{"id":"https://openalex.org/W2103638676","doi":"https://doi.org/10.1109/etsym.2010.5512735","title":"Configurable fault-tolerant link for inter-die communication in 3D on-chip networks","display_name":"Configurable fault-tolerant link for inter-die communication in 3D on-chip networks","publication_year":2010,"publication_date":"2010-05-01","ids":{"openalex":"https://openalex.org/W2103638676","doi":"https://doi.org/10.1109/etsym.2010.5512735","mag":"2103638676"},"language":"en","primary_location":{"id":"doi:10.1109/etsym.2010.5512735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/etsym.2010.5512735","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 15th IEEE European Test Symposium","raw_type":"proceedings-article"},"type":"preprint","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064147688","display_name":"Vladimir Pa\u015fca","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087012","display_name":"Techniques of Informatics and Microelectronics for Integrated Systems Architecture","ror":"https://ror.org/000063q30","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210087012","https://openalex.org/I4210159245","https://openalex.org/I899635006","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Vladimir Pasca","raw_affiliation_strings":["TIMA Laboratory, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"TIMA Laboratory, Grenoble, France","institution_ids":["https://openalex.org/I4210087012"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053835664","display_name":"Lorena Anghel","orcid":"https://orcid.org/0000-0001-9569-0072"},"institutions":[{"id":"https://openalex.org/I4210087012","display_name":"Techniques of Informatics and Microelectronics for Integrated Systems Architecture","ror":"https://ror.org/000063q30","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210087012","https://openalex.org/I4210159245","https://openalex.org/I899635006","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Lorena Anghel","raw_affiliation_strings":["TIMA Laboratory, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"TIMA Laboratory, Grenoble, France","institution_ids":["https://openalex.org/I4210087012"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076109381","display_name":"Claudia Rusu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087012","display_name":"Techniques of Informatics and Microelectronics for Integrated Systems Architecture","ror":"https://ror.org/000063q30","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210087012","https://openalex.org/I4210159245","https://openalex.org/I899635006","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Claudia Rusu","raw_affiliation_strings":["TIMA Laboratory, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"TIMA Laboratory, Grenoble, France","institution_ids":["https://openalex.org/I4210087012"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108093269","display_name":"Mounir Benabdenbi","orcid":"https://orcid.org/0000-0001-9586-3009"},"institutions":[{"id":"https://openalex.org/I4210087012","display_name":"Techniques of Informatics and Microelectronics for Integrated Systems Architecture","ror":"https://ror.org/000063q30","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210087012","https://openalex.org/I4210159245","https://openalex.org/I899635006","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Mounir Benabdenbi","raw_affiliation_strings":["TIMA Laboratory, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"TIMA Laboratory, Grenoble, France","institution_ids":["https://openalex.org/I4210087012"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5064147688"],"corresponding_institution_ids":["https://openalex.org/I4210087012"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15254302,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"258","last_page":"258"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9731000065803528,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/link","display_name":"Link (geometry)","score":0.733959972858429},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6620513200759888},{"id":"https://openalex.org/keywords/fault-tolerance","display_name":"Fault tolerance","score":0.6401728987693787},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6172472238540649},{"id":"https://openalex.org/keywords/communication-link","display_name":"Communication link","score":0.554961621761322},{"id":"https://openalex.org/keywords/transmission","display_name":"Transmission (telecommunications)","score":0.4932047724723816},{"id":"https://openalex.org/keywords/degradation","display_name":"Degradation (telecommunications)","score":0.4746982455253601},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4541045129299164},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.43839046359062195},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4233788847923279},{"id":"https://openalex.org/keywords/serial-communication","display_name":"Serial communication","score":0.4206107556819916},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.3073907196521759},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.24492821097373962},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.15910816192626953},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10169139504432678},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0772351622581482}],"concepts":[{"id":"https://openalex.org/C2778753846","wikidata":"https://www.wikidata.org/wiki/Q6554239","display_name":"Link (geometry)","level":2,"score":0.733959972858429},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6620513200759888},{"id":"https://openalex.org/C63540848","wikidata":"https://www.wikidata.org/wiki/Q3140932","display_name":"Fault tolerance","level":2,"score":0.6401728987693787},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6172472238540649},{"id":"https://openalex.org/C2986660100","wikidata":"https://www.wikidata.org/wiki/Q1172466","display_name":"Communication link","level":2,"score":0.554961621761322},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.4932047724723816},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.4746982455253601},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4541045129299164},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.43839046359062195},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4233788847923279},{"id":"https://openalex.org/C51707140","wikidata":"https://www.wikidata.org/wiki/Q518280","display_name":"Serial communication","level":2,"score":0.4206107556819916},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.3073907196521759},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.24492821097373962},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.15910816192626953},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10169139504432678},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0772351622581482},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/etsym.2010.5512735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/etsym.2010.5512735","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 15th IEEE European Test Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6600000262260437,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2481508967"],"related_works":["https://openalex.org/W1998809012","https://openalex.org/W1965617705","https://openalex.org/W206422227","https://openalex.org/W2277436753","https://openalex.org/W2148428795","https://openalex.org/W2372011819","https://openalex.org/W2357481891","https://openalex.org/W2808994160","https://openalex.org/W2391090056","https://openalex.org/W2358440364"],"abstract_inverted_index":{"In":[0],"this":[1],"paper":[2],"configurable":[3],"fault":[4,19],"tolerant":[5],"links":[6,21],"are":[7],"proposed":[8],"for":[9],"inter-die":[10],"communication":[11],"in":[12],"stacked":[13],"3D":[14],"SoCs.":[15],"For":[16],"high":[17],"TSV":[18],"rates,":[20],"degrade":[22],"their":[23],"performance":[24],"by":[25],"serial":[26],"data":[27],"transmission":[28],"and":[29],"signal":[30],"remapping":[31],"on":[32],"the":[33,48],"defect":[34],"free":[35],"wires.":[36],"The":[37],"link":[38,49],"degradation":[39],"is":[40,50],"limited":[41],"to":[42],"a":[43],"predetermined":[44],"value,":[45],"above":[46],"which":[47],"considered":[51],"non-functional.":[52]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}