{"id":"https://openalex.org/W2155739617","doi":"https://doi.org/10.1109/hpca.2009.4798234","title":"A low-radix and low-diameter 3D interconnection network design","display_name":"A low-radix and low-diameter 3D interconnection network design","publication_year":2009,"publication_date":"2009-02-01","ids":{"openalex":"https://openalex.org/W2155739617","doi":"https://doi.org/10.1109/hpca.2009.4798234","mag":"2155739617"},"language":"en","primary_location":{"id":"doi:10.1109/hpca.2009.4798234","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hpca.2009.4798234","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE 15th International Symposium on High Performance Computer Architecture","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051172488","display_name":"Yi Xu","orcid":"https://orcid.org/0000-0001-8894-525X"},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yi Xu","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102025730","display_name":"Yu Du","orcid":"https://orcid.org/0000-0002-2239-4659"},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Du","raw_affiliation_strings":["Department of Computer Science, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055093285","display_name":"Bo Zhao","orcid":"https://orcid.org/0000-0002-0859-1250"},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bo Zhao","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030340299","display_name":"Xiuyi Zhou","orcid":null},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiuyi Zhou","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026996875","display_name":"Youtao Zhang","orcid":"https://orcid.org/0000-0001-8425-8743"},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Youtao Zhang","raw_affiliation_strings":["Department of Computer Science, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030384645","display_name":"Jun Yang","orcid":"https://orcid.org/0000-0002-8379-0321"},"institutions":[{"id":"https://openalex.org/I170201317","display_name":"University of Pittsburgh","ror":"https://ror.org/01an3r305","country_code":"US","type":"education","lineage":["https://openalex.org/I170201317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jun Yang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I170201317"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I170201317"],"apc_list":null,"apc_paid":null,"fwci":14.8852,"has_fulltext":false,"cited_by_count":88,"citation_normalized_percentile":{"value":0.99163693,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"30","last_page":"42"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10179","display_name":"Supercapacitor Materials and Fabrication","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9864000082015991,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7648645043373108},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.698673665523529},{"id":"https://openalex.org/keywords/network-topology","display_name":"Network topology","score":0.6313732862472534},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.5797973275184631},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5347406268119812},{"id":"https://openalex.org/keywords/router","display_name":"Router","score":0.4859508275985718},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.47787824273109436},{"id":"https://openalex.org/keywords/logical-topology","display_name":"Logical topology","score":0.44202226400375366},{"id":"https://openalex.org/keywords/network-architecture","display_name":"Network architecture","score":0.43191689252853394},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.42311346530914307},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.3929392993450165},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.36368465423583984},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3398903012275696},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1461200714111328},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11874279379844666}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7648645043373108},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.698673665523529},{"id":"https://openalex.org/C199845137","wikidata":"https://www.wikidata.org/wiki/Q145490","display_name":"Network topology","level":2,"score":0.6313732862472534},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.5797973275184631},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5347406268119812},{"id":"https://openalex.org/C2775896111","wikidata":"https://www.wikidata.org/wiki/Q642560","display_name":"Router","level":2,"score":0.4859508275985718},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.47787824273109436},{"id":"https://openalex.org/C117729477","wikidata":"https://www.wikidata.org/wiki/Q145490","display_name":"Logical topology","level":3,"score":0.44202226400375366},{"id":"https://openalex.org/C193415008","wikidata":"https://www.wikidata.org/wiki/Q639681","display_name":"Network architecture","level":2,"score":0.43191689252853394},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.42311346530914307},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.3929392993450165},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.36368465423583984},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3398903012275696},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1461200714111328},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11874279379844666},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/hpca.2009.4798234","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hpca.2009.4798234","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE 15th International Symposium on High Performance Computer Architecture","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.160.7670","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.160.7670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www3.cs.pitt.edu/~zhangyt/research/hpca09.