{"id":"https://openalex.org/W2967569513","doi":"https://doi.org/10.1109/ets.2019.8791515","title":"Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs","display_name":"Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs","publication_year":2019,"publication_date":"2019-05-01","ids":{"openalex":"https://openalex.org/W2967569513","doi":"https://doi.org/10.1109/ets.2019.8791515","mag":"2967569513"},"language":"en","primary_location":{"id":"doi:10.1109/ets.2019.8791515","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets.2019.8791515","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090354528","display_name":"Arjun Chaudhuri","orcid":"https://orcid.org/0000-0001-9353-6397"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arjun Chaudhuri","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052051759","display_name":"Sanmitra Banerjee","orcid":"https://orcid.org/0000-0002-1136-9220"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanmitra Banerjee","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022173483","display_name":"Heechun Park","orcid":"https://orcid.org/0000-0003-2796-518X"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Heechun Park","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041659450","display_name":"Bon Woong Ku","orcid":"https://orcid.org/0000-0001-9770-0297"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bon Woong Ku","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033880864","display_name":"Krishnendu Chakrabarty","orcid":"https://orcid.org/0000-0003-4475-6435"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnendu Chakrabarty","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung-Kyu Lim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.9687,"has_fulltext":false,"cited_by_count":23,"citation_normalized_percentile":{"value":0.76469461,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5576578378677368},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5045150518417358},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4517001509666443},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.43036219477653503},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4023705720901489},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3586024343967438},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.32267457246780396},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.23620501160621643},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18151667714118958},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.10553866624832153},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08934292197227478}],"concepts":[{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5576578378677368},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5045150518417358},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4517001509666443},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.43036219477653503},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4023705720901489},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3586024343967438},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.32267457246780396},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.23620501160621643},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18151667714118958},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.10553866624832153},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08934292197227478},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ets.2019.8791515","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ets.2019.8791515","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE European Test Symposium (ETS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1526396591","https://openalex.org/W1559886496","https://openalex.org/W1560950418","https://openalex.org/W1668395569","https://openalex.org/W1965451131","https://openalex.org/W1972367194","https://openalex.org/W1995969856","https://openalex.org/W2029376899","https://openalex.org/W2030641935","https://openalex.org/W2083758827","https://openalex.org/W2102304175","https://openalex.org/W2106433082","https://openalex.org/W2127622278","https://openalex.org/W2134103801","https://openalex.org/W2137906067","https://openalex.org/W2160007566","https://openalex.org/W2160393392","https://openalex.org/W2162544780","https://openalex.org/W2569250791","https://openalex.org/W2581008992","https://openalex.org/W2735555835","https://openalex.org/W2885203734","https://openalex.org/W4242887565","https://openalex.org/W6636913440","https://openalex.org/W6649450396","https://openalex.org/W6731978728","https://openalex.org/W6754135523"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W3093450488","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W3163301441","https://openalex.org/W1522190160","https://openalex.org/W2534942874","https://openalex.org/W2289302158"],"abstract_inverted_index":{"Monolithic":[0],"3D":[1],"integration":[2,6,17],"provides":[3,131],"massive":[4],"vertical":[5],"through":[7,94],"the":[8,23,59,76,83,85,119,136],"use":[9],"of":[10,22,62,65,82,138,142],"nanoscale":[11],"inter-layer":[12,24],"vias":[13],"(ILVs).":[14],"However,":[15],"high":[16],"density":[18],"and":[19,46,55,113,127,135],"aggressive":[20],"scaling":[21],"dielectric":[25],"make":[26],"ILVs":[27,66],"especially":[28],"prone":[29],"to":[30,40,58,90],"defects.":[31],"We":[32,97],"present":[33],"a":[34,63,70,91,139],"low-cost":[35],"built-in":[36],"self-test":[37],"(BIST)":[38],"method":[39,122],"detect":[41],"opens,":[42],"stuck-at":[43],"faults":[44,48],"(SAFs),":[45],"bridging":[47],"(shorts)":[49],"in":[50],"ILVs.":[51],"Two":[52],"test":[53,86,128],"patterns-all-1s":[54],"all-0s-are":[56],"applied":[57],"input":[60],"side":[61,81],"set":[64],"(e.g.,":[67],"making":[68],"up":[69],"bus":[71],"between":[72],"two":[73],"tiers).":[74],"On":[75],"adjacent":[77],"tier":[78],"(the":[79],"output":[80],"ILVs),":[84],"responses":[87],"are":[88],"compacted":[89],"2-bit":[92],"signature":[93],"space":[95],"compaction.":[96],"prove":[98],"that":[99,118],"this":[100],"compaction":[101],"solution":[102],"does":[103],"not":[104],"introduce":[105],"any":[106],"fault":[107,133],"aliasing.":[108],"Simulations":[109],"results":[110],"using":[111],"HSPICE":[112],"M3D":[114],"benchmark":[115],"designs":[116],"show":[117],"proposed":[120],"BIST":[121],"requires":[123],"low":[124],"area":[125],"overhead":[126],"time,":[129],"but":[130],"effective":[132],"localization":[134],"detectability":[137],"wide":[140],"range":[141],"resistive":[143],"faults.":[144]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":4}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}