{"id":"https://openalex.org/W2028695918","doi":"https://doi.org/10.1109/etfa.2013.6648127","title":"Prediction of integral type failures in semiconductor manufacturing through classification methods","display_name":"Prediction of integral type failures in semiconductor manufacturing through classification methods","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W2028695918","doi":"https://doi.org/10.1109/etfa.2013.6648127","mag":"2028695918"},"language":"en","primary_location":{"id":"doi:10.1109/etfa.2013.6648127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/etfa.2013.6648127","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE 18th Conference on Emerging Technologies & Factory Automation (ETFA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026617079","display_name":"Gian Antonio Susto","orcid":"https://orcid.org/0000-0001-5739-9639"},"institutions":[{"id":"https://openalex.org/I157286207","display_name":"National University of Ireland, Maynooth","ror":"https://ror.org/048nfjm95","country_code":"IE","type":"education","lineage":["https://openalex.org/I157286207"]}],"countries":["IE"],"is_corresponding":false,"raw_author_name":"Gian Antonio Susto","raw_affiliation_strings":["National University of Ireland, Maynooth, Ireland","National University of Ireland Maynooth, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National University of Ireland, Maynooth, Ireland","institution_ids":["https://openalex.org/I157286207"]},{"raw_affiliation_string":"National University of Ireland Maynooth, Ireland","institution_ids":["https://openalex.org/I157286207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005974306","display_name":"Se\u00e1n McLoone","orcid":"https://orcid.org/0000-0002-3016-6197"},"institutions":[{"id":"https://openalex.org/I157286207","display_name":"National University of Ireland, Maynooth","ror":"https://ror.org/048nfjm95","country_code":"IE","type":"education","lineage":["https://openalex.org/I157286207"]}],"countries":["IE"],"is_corresponding":false,"raw_author_name":"Sean McLoone","raw_affiliation_strings":["National University of Ireland, Maynooth, Ireland","National University of Ireland Maynooth, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National University of Ireland, Maynooth, Ireland","institution_ids":["https://openalex.org/I157286207"]},{"raw_affiliation_string":"National University of Ireland Maynooth, Ireland","institution_ids":["https://openalex.org/I157286207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087350070","display_name":"Daniele Pagano","orcid":"https://orcid.org/0000-0003-4070-454X"},"institutions":[{"id":"https://openalex.org/I25217355","display_name":"University of Pavia","ror":"https://ror.org/00s6t1f81","country_code":"IT","type":"education","lineage":["https://openalex.org/I25217355"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Daniele Pagano","raw_affiliation_strings":["University of Pavia, Italy","STMicroelectron. Catania, Catania, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Pavia, Italy","institution_ids":["https://openalex.org/I25217355"]},{"raw_affiliation_string":"STMicroelectron. Catania, Catania, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081650242","display_name":"Andrea Schirru","orcid":"https://orcid.org/0000-0002-9249-1227"},"institutions":[{"id":"https://openalex.org/I25217355","display_name":"University of Pavia","ror":"https://ror.org/00s6t1f81","country_code":"IT","type":"education","lineage":["https://openalex.org/I25217355"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Andrea Schirru","raw_affiliation_strings":["University of Pavia, Italy","University of Pavia, Pavia / Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Pavia, Italy","institution_ids":["https://openalex.org/I25217355"]},{"raw_affiliation_string":"University of Pavia, Pavia / Italy","institution_ids":["https://openalex.org/I25217355"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061018928","display_name":"Simone Pampuri","orcid":"https://orcid.org/0000-0002-0582-9892"},"institutions":[{"id":"https://openalex.org/I138689650","display_name":"University of Padua","ror":"https://ror.org/00240q980","country_code":"IT","type":"education","lineage":["https://openalex.org/I138689650"]},{"id":"https://openalex.org/I25217355","display_name":"University of Pavia","ror":"https://ror.org/00s6t1f81","country_code":"IT","type":"education","lineage":["https://openalex.org/I25217355"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Simone Pampuri","raw_affiliation_strings":["University of Padova, Italy","University of Pavia, Pavia / Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Padova, Italy","institution_ids":["https://openalex.org/I138689650"]},{"raw_affiliation_string":"University of Pavia, Pavia / Italy","institution_ids":["https://openalex.org/I25217355"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043391732","display_name":"Alessandro Beghi","orcid":"https://orcid.org/0000-0003-2252-2179"},"institutions":[{"id":"https://openalex.org/I138689650","display_name":"University of Padua","ror":"https://ror.org/00240q980","country_code":"IT","type":"education","lineage":["https://openalex.org/I138689650"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alessandro Beghi","raw_affiliation_strings":["STMicroelectronics, Italy","Univ. of Padova,Padua,Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"Univ. of Padova,Padua,Italy","institution_ids":["https://openalex.org/I138689650"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.5069,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":{"value":0.8473345,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11443","display_name":"Advanced Statistical Process Monitoring","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/1804","display_name":"Statistics, Probability and