4237299108","https://openalex.org/W4239055271","https://openalex.org/W4239364405","https://openalex.org/W4243380698","https://openalex.org/W4246229820","https://openalex.org/W4254470553","https://openalex.org/W6629394857","https://openalex.org/W6631416227","https://openalex.org/W6632312726","https://openalex.org/W6653687070","https://openalex.org/W6661909638","https://openalex.org/W6677352907","https://openalex.org/W6681326296","https://openalex.org/W6684944495"],"related_works":["https://openalex.org/W4256007160","https://openalex.org/W2094042791","https://openalex.org/W4205135025","https://openalex.org/W3153286430","https://openalex.org/W2781601456","https://openalex.org/W2138401961","https://openalex.org/W4249576260","https://openalex.org/W4388721364","https://openalex.org/W3047088815","https://openalex.org/W3172718840"],"abstract_inverted_index":{"Thermal":[0],"issues":[1],"are":[2],"a":[3,54,98,104],"primary":[4],"concern":[5],"in":[6],"the":[7,90,137,167],"threedimensional":[8],"(3D)":[9],"integrated":[10],"circuit":[11],"(IC)":[12],"design.":[13],"Temperature,":[14],"area,":[15],"and":[16,40,52,118,143],"wire":[17,171],"length":[18,172],"must":[19,74],"be":[20],"simultaneously":[21],"optimized":[22],"during":[23,121],"3D":[24,45,95,162],"floorplanning,":[25],"significantly":[26],"increasing":[27],"optimization":[28,36,107,134],"complexity.":[29],"Most":[30],"existing":[31],"floorplanners":[32],"use":[33],"combinatorial":[34],"stochastic":[35],"techniques,":[37,62],"hampering":[38],"performance":[39,150],"scalability":[41],"when":[42,83],"used":[43,84,129],"for":[44,85,154],"floorplanning.":[46,123],"In":[47],"this":[48],"work,":[49,164],"we":[50,102],"propose":[51,103],"evaluate":[53],"scalable,":[55],"temperature-aware,":[56],"force-directed":[57,106],"floorplanner":[58],"called":[59],"3D-STAF.":[60],"Force-directed":[61],"although":[63],"efficient":[64],"at":[65],"reacting":[66],"to":[67,97,132,159],"physical":[68],"information":[69],"such":[70],"as":[71],"temperature":[72,180],"gradients,":[73],"eventually":[75],"eliminate":[76,115],"overlap.":[77],"This":[78],"can":[79],"cause":[80],"significant":[81],"displacement":[82],"heterogeneous":[86],"blocks.":[87],"To":[88],"smooth":[89],"transition":[91],"from":[92],"an":[93],"unconstrained":[94],"placement":[96],"legalized,":[99],"layer-assigned":[100],"floorplan,":[101],"three-stage":[105],"flow":[108],"combined":[109],"with":[110],"new":[111],"legalization":[112],"techniques":[113],"that":[114,151],"white":[116],"spaces":[117],"block":[119],"overlapping":[120],"multi-layer":[122],"A":[124],"temperature-dependent":[125],"leakage":[126,144],"model":[127],"is":[128],"within":[130],"3D-STAF":[131,147,165],"permit":[133],"based":[135],"on":[136,188],"feedback":[138],"loop":[139],"connecting":[140],"thermal":[141],"profile":[142],"power":[145],"consumption.":[146],"has":[148],"good":[149],"scales":[152],"well":[153],"large":[155],"problem":[156],"instances.":[157],"Compared":[158],"recently":[160],"published":[161],"floorplanning":[163],"improves":[166],"area":[168],"by":[169,173,177,181],"6%,":[170],"16%,":[174],"via":[175],"count":[176],"22%,":[178],"peak":[179],"6%":[182],"while":[183],"running":[184],"nearly":[185],"4\u00d7":[186],"faster":[187],"average.":[189]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":7},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":5}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}