{"id":"https://openalex.org/W2460969197","doi":"https://doi.org/10.1109/hotchips.2012.7476474","title":"Xilinx SSI technology concept to silicon development overview","display_name":"Xilinx SSI technology concept to silicon development overview","publication_year":2012,"publication_date":"2012-08-01","ids":{"openalex":"https://openalex.org/W2460969197","doi":"https://doi.org/10.1109/hotchips.2012.7476474","mag":"2460969197"},"language":"en","primary_location":{"id":"doi:10.1109/hotchips.2012.7476474","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2012.7476474","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE Hot Chips 24 Symposium (HCS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5054478504","display_name":"Shankar Lakka","orcid":null},"institutions":[{"id":"https://openalex.org/I165779595","display_name":"University of Melbourne","ror":"https://ror.org/01ej9dk98","country_code":"AU","type":"education","lineage":["https://openalex.org/I165779595"]}],"countries":["AU"],"is_corresponding":true,"raw_author_name":"Shankar Lakka","raw_affiliation_strings":["Department of Infrastructure Engineering, The University of Melbourne, Melbourne, Australia"],"affiliations":[{"raw_affiliation_string":"Department of Infrastructure Engineering, The University of Melbourne, Melbourne, Australia","institution_ids":["https://openalex.org/I165779595"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5054478504"],"corresponding_institution_ids":["https://openalex.org/I165779595"],"apc_list":null,"apc_paid":null,"fwci":0.491,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.71533633,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"22"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.817799985408783,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.817799985408783,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.7358999848365784,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.6772000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.680038332939148},{"id":"https://openalex.org/keywords/presentation","display_name":"Presentation (obstetrics)","score":0.6330296993255615},{"id":"https://openalex.org/keywords/technology-development","display_name":"Technology development","score":0.5886157155036926},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5495761632919312},{"id":"https://openalex.org/keywords/new-product-development","display_name":"New product development","score":0.5429731011390686},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5428332090377808},{"id":"https://openalex.org/keywords/engineering-management","display_name":"Engineering management","score":0.47720393538475037},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.46893003582954407},{"id":"https://openalex.org/keywords/silicon-valley","display_name":"Silicon valley","score":0.41438359022140503},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4009261727333069},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.39058026671409607},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3900984525680542},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3828510046005249},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32634881138801575},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.28436848521232605},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.2167333960533142},{"id":"https://openalex.org/keywords/marketing","display_name":"Marketing","score":0.09561565518379211}],"concepts":[{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.680038332939148},{"id":"https://openalex.org/C2777601897","wikidata":"https://www.wikidata.org/wiki/Q3409113","display_name":"Presentation (obstetrics)","level":2,"score":0.6330296993255615},{"id":"https://openalex.org/C2988118331","wikidata":"https://www.wikidata.org/wiki/Q276099","display_name":"Technology development","level":2,"score":0.5886157155036926},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5495761632919312},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.5429731011390686},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5428332090377808},{"id":"https://openalex.org/C110354214","wikidata":"https://www.wikidata.org/wiki/Q6314146","display_name":"Engineering management","level":1,"score":0.47720393538475037},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.46893003582954407},{"id":"https://openalex.org/C2984737752","wikidata":"https://www.wikidata.org/wiki/Q163820","display_name":"Silicon valley","level":3,"score":0.41438359022140503},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4009261727333069},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.39058026671409607},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3900984525680542},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3828510046005249},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32634881138801575},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.28436848521232605},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.2167333960533142},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.09561565518379211},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C126838900","wikidata":"https://www.wikidata.org/wiki/Q77604","display_name":"Radiology","level":1,"score":0.0},{"id":"https://openalex.org/C84309077","wikidata":"https://www.wikidata.org/wiki/Q3908516","display_name":"Entrepreneurship","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/hotchips.2012.7476474","is_oa":false,"landing_page_url":"https://doi.org/10.1109/hotchips.2012.7476474","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE Hot Chips 24 Symposium (HCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3004350229","https://openalex.org/W4232646074","https://openalex.org/W2380702446","https://openalex.org/W2953075001","https://openalex.org/W2278755321","https://openalex.org/W2766358120","https://openalex.org/W2252666767","https://openalex.org/W2165469466","https://openalex.org/W2063411654","https://openalex.org/W2002378437"],"abstract_inverted_index":{"This":[0],"article":[1],"consists":[2],"of":[3,6,47],"a":[4],"collection":[5],"slides":[7],"from":[8],"the":[9,14,28,34,43],"author's":[10],"conference":[11],"presentation.":[12],"Presents":[13],"product":[15],"design":[16],"and":[17,31,45,60],"applications":[18],"supported":[19],"by":[20],"Xilinx":[21],"stacked":[22],"silicon":[23],"interconnect":[24],"(SSI)":[25],"technology.":[26],"Identifies":[27],"economics":[29],"drivers":[30],"technical":[32],"challenges":[33],"company":[35],"faces":[36],"to":[37],"develop":[38],"its":[39],"SSI":[40,58],"products/services.":[41],"Discusses":[42],"progression":[44],"development":[46],"three-dimensional":[48],"(3D)":[49],"technolgies.":[50],"Also":[51],"examines":[52],"capacity":[53],"planning;":[54],"FPGA":[55],"technologies":[56],"for":[57],"development;":[59],"future":[61],"market":[62],"opportunties.":[63]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}