{"id":"https://openalex.org/W2800210219","doi":"https://doi.org/10.1109/haptics.2018.8357160","title":"Development of a miniaturized thermal module designed for integration in a wearable haptic device","display_name":"Development of a miniaturized thermal module designed for integration in a wearable haptic device","publication_year":2018,"publication_date":"2018-03-01","ids":{"openalex":"https://openalex.org/W2800210219","doi":"https://doi.org/10.1109/haptics.2018.8357160","mag":"2800210219"},"language":"en","primary_location":{"id":"doi:10.1109/haptics.2018.8357160","is_oa":false,"landing_page_url":"https://doi.org/10.1109/haptics.2018.8357160","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE Haptics Symposium (HAPTICS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007546159","display_name":"Massimiliano Gabardi","orcid":"https://orcid.org/0000-0002-8980-8588"},"institutions":[{"id":"https://openalex.org/I162290304","display_name":"Scuola Superiore Sant'Anna","ror":"https://ror.org/025602r80","country_code":"IT","type":"education","lineage":["https://openalex.org/I162290304"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"Massimiliano Gabardi","raw_affiliation_strings":["Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory"],"affiliations":[{"raw_affiliation_string":"Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory","institution_ids":["https://openalex.org/I162290304"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041878402","display_name":"Daniele Leonardis","orcid":"https://orcid.org/0000-0002-9868-5524"},"institutions":[{"id":"https://openalex.org/I162290304","display_name":"Scuola Superiore Sant'Anna","ror":"https://ror.org/025602r80","country_code":"IT","type":"education","lineage":["https://openalex.org/I162290304"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Daniele Leonardis","raw_affiliation_strings":["Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory"],"affiliations":[{"raw_affiliation_string":"Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory","institution_ids":["https://openalex.org/I162290304"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089138290","display_name":"Massimiliano Solazzi","orcid":"https://orcid.org/0000-0002-9053-2814"},"institutions":[{"id":"https://openalex.org/I162290304","display_name":"Scuola Superiore Sant'Anna","ror":"https://ror.org/025602r80","country_code":"IT","type":"education","lineage":["https://openalex.org/I162290304"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Massimiliano Solazzi","raw_affiliation_strings":["Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory"],"affiliations":[{"raw_affiliation_string":"Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory","institution_ids":["https://openalex.org/I162290304"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090204404","display_name":"Antonio Frisoli","orcid":"https://orcid.org/0000-0002-7126-4113"},"institutions":[{"id":"https://openalex.org/I162290304","display_name":"Scuola Superiore Sant'Anna","ror":"https://ror.org/025602r80","country_code":"IT","type":"education","lineage":["https://openalex.org/I162290304"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Antonio Frisoli","raw_affiliation_strings":["Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory"],"affiliations":[{"raw_affiliation_string":"Scuola Superiore Sant'Anna, TeCip Institute, PERCRO Laboratory","institution_ids":["https://openalex.org/I162290304"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5007546159"],"corresponding_institution_ids":["https://openalex.org/I162290304"],"apc_list":null,"apc_paid":null,"fwci":1.2749,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":{"value":0.78138413,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"100","last_page":"105"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11687","display_name":"Teleoperation and Haptic Systems","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10648","display_name":"Virtual Reality Applications and Impacts","score":0.9786999821662903,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/haptic-technology","display_name":"Haptic technology","score":0.6578488945960999},{"id":"https://openalex.org/keywords/rendering","display_name":"Rendering (computer graphics)","score":0.6241545677185059},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5629512071609497},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5612080097198486},{"id":"https://openalex.org/keywords/wearable-computer","display_name":"Wearable computer","score":0.5530923008918762},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.4164220690727234},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3424544930458069},{"id":"https://openalex.org/keywords/computer-graphics","display_name":"Computer