{"id":"https://openalex.org/W2518881007","doi":"https://doi.org/10.1109/hpcsim.2016.7568418","title":"High temperature coolant demonstrated for a computational cluster","display_name":"High temperature coolant demonstrated for a computational cluster","publication_year":2016,"publication_date":"2016-07-01","ids":{"openalex":"https://openalex.org/W2518881007","doi":"https://doi.org/10.1109/hpcsim.2016.7568418","mag":"2518881007"},"language":"en","primary_location":{"id":"doi:10.1109/hpcsim.2016.7568418","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hpcsim.2016.7568418","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Conference on High Performance Computing & Simulation (HPCS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041393827","display_name":"E. A. Druzhinin","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Egor Druzhinin","raw_affiliation_strings":["ZAO \u201cRSC Technologies\u201d, Moscow, Russia","ZAO \"RSC Technologies\", Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"ZAO \u201cRSC Technologies\u201d, Moscow, Russia","institution_ids":[]},{"raw_affiliation_string":"ZAO \"RSC Technologies\", Moscow, Russia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113781878","display_name":"Alexey Shmelev","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Alexey Shmelev","raw_affiliation_strings":["ZAO \u201cRSC Technologies\u201d, Moscow, Russia","ZAO \"RSC Technologies\", Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"ZAO \u201cRSC Technologies\u201d, Moscow, Russia","institution_ids":[]},{"raw_affiliation_string":"ZAO \"RSC Technologies\", Moscow, Russia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059173113","display_name":"Alexander Moskovsky","orcid":"https://orcid.org/0000-0002-6424-320X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Alexander Moskovsky","raw_affiliation_strings":["ZAO \u201cRSC Technologies\u201d, Moscow, Russia","ZAO \"RSC Technologies\", Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"ZAO \u201cRSC Technologies\u201d, Moscow, Russia","institution_ids":[]},{"raw_affiliation_string":"ZAO \"RSC Technologies\", Moscow, Russia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001575210","display_name":"Yuri Migal","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yuri Migal","raw_affiliation_strings":["ZAO \u201cRSC Technologies\u201d, Moscow, Russia","ZAO \"RSC Technologies\", Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"ZAO \u201cRSC Technologies\u201d, Moscow, Russia","institution_ids":[]},{"raw_affiliation_string":"ZAO \"RSC Technologies\", Moscow, Russia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080056836","display_name":"Vladimir Mironov","orcid":"https://orcid.org/0000-0002-9454-5823"},"institutions":[{"id":"https://openalex.org/I19880235","display_name":"Lomonosov Moscow State University","ror":"https://ror.org/010pmpe69","country_code":"RU","type":"education","lineage":["https://openalex.org/I19880235"]}],"countries":["RU"],"is_corresponding":false,"raw_author_name":"Vladimir Mironov","raw_affiliation_strings":["Lomonosov Moscow State University, Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"Lomonosov Moscow State University, Moscow, Russia","institution_ids":["https://openalex.org/I19880235"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041594175","display_name":"Andrey Semin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210094487","display_name":"Intel (Germany)","ror":"https://ror.org/00m2x0g47","country_code":"DE","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210094487"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andrey Semin","raw_affiliation_strings":["Intel Deutschland GmbH, Munich, Germany"],"affiliations":[{"raw_affiliation_string":"Intel Deutschland GmbH, Munich, Germany","institution_ids":["https://openalex.org/I4210094487"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5041393827"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2602,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.61092176,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"10","issue":null,"first_page":"814","last_page":"817"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/coolant","display_name":"Coolant","score":0.7593902349472046},{"id":"https://openalex.org/keywords/nuclear-engineering","display_name":"Nuclear engineering","score":0.49840378761291504},{"id":"https://openalex.org/keywords/active-cooling","display_name":"Active cooling","score":0.4856332838535309},{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.46684345602989197},{"id":"https://openalex.org/keywords/air-cooling","display_name":"Air cooling","score":0.44393470883369446},{"id":"https://openalex.org/keywords/environmental-science","display_name":"Environmental