{"id":"https://openalex.org/W4400034048","doi":"https://doi.org/10.1109/ets61313.2024.10567964","title":"Fault Sensitivity Analysis of Printed Bespoke Multilayer Perceptron Classifiers","display_name":"Fault Sensitivity Analysis of Printed Bespoke Multilayer Perceptron Classifiers","publication_year":2024,"publication_date":"2024-05-20","ids":{"openalex":"https://openalex.org/W4400034048","doi":"https://doi.org/10.1109/ets61313.2024.10567964"},"language":"en","primary_location":{"id":"doi:10.1109/ets61313.2024.10567964","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets61313.2024.10567964","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103175471","display_name":"Priyanjana Pal","orcid":"https://orcid.org/0009-0000-2977-8471"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Priyanjana Pal","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5093384120","display_name":"Florentia Afentaki","orcid":null},"institutions":[{"id":"https://openalex.org/I174878644","display_name":"University of Patras","ror":"https://ror.org/017wvtq80","country_code":"GR","type":"education","lineage":["https://openalex.org/I174878644"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Florentia Afentaki","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE","University of Patras, GR"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]},{"raw_affiliation_string":"University of Patras, GR","institution_ids":["https://openalex.org/I174878644"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084787896","display_name":"Haibin Zhao","orcid":"https://orcid.org/0000-0001-7018-1159"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Haibin Zhao","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009072180","display_name":"Gurol Saglam","orcid":"https://orcid.org/0000-0002-7762-7384"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Gurol Saglam","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038362728","display_name":"Michael Hefenbrock","orcid":"https://orcid.org/0000-0002-7583-2376"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michael Hefenbrock","raw_affiliation_strings":["RevoAI GmbH"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RevoAI GmbH","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051495057","display_name":"Georgios Zervakis","orcid":"https://orcid.org/0000-0001-8110-7122"},"institutions":[{"id":"https://openalex.org/I174878644","display_name":"University of Patras","ror":"https://ror.org/017wvtq80","country_code":"GR","type":"education","lineage":["https://openalex.org/I174878644"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Georgios Zervakis","raw_affiliation_strings":["University of Patras,GR","University of Patras, GR"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Patras,GR","institution_ids":["https://openalex.org/I174878644"]},{"raw_affiliation_string":"University of Patras, GR","institution_ids":["https://openalex.org/I174878644"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082553444","display_name":"Michael Beigl","orcid":"https://orcid.org/0000-0001-5009-2327"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michael Beigl","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064445713","display_name":"Mehdi B. Tahoori","orcid":"https://orcid.org/0000-0002-8829-5610"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mehdi B. Tahoori","raw_affiliation_strings":["Karlsruhe Institute of Technology,DE","Karlsruhe Institute of Technology, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Karlsruhe Institute of Technology,DE","institution_ids":[]},{"raw_affiliation_string":"Karlsruhe Institute of Technology, DE","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7425,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.70240581,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11689","display_name":"Adversarial Robustness in Machine Learning","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bespoke","display_name":"Bespoke","score":0.9144850373268127},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.6423976421356201},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6421099305152893},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.5411026477813721},{"id":"https://openalex.org/keywords/multilayer-perceptron","display_name":"Multilayer perceptron","score":0.4933384954929352},{"id":"https://openalex.org/keywords/perceptron","display_name":"Perceptron","score":0.4789053201675415},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.4785371720790863},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.45540034770965576},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.4389871656894684},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4349234402179718},{"id":"https://openalex.org/keywords/digital-electronics","display_name":"Digital electronics","score":0.4348505437374115},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.40936076641082764},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.39586150646209717},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.360162615776062},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.30687546730041504},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.25910478830337524},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23892301321029663},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12935104966163635}],"concepts":[{"id":"https://openalex.org/C44210515","wikidata":"https://www.wikidata.org/wiki/Q16968978","display_name":"Bespoke","level":2,"score":0.9144850373268127},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.6423976421356201},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6421099305152893},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.5411026477813721},{"id":"https://openalex.org/C179717631","wikidata":"https://www.wikidata.org/wiki/Q2991667","display_name":"Multilayer perceptron","level":3,"score":0.4933384954929352},{"id":"https://openalex.org/C60908668","wikidata":"https://www.wikidata.org/wiki/Q690207","display_name":"Perceptron","level":3,"score":0.4789053201675415},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4785371720790863},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.45540034770965576},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.4389871656894684},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4349234402179718},{"id":"https://openalex.org/C81843906","wikidata":"https://www.wikidata.org/wiki/Q173156","display_name":"Digital electronics","level":3,"score":0.4348505437374115},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.40936076641082764},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.39586150646209717},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.360162615776062},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.30687546730041504},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.25910478830337524},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23892301321029663},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12935104966163635},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ets61313.2024.10567964","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets61313.2024.10567964","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6600000262260437,"id":"https://metadata.un.org/sdg/13","display_name":"Climate action"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320334678","display_name":"European Research Council","ror":"https://ror.org/0472cxd90"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W2049431206","https://openalex.org/W2106816366","https://openalex.org/W2592328268","https://openalex.org/W2751883066","https://openalex.org/W2998768810","https://openalex.org/W3045747056","https://openalex.org/W3101262113","https://openalex.org/W3134075829","https://openalex.org/W3166461114","https://openalex.org/W3185080747","https://openalex.org/W4280586535","https://openalex.org/W4319865974","https://openalex.org/W4323022592","https://openalex.org/W4327808507","https://openalex.org/W4378190624","https://openalex.org/W4379115677","https://openalex.org/W4379116042","https://openalex.org/W4389166714","https://openalex.org/W4389166742","https://openalex.org/W4401568775"],"related_works":["https://openalex.org/W2076543106","https://openalex.org/W2523437662","https://openalex.org/W89844371","https://openalex.org/W2019891950","https://openalex.org/W2085842814","https://openalex.org/W4286643620","https://openalex.org/W4387048144","https://openalex.org/W2492135063","https://openalex.org/W2362514456","https://openalex.org/W2136232598"],"abstract_inverted_index":{"Printed":[0],"Electronics":[1],"(PE)":[2],"is":[3],"an":[4,14],"emerging":[5],"technology":[6],"with":[7],"flexible":[8],"substrates":[9],"and":[10,65,82],"ultra-low-cost":[11],"manufacturing,":[12],"providing":[13],"appealing":[15],"alternative":[16],"to":[17,84],"traditional":[18],"wafer-scale":[19],"silicon":[20],"fabrication.":[21],"With":[22],"the":[23,36,53],"increasing":[24],"integration":[25],"of":[26,38,52,59,68],"various":[27,63],"printed":[28,39,69],"neural":[29],"network":[30],"(NN)":[31],"architectures":[32],"in":[33],"diverse":[34],"applications,":[35],"reliability":[37],"circuits":[40],"has":[41],"become":[42],"a":[43,49,57,86],"critical":[44],"concern.":[45],"This":[46],"work":[47],"provides":[48],"comprehensive":[50,87],"analysis":[51,89],"fault":[54,88],"sensitivity":[55],"on":[56,90],"variety":[58],"classification":[60],"tasks":[61],"for":[62],"digital":[64,77],"analog":[66],"realizations":[67],"multilayer":[70],"perceptrons":[71],"(MLPs).":[72],"We":[73],"further":[74],"evaluate":[75],"different":[76,91],"architectures,":[78],"i.e.,":[79],"generic,":[80],"bespoke,":[81],"approximate,":[83],"provide":[85],"benchmark":[92],"datasets.":[93]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}