{"id":"https://openalex.org/W2484041783","doi":"https://doi.org/10.1109/hotchips.2013.7478328","title":"A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface","display_name":"A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface","publication_year":2013,"publication_date":"2013-08-01","ids":{"openalex":"https://openalex.org/W2484041783","doi":"https://doi.org/10.1109/hotchips.2013.7478328","mag":"2484041783"},"language":"en","primary_location":{"id":"doi:10.1109/hotchips.2013.7478328","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2013.7478328","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE Hot Chips 25 Symposium (HCS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032938283","display_name":"Noriyuki Miura","orcid":"https://orcid.org/0000-0002-0072-6114"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Noriyuki Miura","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006191655","display_name":"Yusuke Koizumi","orcid":"https://orcid.org/0000-0001-9369-8767"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yusuke Koizumi","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066876803","display_name":"Eiichi Sasaki","orcid":"https://orcid.org/0000-0003-3086-3125"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Eiichi Sasaki","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109964341","display_name":"Yasuhiro Take","orcid":null},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yasuhiro Take","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041549339","display_name":"Hiroki Matsutani","orcid":"https://orcid.org/0000-0001-9578-3842"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroki Matsutani","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073154009","display_name":"Tadahiro Kuroda","orcid":"https://orcid.org/0000-0003-0617-1057"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tadahiro Kuroda","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113742339","display_name":"Hideharu Amano","orcid":null},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hideharu Amano","raw_affiliation_strings":["Keio Univ"],"affiliations":[{"raw_affiliation_string":"Keio Univ","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001091323","display_name":"R. Sakamoto","orcid":"https://orcid.org/0000-0002-4453-953X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ryuichi Sakamoto","raw_affiliation_strings":["Tokyo Univ. of Agri. And Tech"],"affiliations":[{"raw_affiliation_string":"Tokyo Univ. of Agri. And Tech","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113856358","display_name":"Mitaro Namiki","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mitaro Namiki","raw_affiliation_strings":["Tokyo Univ. of Agri. And Tech"],"affiliations":[{"raw_affiliation_string":"Tokyo Univ. of Agri. And Tech","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030692253","display_name":"Kimiyoshi Usami","orcid":"https://orcid.org/0000-0002-8911-3313"},"institutions":[{"id":"https://openalex.org/I171481255","display_name":"Shibaura Institute of Technology","ror":"https://ror.org/020wjcq07","country_code":"JP","type":"education","lineage":["https://openalex.org/I171481255"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kimiyoshi Usami","raw_affiliation_strings":["Shibaura Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Shibaura Institute of Technology","institution_ids":["https://openalex.org/I171481255"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103017591","display_name":"Masaaki Kondo","orcid":"https://orcid.org/0000-0002-6025-8738"},"institutions":[{"id":"https://openalex.org/I20529979","display_name":"University of Electro-Communications","ror":"https://ror.org/02x73b849","country_code":"JP","type":"education","lineage":["https://openalex.org/I20529979"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaaki Kondo","raw_affiliation_strings":["University of Electro-Communications"],"affiliations":[{"raw_affiliation_string":"University of Electro-Communications","institution_ids":["https://openalex.org/I20529979"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090578339","display_name":"Hiroshi Nakamura","orcid":"https://orcid.org/0009-0005-6505-1903"},"institutions":[{"id":"https://openalex.org/I74801974","display_name":"The University of Tokyo","ror":"https://ror.org/057zh3y96","country_code":"JP","type":"education","lineage":["https://openalex.org/I74801974"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Nakamura","raw_affiliation_strings":["University of Tokyo"],"affiliations":[{"raw_affiliation_string":"University of Tokyo","institution_ids":["https://openalex.org/I74801974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5032938283"],"corresponding_institution_ids":["https://openalex.org/I203951103"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.28899562,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.7825101017951965},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.707761287689209},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5958210229873657},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.556210994720459},{"id":"https://openalex.org/keywords/multi-core-processor","display_name":"Multi-core processor","score":0.5379508137702942},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.522491991519928},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5128262639045715},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.49042150378227234},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.4419425427913666},{"id":"https://openalex.org/keywords/battery","display_name":"Battery (electricity)","score":0.43160057067871094},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4257080554962158},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.4229614734649658},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.17121177911758423},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15317991375923157},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.13879519701004028},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1285095512866974},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.09507137537002563}],"concepts":[{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.7825101017951965},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.707761287689209},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5958210229873657},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.556210994720459},{"id":"https://openalex.org/C78766204","wikidata":"https://www.wikidata.org/wiki/Q555032","display_name":"Multi-core processor","level":2,"score":0.5379508137702942},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.522491991519928},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5128262639045715},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.49042150378227234},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.4419425427913666},{"id":"https://openalex.org/C555008776","wikidata":"https://www.wikidata.org/wiki/Q267298","display_name":"Battery (electricity)","level":3,"score":0.43160057067871094},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4257080554962158},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.4229614734649658},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.17121177911758423},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15317991375923157},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.13879519701004028},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1285095512866974},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.09507137537002563},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/hotchips.2013.7478328","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2013.7478328","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE Hot Chips 25 Symposium (HCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2005385707","https://openalex.org/W2009997678","https://openalex.org/W2043240286"],"related_works":["https://openalex.org/W2155019192","https://openalex.org/W2014709025","https://openalex.org/W4249035840","https://openalex.org/W2766970861","https://openalex.org/W1964071618","https://openalex.org/W3125341812","https://openalex.org/W1668171714","https://openalex.org/W2018755015","https://openalex.org/W2115579119","https://openalex.org/W2017236304"],"abstract_inverted_index":{"Recent":[0],"battery":[1],"driven":[2],"IT":[3],"devices":[4],"including":[5],"smart":[6],"phone":[7],"and":[8,13,31,37,97,111],"tablets":[9],"require":[10],"versatile":[11],"functions":[12],"high":[14],"performance":[15,59,69],"with":[16,66,104],"low":[17],"energy":[18],"consumption.":[19],"On":[20],"the":[21,24,58,67,109,121,124],"other":[22],"hand,":[23],"initial":[25],"cost":[26],"of":[27,39,71,91,113,123],"LSI":[28],"for":[29,44],"design":[30],"mask":[32],"development":[33,38],"has":[34,47],"increased":[35],"rapidly,":[36],"an":[40],"SoC":[41],"(System-on-a":[42],"Chip)":[43],"each":[45],"product":[46],"become":[48],"difficult.":[49],"Although":[50],"flexible":[51],"reconfigurable":[52,98],"architectures":[53],"can":[54,115],"be":[55,116],"a":[56,74,80,92],"solution,":[57,75],"scalability":[60],"is":[61,86],"also":[62],"necessary":[63],"to":[64],"cope":[65],"wide":[68],"range":[70],"products.":[72],"As":[73],"heterogeneous":[76],"multi-core":[77],"system":[78,89],"using":[79],"3-D":[81],"wireless":[82,105],"inductive":[83,106],"coupling":[84,107],"interconnect":[85],"proposed.":[87],"This":[88],"consists":[90],"MIPS-R3000":[93],"compatible":[94],"embedded":[95],"CPU":[96],"accelerators.":[99],"Since":[100],"chips":[101],"are":[102],"connected":[103],"channels,":[108],"number":[110],"types":[112],"accelerators":[114],"tailored":[117],"easily":[118],"depending":[119],"on":[120],"requirement":[122],"product.":[125]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}