science","score":0.4156171977519989},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3817024827003479},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.33945223689079285},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22838133573532104}],"concepts":[{"id":"https://openalex.org/C91914117","wikidata":"https://www.wikidata.org/wiki/Q1056832","display_name":"Coolant","level":2,"score":0.7593902349472046},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.49840378761291504},{"id":"https://openalex.org/C156820238","wikidata":"https://www.wikidata.org/wiki/Q422876","display_name":"Active cooling","level":3,"score":0.4856332838535309},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.46684345602989197},{"id":"https://openalex.org/C105873366","wikidata":"https://www.wikidata.org/wiki/Q1208873","display_name":"Air cooling","level":2,"score":0.44393470883369446},{"id":"https://openalex.org/C39432304","wikidata":"https://www.wikidata.org/wiki/Q188847","display_name":"Environmental science","level":0,"score":0.4156171977519989},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3817024827003479},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33945223689079285},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22838133573532104},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/hpcsim.2016.7568418","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hpcsim.2016.7568418","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Conference on High Performance Computing & Simulation (HPCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1608932932","https://openalex.org/W1997674351","https://openalex.org/W2051101806","https://openalex.org/W2143343910","https://openalex.org/W2174008574","https://openalex.org/W3098676847","https://openalex.org/W4213364828"],"related_works":["https://openalex.org/W2071424948","https://openalex.org/W4312768595","https://openalex.org/W2343074808","https://openalex.org/W4396643344","https://openalex.org/W2037326712","https://openalex.org/W2121129873","https://openalex.org/W4389061003","https://openalex.org/W2128361774","https://openalex.org/W2197515183","https://openalex.org/W2502423323"],"abstract_inverted_index":{"Energy":[0],"efficiency":[1],"is":[2,19,43,65,73,130,228],"an":[3,133],"important":[4],"aspect":[5],"of":[6,27,51,172],"high":[7],"performance":[8],"computing":[9],"systems":[10],"design,":[11],"as":[12],"the":[13,28,52,55,70,83,86,122,178,192,216,221],"power":[14],"consumption":[15,26],"grows.":[16],"Free":[17],"cooling":[18,29,117,161],"a":[20,153,173],"widespread":[21],"technique":[22],"to":[23,35,80,135,183,230],"lower":[24],"energy":[25],"subsystem,":[30],"usually":[31],"requires":[32],"expensive":[33],"equipment":[34],"be":[36,47,78],"installed.":[37],"The":[38,127],"standard":[39],"chilled":[40],"water":[41],"temperature":[42,64,72,165,180,227],"7":[44],"\u00b0C":[45,185,232],"may":[46],"attained":[48],"large":[49],"part":[50],"year":[53],"in":[54,58],"Europe,":[56],"and":[57,95,141,169,233],"North":[59],"America,":[60],"when":[61,224],"atmosphere":[62,119],"air":[63,71,120],"low":[66,156],"enough.":[67],"In":[68,85],"case":[69],"higher,":[74],"freon":[75],"compressors":[76],"should":[77],"used":[79],"cool":[81],"down":[82],"liquid.":[84],"presented":[87],"work":[88],"we":[89],"report":[90,210],"about":[91],"blade":[92],"server":[93,128,187,194],"design":[94,129],"computational":[96,218],"cluster":[97,219],"installation":[98],"with":[99,118,138,155,162,201],"direct":[100],"liquid":[101,142,226],"cooling,":[102],"that":[103,158],"operate":[104],"at":[105,121],"coolant":[106,168,179,225],"temperatures":[107],"above":[108],"50":[109,231],"\u00b0C,":[110],"which":[111],"enables":[112],"24":[113],"hour,":[114],"year-round":[115],"free":[116],"most":[123],"locations":[124],"on":[125,132,191,197,220],"Earth.":[126],"based":[131],"approach":[134],"utilize":[136],"coldplates":[137],"channel":[139],"structure":[140],"circulation":[143],"for":[144,215],"heat":[145],"removal":[146],"from":[147],"semiconductor":[148],"components.":[149],"We":[150,208],"have":[151],"designed":[152],"coldplate":[154],"heat-resistance":[157],"ensures":[159],"effective":[160],"only":[163],"20-30\u00b0":[164],"difference":[166],"between":[167],"electronic":[170],"parts":[171],"server.":[174],"Under":[175],"stress-test":[176],"conditions":[177],"was":[181,189],"up":[182],"65":[184],"while":[186],"operation":[188],"undisturbed":[190],"individual":[193],"level":[195],"(based":[196],"Intel":[198,203],"Grantley":[199],"platform":[200],"dual":[202],"Xeon":[204],"E5-2697":[205],"v3":[206],"processors).":[207],"also":[209],"first":[211],"stress":[212],"test":[213],"results":[214],"24-node":[217],"same":[222],"platform,":[223],"set":[229],"more.":[234]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}