{"id":"https://openalex.org/W2620776621","doi":"https://doi.org/10.1109/hotchips.2016.7936172","title":"HBM package integration: Technology trends, challenges and applications","display_name":"HBM package integration: Technology trends, challenges and applications","publication_year":2016,"publication_date":"2016-08-01","ids":{"openalex":"https://openalex.org/W2620776621","doi":"https://doi.org/10.1109/hotchips.2016.7936172","mag":"2620776621"},"language":"en","primary_location":{"id":"doi:10.1109/hotchips.2016.7936172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2016.7936172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Hot Chips 28 Symposium (HCS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103745366","display_name":"Suresh Ramalingam","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Suresh Ramalingam","raw_affiliation_strings":["Xilinx, United States of America"],"affiliations":[{"raw_affiliation_string":"Xilinx, United States of America","institution_ids":["https://openalex.org/I32923980"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5103745366"],"corresponding_institution_ids":["https://openalex.org/I32923980"],"apc_list":null,"apc_paid":null,"fwci":0.9188,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.79195367,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6193327903747559},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.5541132688522339},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5228819847106934},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5038642287254333},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49256712198257446},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.48521116375923157},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4147372841835022},{"id":"https://openalex.org/keywords/emerging-technologies","display_name":"Emerging technologies","score":0.41001808643341064},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3111478090286255},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.28995174169540405},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.25050973892211914},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.24984830617904663},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.14090844988822937}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6193327903747559},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.5541132688522339},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5228819847106934},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5038642287254333},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49256712198257446},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.48521116375923157},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4147372841835022},{"id":"https://openalex.org/C207267971","wikidata":"https://www.wikidata.org/wiki/Q120208","display_name":"Emerging technologies","level":2,"score":0.41001808643341064},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3111478090286255},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28995174169540405},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25050973892211914},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.24984830617904663},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.14090844988822937},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/hotchips.2016.7936172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2016.7936172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Hot Chips 28 Symposium (HCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2899084033","https://openalex.org/W2112235696","https://openalex.org/W2171139276","https://openalex.org/W2258021392","https://openalex.org/W3187131569","https://openalex.org/W2288066156","https://openalex.org/W1511998565","https://openalex.org/W2543304869","https://openalex.org/W2041513523"],"abstract_inverted_index":{"Tb/s":[0],"low":[1],"latency":[2],"bandwidth":[3],"and":[4,31,46],"lower":[5,25],"system":[6],"power":[7],"is":[8,18],"driving":[9],"the":[10,19],"need":[11],"for":[12],"HBM":[13,42,52],"adoption.":[14],"Silicon":[15],"Interposer":[16],"(2.5D)":[17],"incumbent":[20],"technology":[21],"of":[22,41],"choice.":[23],"Potentially":[24],"cost,":[26],"fine":[27],"pitch":[28],"interconnect":[29],"wafer-level":[30],"substrate":[32],"based":[33],"technologies":[34],"are":[35],"emerging.":[36],"To":[37],"drive":[38],"broader":[39],"adoption":[40],"applications":[43],"(cooling":[44],"limited)":[45],"higher":[47,51],"performance":[48],"stacks":[49],"(8-Hi),":[50],"junction":[53],"temperature":[54],"(>95C)":[55],"needs":[56],"to":[57],"be":[58],"supported.":[59]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}