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8600000143051147,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":40,"referenced_works":["https://openalex.org/W1543981997","https://openalex.org/W1974843053","https://openalex.org/W2001505646","https://openalex.org/W2039358455","https://openalex.org/W2048789167","https://openalex.org/W2096696871","https://openalex.org/W2099399959","https://openalex.org/W2102387714","https://openalex.org/W2104283712","https://openalex.org/W2106537813","https://openalex.org/W2111531437","https://openalex.org/W2116981307","https://openalex.org/W2117816012","https://openalex.org/W2118961575","https://openalex.org/W2120635877","https://openalex.org/W2123415020","https://openalex.org/W2126475076","https://openalex.org/W2126699268","https://openalex.org/W2133044942","https://openalex.org/W2135489208","https://openalex.org/W2143807959","https://openalex.org/W2145252892","https://openalex.org/W2152727770","https://openalex.org/W2153025112","https://openalex.org/W2153215457","https://openalex.org/W2166695060","https://openalex.org/W2169387321","https://openalex.org/W2171825402","https://openalex.org/W2786741601","https://openalex.org/W3139689176","https://openalex.org/W3142356592","https://openalex.org/W3150157207","https://openalex.org/W4235990555","https://openalex.org/W4239080746","https://openalex.org/W6632558102","https://openalex.org/W6641226323","https://openalex.org/W6674498722","https://openalex.org/W6675224354","https://openalex.org/W6679620896","https://openalex.org/W6682523245"],"related_works":["https://openalex.org/W2122026593","https://openalex.org/W2582203024","https://openalex.org/W1588358165","https://openalex.org/W4237683758","https://openalex.org/W2370711413","https://openalex.org/W2052038519","https://openalex.org/W2375932043","https://openalex.org/W2841075164","https://openalex.org/W2150932551","https://openalex.org/W2050961419"],"abstract_inverted_index":{"Interconnection":[0],"plays":[1],"an":[2],"important":[3,55],"role":[4],"in":[5,83,135,187],"performance":[6],"and":[7,25,104,108,121,170,230],"power":[8,105,120],"of":[9,33,49,106,163,190,200,206,221],"CMP":[10],"designs":[11],"using":[12,147,204],"deep":[13],"sub-micron":[14],"technology.":[15],"The":[16,31,194,214],"network-on-chip":[17],"(NoCs)":[18],"has":[19,37,54],"been":[20],"proposed":[21,215],"as":[22,210],"a":[23,143,182,191,198,239],"scalable":[24],"high-bandwidth":[26],"fabric":[27],"for":[28,118],"interconnect":[29],"design.":[30],"advent":[32],"the":[34,47,50,87,95,102,164,207],"3D":[35,51,66,96,145,192,211,240],"technology":[36,68],"provided":[38],"further":[39],"opportunity":[40],"to":[41,131,155,175,219,226,232,238],"reduce":[42],"on-chip":[43],"communication":[44,168],"delay.":[45],"However,":[46],"design":[48,142,169],"NoC":[52,97],"topologies":[53],"distinctions":[56],"from":[57],"2D":[58],"NoCs":[59],"or":[60],"off-chip":[61],"interconnection":[62],"networks.":[63],"First,":[64],"current":[65],"stacking":[67],"allows":[69],"only":[70,202],"vertical":[71,88,167],"inter-layer":[72],"links.":[73,109],"Hence,":[74,110],"there":[75],"cannot":[76],"be":[77],"direct":[78],"connections":[79],"between":[80],"arbitrary":[81],"nodes":[82],"different":[84,188],"layers":[85,189],"\u2014":[86],"connection":[89],"topology":[90,151,196],"are":[91,113],"essentially":[92],"fixed.":[93],"Second,":[94],"is":[98],"highly":[99],"constrained":[100],"by":[101],"complexity":[103],"routers":[107,112,117,205],"low-radix":[111,148],"preferred":[114],"over":[115],"high-radix":[116],"lower":[119],"better":[122],"heat":[123],"dissipation.":[124],"This":[125],"implies":[126],"long":[127,153,173],"network":[128,136,146,177,186,216,222],"latency":[129,223],"due":[130],"high":[132],"hop":[133],"counts":[134],"paths.":[137,178],"In":[138],"this":[139],"paper,":[140],"we":[141,180],"low-diameter":[144],"routers.":[149,213],"Our":[150],"leverages":[152],"wires":[154,174],"connect":[156],"remote":[157],"intra-layer":[158],"nodes.":[159],"We":[160],"take":[161],"advantage":[162],"start-of-the-art":[165],"one-hop":[166],"utilize":[171],"lateral":[172],"shorten":[176],"Effectively,":[179],"implement":[181],"small-to-medium":[183],"sized":[184],"clique":[185],"chip.":[193],"resulting":[195],"generates":[197],"diameter":[199],"3-hop":[201],"network,":[203],"same":[208],"radix":[209],"mesh":[212,241],"shows":[217],"up":[218,225,231],"29%":[220],"reduction,":[224,235],"10%":[227],"throughput":[228],"improvement,":[229],"24%":[233],"energy":[234],"when":[236],"compared":[237],"network.":[242]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":8},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":6},{"year":2014,"cited_by_count":7},{"year":2013,"cited_by_count":14},{"year":2012,"cited_by_count":11}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}