Uncertainty"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/downtime","display_name":"Downtime","score":0.8950096964836121},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.6815183162689209},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6353181004524231},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5987386703491211},{"id":"https://openalex.org/keywords/predictive-maintenance","display_name":"Predictive maintenance","score":0.4237467646598816},{"id":"https://openalex.org/keywords/production","display_name":"Production (economics)","score":0.4208827018737793},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3790203332901001},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3248157501220703},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2850627899169922},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12244856357574463},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.099244624376297}],"concepts":[{"id":"https://openalex.org/C180591934","wikidata":"https://www.wikidata.org/wiki/Q1253369","display_name":"Downtime","level":2,"score":0.8950096964836121},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.6815183162689209},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6353181004524231},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5987386703491211},{"id":"https://openalex.org/C70452415","wikidata":"https://www.wikidata.org/wiki/Q3182448","display_name":"Predictive maintenance","level":2,"score":0.4237467646598816},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.4208827018737793},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3790203332901001},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3248157501220703},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2850627899169922},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12244856357574463},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.099244624376297},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/etfa.2013.6648127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/etfa.2013.6648127","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE 18th Conference on Emerging Technologies & Factory Automation (ETFA)","raw_type":"proceedings-article"},{"id":"pmh:oai:pure.qub.ac.uk/portal:publications/9a28c5c9-fa2a-4c06-aa7b-0ffc7ec19a7c","is_oa":false,"landing_page_url":"https://pure.qub.ac.uk/en/publications/9a28c5c9-fa2a-4c06-aa7b-0ffc7ec19a7c","pdf_url":null,"source":{"id":"https://openalex.org/S4306402319","display_name":"Research Portal (Queen's University Belfast)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I126231945","host_organization_name":"Queen's University Belfast","host_organization_lineage":["https://openalex.org/I126231945"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Susto , G A , McLoone , S , Pagano , D , Schirru , A , Pampuri , S & Beghi , A 2013 , Prediction of integral type failures in semiconductor manufacturing through classification methods . in IEEE International Conference on Emerging Technologies and Factory Automation, ETFA . , 6648127 , 2013 IEEE 18th International Conference on Emerging Technologies and Factory Automation, ETFA 2013 , Cagliari , Italy , 10/09/2013 . https://doi.org/10.1109/ETFA.2013.6648127","raw_type":"contributionToPeriodical"},{"id":"pmh:oai:www.research.unipd.it:11577/2795756","is_oa":false,"landing_page_url":"http://hdl.handle.net/11577/2795756","pdf_url":null,"source":{"id":"https://openalex.org/S4306402547","display_name":"Padua Research Archive (University of Padova)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I138689650","host_organization_name":"University of Padua","host_organization_lineage":["https://openalex.org/I138689650"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1977471222","https://openalex.org/W2033872649","https://openalex.org/W2034243637","https://openalex.org/W2077562320","https://openalex.org/W2095971510","https://openalex.org/W2105355692","https://openalex.org/W2151252797","https://openalex.org/W2169815324","https://openalex.org/W2171789818","https://openalex.org/W2336000173","https://openalex.org/W6675713438","https://openalex.org/W6703532998"],"related_works":["https://openalex.org/W4362496992","https://openalex.org/W1516451032","https://openalex.org/W2944342107","https://openalex.org/W102856357","https://openalex.org/W1567468256","https://openalex.org/W4214827973","https://openalex.org/W2124941321","https://openalex.org/W4251454458","https://openalex.org/W1980965876","https://openalex.org/W2080951167"],"abstract_inverted_index":{"Smart":[0],"management":[1],"of":[2,37,45,47,51,77,89,101,108],"maintenances":[3],"has":[4,94,115],"become":[5],"fundamental":[6],"in":[7,10,61],"manufacturing":[8],"environments":[9],"order":[11],"to":[12,84,97],"decrease":[13,39],"downtime":[14],"and":[15,49,87],"costs":[16,36],"associated":[17],"with":[18,33],"failures.":[19],"Predictive":[20],"Maintenance":[21],"(PdM)":[22],"systems":[23,55],"based":[24,67],"on":[25,68,118],"Machine":[26],"Learning":[27],"(ML)":[28],"techniques":[29],"have":[30],"the":[31,43,75,106],"possibility":[32],"low":[34],"added":[35],"drastically":[38],"failures-related":[40],"expenses;":[41],"given":[42],"increase":[44],"availability":[46],"data":[48],"capabilities":[50],"ML":[52],"tools,":[53],"PdM":[54,65,114],"are":[56,82],"becoming":[57],"really":[58],"popular,":[59],"especially":[60],"semiconductor":[62,102],"manufacturing.":[63],"A":[64],"module":[66,93],"Classification":[69],"methods":[70],"is":[71],"presented":[72],"here":[73],"for":[74,105],"prediction":[76,107],"integral":[78],"type":[79],"faults":[80],"that":[81],"related":[83],"machine":[85],"usage":[86],"stress":[88],"equipment":[90],"parts.":[91],"The":[92,113],"been":[95,116],"applied":[96],"an":[98],"important":[99],"class":[100],"processes,":[103],"ion-implantation,":[104],"ion-source":[109],"tungsten":[110],"filament":[111],"breaks.":[112],"tested":[117],"a":[119],"real":[120],"production":[121],"dataset.":[122]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":4},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}