{"id":"https://openalex.org/W3038497612","doi":"https://doi.org/10.1109/ets48528.2020.9131586","title":"Efficient Prognostication of Pattern Count with Different Input Compression Ratios","display_name":"Efficient Prognostication of Pattern Count with Different Input Compression Ratios","publication_year":2020,"publication_date":"2020-05-01","ids":{"openalex":"https://openalex.org/W3038497612","doi":"https://doi.org/10.1109/ets48528.2020.9131586","mag":"3038497612"},"language":"en","primary_location":{"id":"doi:10.1109/ets48528.2020.9131586","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets48528.2020.9131586","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083596575","display_name":"Fong-Jyun Tsai","orcid":"https://orcid.org/0000-0002-5129-645X"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Fong-Jyun Tsai","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081705946","display_name":"Chong-Siao Ye","orcid":"https://orcid.org/0000-0001-8221-4392"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chong-Siao Ye","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101775144","display_name":"Yu Huang","orcid":"https://orcid.org/0000-0003-2619-4686"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Huang","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079657769","display_name":"Kuen-Jong Lee","orcid":"https://orcid.org/0000-0002-6690-0074"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuen-Jong Lee","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077101123","display_name":"S.M. Reddy","orcid":"https://orcid.org/0000-0001-9208-8262"},"institutions":[{"id":"https://openalex.org/I126307644","display_name":"University of Iowa","ror":"https://ror.org/036jqmy94","country_code":"US","type":"education","lineage":["https://openalex.org/I126307644"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sudhakar M. Reddy","raw_affiliation_strings":["Department of Electrical & Computer Engineering, University of Iowa, Iowa City, IA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical & Computer Engineering, University of Iowa, Iowa City, IA, USA","institution_ids":["https://openalex.org/I126307644"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088212941","display_name":"Mark Kassab","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark Kassab","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080960636","display_name":"Janusz Rajski","orcid":"https://orcid.org/0000-0003-2124-447X"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Janusz Rajski","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5083596575"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08304297,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.6836538314819336},{"id":"https://openalex.org/keywords/compression-ratio","display_name":"Compression ratio","score":0.6440982818603516},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6103824973106384},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.5947824716567993},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.5758365392684937},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.514053225517273},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.41044265031814575},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11215966939926147},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.06772544980049133}],"concepts":[{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.6836538314819336},{"id":"https://openalex.org/C25797200","wikidata":"https://www.wikidata.org/wiki/Q828137","display_name":"Compression ratio","level":3,"score":0.6440982818603516},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6103824973106384},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.5947824716567993},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.5758365392684937},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.514053225517273},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.41044265031814575},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11215966939926147},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.06772544980049133},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C511840579","wikidata":"https://www.wikidata.org/wiki/Q12757","display_name":"Internal combustion engine","level":2,"score":0.0},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.0},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ets48528.2020.9131586","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets48528.2020.9131586","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.41999998688697815}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1849928240","https://openalex.org/W1985440524","https://openalex.org/W2011363932","https://openalex.org/W2143816238","https://openalex.org/W2144033909","https://openalex.org/W6681008240"],"related_works":["https://openalex.org/W4285708951","https://openalex.org/W2147986372","https://openalex.org/W2786111245","https://openalex.org/W1979305473","https://openalex.org/W3009953521","https://openalex.org/W4234763172","https://openalex.org/W2992024382","https://openalex.org/W2125317684","https://openalex.org/W1588361197","https://openalex.org/W2161045522"],"abstract_inverted_index":{"A":[0],"novel":[1],"method":[2,28],"to":[3,39],"efficiently":[4],"and":[5],"accurately":[6],"prognosticate":[7],"the":[8,17,29,40],"pattern":[9],"count":[10],"at":[11],"different":[12],"input":[13],"compression":[14,22],"ratios":[15],"with":[16],"Embedded":[18],"Deterministic":[19],"Test":[20],"(EDT)":[21],"technology":[23],"is":[24],"proposed.":[25],"With":[26],"this":[27],"total":[30],"ATPG":[31],"run":[32],"time":[33],"can":[34],"be":[35],"significantly":[36],"reduced":[37],"compared":[38],"currently":[41],"used":[42],"trial-and-error":[43],"method.":[44]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}