{"id":"https://openalex.org/W3015504877","doi":"https://doi.org/10.1109/icassp40776.2020.9054416","title":"Augmented Grad-CAM: Heat-Maps Super Resolution Through Augmentation","display_name":"Augmented Grad-CAM: Heat-Maps Super Resolution Through Augmentation","publication_year":2020,"publication_date":"2020-04-09","ids":{"openalex":"https://openalex.org/W3015504877","doi":"https://doi.org/10.1109/icassp40776.2020.9054416","mag":"3015504877"},"language":"en","primary_location":{"id":"doi:10.1109/icassp40776.2020.9054416","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icassp40776.2020.9054416","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/11311/1156462","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064927178","display_name":"Pietro Morbidelli","orcid":null},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Pietro Morbidelli","raw_affiliation_strings":["Politecnico di Milano, DEIB, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Politecnico di Milano, DEIB, Italy","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068666949","display_name":"Diego Carrera","orcid":"https://orcid.org/0000-0002-5455-5867"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Diego Carrera","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110947898","display_name":"Beatrice Rossi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Beatrice Rossi","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075226337","display_name":"Pasqualina Fragneto","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Pasqualina Fragneto","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006716646","display_name":"Giacomo Boracchi","orcid":"https://orcid.org/0000-0002-1650-3054"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Giacomo Boracchi","raw_affiliation_strings":["Politecnico di Milano, DEIB, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Politecnico di Milano, DEIB, Italy","institution_ids":["https://openalex.org/I93860229"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"4067","last_page":"4071"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/regularization","display_name":"Regularization (linguistics)","score":0.72515869140625},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6237959265708923},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.5381932854652405},{"id":"https://openalex.org/keywords/resolution","display_name":"Resolution (logic)","score":0.5335140228271484},{"id":"https://openalex.org/keywords/inference","display_name":"Inference","score":0.5187068581581116},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.5102393627166748},{"id":"https://openalex.org/keywords/image-resolution","display_name":"Image resolution","score":0.48535600304603577},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4318270683288574},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.3745822310447693},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.35877418518066406},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.09542584419250488}],"concepts":[{"id":"https://openalex.org/C2776135515","wikidata":"https://www.wikidata.org/wiki/Q17143721","display_name":"Regularization (linguistics)","level":2,"score":0.72515869140625},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6237959265708923},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.5381932854652405},{"id":"https://openalex.org/C138268822","wikidata":"https://www.wikidata.org/wiki/Q1051925","display_name":"Resolution (logic)","level":2,"score":0.5335140228271484},{"id":"https://openalex.org/C2776214188","wikidata":"https://www.wikidata.org/wiki/Q408386","display_name":"Inference","level":2,"score":0.5187068581581116},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.5102393627166748},{"id":"https://openalex.org/C205372480","wikidata":"https://www.wikidata.org/wiki/Q210521","display_name":"Image resolution","level":2,"score":0.48535600304603577},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4318270683288574},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.3745822310447693},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.35877418518066406},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09542584419250488},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icassp40776.2020.9054416","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icassp40776.2020.9054416","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)","raw_type":"proceedings-article"},{"id":"pmh:oai:re.public.polimi.it:11311/1156462","is_oa":true,"landing_page_url":"http://hdl.handle.net/11311/1156462","pdf_url":null,"source":{"id":"https://openalex.org/S4306400312","display_name":"Virtual Community of Pathological Anatomy (University of Castilla La Mancha)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79189158","host_organization_name":"University of Castilla-La Mancha","host_organization_lineage":["https://openalex.org/I79189158"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":{"id":"pmh:oai:re.public.polimi.it:11311/1156462","is_oa":true,"landing_page_url":"http://hdl.handle.net/11311/1156462","pdf_url":null,"source":{"id":"https://openalex.org/S4306400312","display_name":"Virtual Community of Pathological Anatomy (University of Castilla La Mancha)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79189158","host_organization_name":"University of Castilla-La Mancha","host_organization_lineage":["https://openalex.org/I79189158"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.46000000834465027,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1522301498","https://openalex.org/W1686810756","https://openalex.org/W2108598243","https://openalex.org/W2117539524","https://openalex.org/W2165939075","https://openalex.org/W2295107390","https://openalex.org/W2626639386","https://openalex.org/W2765793020","https://openalex.org/W2790607928","https://openalex.org/W2962858109","https://openalex.org/W2963182550","https://openalex.org/W2964121744","https://openalex.org/W2965696320","https://openalex.org/W2972179887","https://openalex.org/W4293861706","https://openalex.org/W6631190155","https://openalex.org/W6637373629","https://openalex.org/W6739575509","https://openalex.org/W6766931891"],"related_works":["https://openalex.org/W2362774332","https://openalex.org/W4249245269","https://openalex.org/W2025681766","https://openalex.org/W2765548132","https://openalex.org/W2542402767","https://openalex.org/W2158056054","https://openalex.org/W3023086044","https://openalex.org/W2294441925","https://openalex.org/W2142226356","https://openalex.org/W3210000161"],"abstract_inverted_index":{"We":[0,45],"present":[1],"Augmented":[2,79,96],"Grad-CAM,":[3],"a":[4,9,55],"general":[5,56],"framework":[6],"to":[7,19,25,99,114,122],"provide":[8],"high-resolution":[10,48],"visual":[11],"explanation":[12],"of":[13,22,40,107],"CNN":[14],"outputs.":[15],"Our":[16],"idea":[17],"is":[18,66],"take":[20],"advantage":[21],"image":[23,77],"augmentation":[24],"aggregate":[26],"multiple":[27],"low-resolution":[28],"heat-maps":[29],"-":[30,35],"in":[31,83,103,126],"our":[32],"experiments":[33],"Grad-CAMs":[34],"computed":[36],"from":[37],"augmented":[38],"copies":[39],"the":[41,47,70,105,119,127],"same":[42],"input":[43],"image.":[44],"generate":[46],"heat-map":[49],"through":[50],"super-resolution,":[51],"and":[52,90],"we":[53],"formulate":[54],"optimization":[57],"problem":[58,65],"based":[59],"on":[60,69,87,118],"Total":[61],"Variation":[62],"regularization.":[63],"This":[64],"entirely":[67],"solved":[68],"GPU":[71],"at":[72],"inference":[73],"time,":[74],"together":[75],"with":[76],"augmentation.":[78],"Grad-CAM":[80,82,97],"outperforms":[81],"weakly":[84],"supervised":[85],"localization":[86],"Imagenet":[88],"dataset,":[89],"provides":[91],"more":[92],"detailed":[93],"heat-maps.":[94],"Moreover,":[95],"turns":[98],"be":[100],"particularly":[101],"useful":[102],"monitoring":[104],"production":[106,128],"silicon":[108],"wafers,":[109],"where":[110],"CNNs":[111],"are":[112],"employed":[113],"classify":[115],"defective":[116],"patterns":[117],"wafer":[120],"surface":[121],"detect":[123],"harmful":[124],"faults":[125],"line.":[129]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2020-04-17T00:00:00"}