graphics (images)","score":0.2432507574558258},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2376897931098938},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22622141242027283}],"concepts":[{"id":"https://openalex.org/C152086174","wikidata":"https://www.wikidata.org/wiki/Q3030571","display_name":"Haptic technology","level":2,"score":0.6578488945960999},{"id":"https://openalex.org/C205711294","wikidata":"https://www.wikidata.org/wiki/Q176953","display_name":"Rendering (computer graphics)","level":2,"score":0.6241545677185059},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5629512071609497},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5612080097198486},{"id":"https://openalex.org/C150594956","wikidata":"https://www.wikidata.org/wiki/Q1334829","display_name":"Wearable computer","level":2,"score":0.5530923008918762},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.4164220690727234},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3424544930458069},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.2432507574558258},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2376897931098938},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22622141242027283},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/haptics.2018.8357160","is_oa":false,"landing_page_url":"https://doi.org/10.1109/haptics.2018.8357160","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE Haptics Symposium (HAPTICS)","raw_type":"proceedings-article"},{"id":"pmh:oai:www.iris.sssup.it:11382/524096","is_oa":false,"landing_page_url":"http://hdl.handle.net/11382/524096","pdf_url":null,"source":{"id":"https://openalex.org/S4377196376","display_name":"CINECA IRIS Institutional Research Information System (Sant'Anna School of Advanced Studies)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I162290304","host_organization_name":"Scuola Superiore Sant'Anna","host_organization_lineage":["https://openalex.org/I162290304"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.44999998807907104}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320300","display_name":"European Commission","ror":"https://ror.org/00k4n6c32"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W21071334","https://openalex.org/W97531205","https://openalex.org/W1580667067","https://openalex.org/W1947793890","https://openalex.org/W1982682094","https://openalex.org/W2008573509","https://openalex.org/W2067168859","https://openalex.org/W2072434538","https://openalex.org/W2089176776","https://openalex.org/W2102163580","https://openalex.org/W2116285432","https://openalex.org/W2160541069","https://openalex.org/W2164302525","https://openalex.org/W2175564905","https://openalex.org/W2345768504","https://openalex.org/W2561042675","https://openalex.org/W2612110125","https://openalex.org/W2732243998","https://openalex.org/W6740365175"],"related_works":["https://openalex.org/W156716224","https://openalex.org/W2111871955","https://openalex.org/W3175380930","https://openalex.org/W4233260495","https://openalex.org/W1989694608","https://openalex.org/W2139876914","https://openalex.org/W4385473849","https://openalex.org/W2800134125","https://openalex.org/W2731583012","https://openalex.org/W2116848172"],"abstract_inverted_index":{"This":[0],"work":[1],"presents":[2],"the":[3,20,25,52,81,89,93,108,113,117,122,126,131],"development":[4],"of":[5,19,37,68,92,112,125],"a":[6,34,60,97],"novel":[7,61],"thermal":[8,43,64,94,110],"display":[9],"for":[10,49,63],"transient":[11],"heat":[12],"rendering":[13,67],"in":[14,30,42,56,84,104,128],"virtual":[15,69],"environments.":[16],"The":[17,45],"design":[18,82,91],"fingertip":[21],"device":[22,46],"focused":[23],"on":[24],"low":[26],"weight":[27],"and":[28,39,65,121],"compactness":[29],"order":[31,57,85,105],"to":[32,58,86,106],"achieve":[33],"high":[35,40],"level":[36],"wearability":[38],"performance":[41],"rendering.":[44],"is":[47],"intended":[48],"integration":[50],"with":[51,130],"Haptic":[53],"Thimble":[54],"device,":[55],"develop":[59],"interface":[62],"haptic":[66],"surfaces.":[70],"An":[71],"iterative":[72],"Finite":[73],"Elements":[74],"(FE)":[75],"procedure":[76],"has":[77,101],"been":[78,102],"performed":[79,103],"within":[80],"process":[83],"numerically":[87],"validate":[88],"final":[90],"module.":[95],"Finally,":[96],"thorough":[98],"experimental":[99],"characterization":[100],"evaluate":[107],"dynamic":[109],"capabilities":[111],"prototype,":[114],"considering":[115],"also":[116],"finger":[118],"contact":[119,129],"response":[120],"temperature":[123],"uniformity":[124],"plate":[127],"finger.":[132]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":5},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":1}],"updated_date":"2026-04-02T15:55:50.835912","created_date":"2025-10-10T00:00:00"}