{"id":"https://openalex.org/W2984240852","doi":"https://doi.org/10.1109/essderc.2019.8901809","title":"Challenges and capabilities of 3D integration in CMOS imaging sensors","display_name":"Challenges and capabilities of 3D integration in CMOS imaging sensors","publication_year":2019,"publication_date":"2019-09-01","ids":{"openalex":"https://openalex.org/W2984240852","doi":"https://doi.org/10.1109/essderc.2019.8901809","mag":"2984240852"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2019.8901809","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901809","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057490839","display_name":"Dominique Thomas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210094169","display_name":"STMicroelectronics (India)","ror":"https://ror.org/00ft7bw25","country_code":"IN","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210094169"]},{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR","IN"],"is_corresponding":true,"raw_author_name":"Dominique Thomas","raw_affiliation_strings":["STMicroelectronics,Europe and France Public Affairs,Crolles,France","Europe and France Public Affairs, STMicroelectronics, Crolles, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics,Europe and France Public Affairs,Crolles,France","institution_ids":["https://openalex.org/I4210094169"]},{"raw_affiliation_string":"Europe and France Public Affairs, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079759778","display_name":"J. Michailos","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210094169","display_name":"STMicroelectronics (India)","ror":"https://ror.org/00ft7bw25","country_code":"IN","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210094169"]}],"countries":["CH","FR","IN"],"is_corresponding":false,"raw_author_name":"Jean Michailos","raw_affiliation_strings":["STMicroelectronics,Digital Front-End Manufacturing & Technology R&D,Crolles,France","Digital Front-End Manufacturing & Technology R&D, STMicroelectronics, Crolles, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics,Digital Front-End Manufacturing & Technology R&D,Crolles,France","institution_ids":["https://openalex.org/I4210094169","https://openalex.org/I131827901"]},{"raw_affiliation_string":"Digital Front-End Manufacturing & Technology R&D, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109255777","display_name":"K. Rochereau","orcid":null},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["CH","FR"],"is_corresponding":false,"raw_author_name":"Krysten Rochereau","raw_affiliation_strings":["STMicroelectronics,Imaging Division,Grenoble,France","Imaging Division, STMicroelectronics, Grenoble, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics,Imaging Division,Grenoble,France","institution_ids":["https://openalex.org/I4210104693","https://openalex.org/I131827901"]},{"raw_affiliation_string":"Imaging Division, STMicroelectronics, Grenoble, France","institution_ids":["https://openalex.org/I4210104693"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5057490839"],"corresponding_institution_ids":["https://openalex.org/I4210094169","https://openalex.org/I4210104693"],"apc_list":null,"apc_paid":null,"fwci":0.4769,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.66055741,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"54","last_page":"56"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12153","display_name":"Advanced Optical Sensing Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12389","display_name":"Infrared Target Detection Methodologies","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7027474045753479},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5632684230804443},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.2252599596977234},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2050643265247345}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7027474045753479},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5632684230804443},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.2252599596977234},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2050643265247345}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2019.8901809","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901809","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2022397498","https://openalex.org/W2767802909","https://openalex.org/W6921191835"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W3014521742","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4386230336","https://openalex.org/W4306968100"],"abstract_inverted_index":{"Increasing":[0],"the":[1,8,25,39,46,50],"density":[2],"and":[3,28,37,49],"functionalities":[4],"of":[5,30],"chips":[6],"in":[7],"third":[9],"dimension,":[10],"3D":[11],"Integration":[12],"(3DI),":[13],"is":[14],"now":[15],"being":[16],"applied":[17],"for":[18,32],"imaging":[19,33],"type":[20],"devices.":[21],"We":[22],"will":[23,42,53],"review":[24],"various":[26],"advantages":[27,36],"embodiments":[29],"3DI":[31],"sensors.":[34],"The":[35],"also":[38],"technical":[40],"challenges":[41],"be":[43,54],"described.":[44],"Finally,":[45],"upcoming":[47],"developments":[48],"next":[51],"steps":[52],"addressed.":[55]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}