{"id":"https://openalex.org/W2071620134","doi":"https://doi.org/10.1109/ewdts.2013.6673151","title":"Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS","display_name":"Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W2071620134","doi":"https://doi.org/10.1109/ewdts.2013.6673151","mag":"2071620134"},"language":"en","primary_location":{"id":"doi:10.1109/ewdts.2013.6673151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ewdts.2013.6673151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"East-West Design & Test Symposium (EWDTS 2013)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5040833992","display_name":"Konstantin O. Petrosyants","orcid":"https://orcid.org/0000-0001-7969-4786"},"institutions":[{"id":"https://openalex.org/I115911606","display_name":"Moscow State Institute of Electronics and Mathematics","ror":"https://ror.org/05dhkbw86","country_code":"RU","type":"education","lineage":["https://openalex.org/I115911606"]},{"id":"https://openalex.org/I4210096404","display_name":"Institute for Design Problems in Microelectronics","ror":"https://ror.org/00t7t9a43","country_code":"RU","type":"facility","lineage":["https://openalex.org/I1313323035","https://openalex.org/I4210096404","https://openalex.org/I4210097085"]}],"countries":["RU"],"is_corresponding":true,"raw_author_name":"K.O. Petrosyants","raw_affiliation_strings":["Institute for Design Problems in Microelectronics of Russian Academy of Sciences (IPPM RAS), Moscow, Russia","Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"Institute for Design Problems in Microelectronics of Russian Academy of Sciences (IPPM RAS), Moscow, Russia","institution_ids":["https://openalex.org/I4210096404"]},{"raw_affiliation_string":"Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia","institution_ids":["https://openalex.org/I115911606"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112252607","display_name":"N I Rjabov","orcid":null},"institutions":[{"id":"https://openalex.org/I4210096404","display_name":"Institute for Design Problems in Microelectronics","ror":"https://ror.org/00t7t9a43","country_code":"RU","type":"facility","lineage":["https://openalex.org/I1313323035","https://openalex.org/I4210096404","https://openalex.org/I4210097085"]},{"id":"https://openalex.org/I115911606","display_name":"Moscow State Institute of Electronics and Mathematics","ror":"https://ror.org/05dhkbw86","country_code":"RU","type":"education","lineage":["https://openalex.org/I115911606"]}],"countries":["RU"],"is_corresponding":false,"raw_author_name":"N.I. Rjabov","raw_affiliation_strings":["Institute for Design Problems in Microelectronics of Russian Academy of Sciences (IPPM RAS), Moscow, Russia","Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia"],"affiliations":[{"raw_affiliation_string":"Institute for Design Problems in Microelectronics of Russian Academy of Sciences (IPPM RAS), Moscow, Russia","institution_ids":["https://openalex.org/I4210096404"]},{"raw_affiliation_string":"Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia","institution_ids":["https://openalex.org/I115911606"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5040833992"],"corresponding_institution_ids":["https://openalex.org/I115911606","https://openalex.org/I4210096404"],"apc_list":null,"apc_paid":null,"fwci":0.2364,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.61578707,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6142778396606445},{"id":"https://openalex.org/keywords/vhdl","display_name":"VHDL","score":0.5777952671051025},{"id":"https://openalex.org/keywords/hardware-description-language","display_name":"Hardware description language","score":0.5704640746116638},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5701319575309753},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5271437168121338},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5213443040847778},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5205098986625671},{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.49610933661460876},{"id":"https://openalex.org/keywords/electronic-circuit-simulation","display_name":"Electronic circuit simulation","score":0.49280694127082825},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.46422669291496277},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.3404672145843506},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27743035554885864},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27168625593185425},{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.2251860797405243},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.165988951921463},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12147000432014465},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07913777232170105}],"concepts":[{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6142778396606445},{"id":"https://openalex.org/C36941000","wikidata":"https://www.wikidata.org/wiki/Q209455","display_name":"VHDL","level":3,"score":0.5777952671051025},{"id":"https://openalex.org/C42143788","wikidata":"https://www.wikidata.org/wiki/Q173341","display_name":"Hardware description language","level":3,"score":0.5704640746116638},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5701319575309753},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5271437168121338},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5213443040847778},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5205098986625671},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.49610933661460876},{"id":"https://openalex.org/C46205389","wikidata":"https://www.wikidata.org/wiki/Q1270401","display_name":"Electronic circuit simulation","level":3,"score":0.49280694127082825},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.46422669291496277},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.3404672145843506},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27743035554885864},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27168625593185425},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.2251860797405243},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.165988951921463},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12147000432014465},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07913777232170105},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ewdts.2013.6673151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ewdts.2013.6673151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"East-West Design & Test Symposium (EWDTS 2013)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.800000011920929}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1605866970","https://openalex.org/W1967136720","https://openalex.org/W2125673187","https://openalex.org/W2134874375","https://openalex.org/W2146091063"],"related_works":["https://openalex.org/W2110818533","https://openalex.org/W1917852300","https://openalex.org/W2384838054","https://openalex.org/W2139058049","https://openalex.org/W2548456620","https://openalex.org/W2376018793","https://openalex.org/W2911649771","https://openalex.org/W2169179842","https://openalex.org/W2148697719","https://openalex.org/W2070083638"],"abstract_inverted_index":{"CAD":[0],"sybsystem":[1],"for":[2],"logi-thermal":[3],"analysis":[4],"of":[5,29,44,54,59],"the":[6,27,30,35],"digital":[7],"circuits":[8,12],"is":[9,49,67],"presented.":[10],"Logical":[11],"are":[13,20],"described":[14],"by":[15,22],"VHDL":[16],"language.":[17],"Thermal":[18],"regimes":[19],"calculated":[21],"electro-thermal":[23],"analogy":[24],"method.":[25],"For":[26,51],"calculation":[28,53],"thermal":[31,36,57],"resistances":[32],"and":[33,56,62],"capacitances":[34],"3D":[37],"simulator":[38,64],"Overheat-IC":[39],"based":[40],"on":[41],"semi-analytical":[42],"solution":[43],"three-dimensional":[45],"heat":[46],"conduction":[47],"equation":[48],"used.":[50,68],"simultaneous":[52],"logical":[55],"characteristics":[58],"IC":[60],"analog":[61],"mixed-signal":[63],"Questa":[65],"ADMS":[66]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}