{"id":"https://openalex.org/W2984236487","doi":"https://doi.org/10.1109/essderc.2019.8901742","title":"Power Packages Interconnections for High Reliability Automotive Applications","display_name":"Power Packages Interconnections for High Reliability Automotive Applications","publication_year":2019,"publication_date":"2019-09-01","ids":{"openalex":"https://openalex.org/W2984236487","doi":"https://doi.org/10.1109/essderc.2019.8901742","mag":"2984236487"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2019.8901742","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901742","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036771281","display_name":"Michele Calabretta","orcid":"https://orcid.org/0000-0001-9322-182X"},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","CZ","IT"],"is_corresponding":false,"raw_author_name":"Michele Calabretta","raw_affiliation_strings":["ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","institution_ids":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017949440","display_name":"Marco Renna","orcid":"https://orcid.org/0000-0002-8143-5131"},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","CZ","IT"],"is_corresponding":false,"raw_author_name":"Marco Renna","raw_affiliation_strings":["ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","institution_ids":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021755663","display_name":"Vincenzo Vinciguerra","orcid":"https://orcid.org/0000-0003-2188-4178"},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","CZ","IT"],"is_corresponding":false,"raw_author_name":"Vincenzo Vinciguerra","raw_affiliation_strings":["ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics,Catania,Italy","institution_ids":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"raw_affiliation_string":"ADG R&D, FE/BE Fusion, STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033909920","display_name":"Angelo Messina","orcid":"https://orcid.org/0000-0002-2762-6615"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Angelo Alberto Messina","raw_affiliation_strings":["Italy Public Affairs, STMicroelectronics,Catania,Italy","Italy Public Affairs, STMicroelectronics, Catania, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Italy Public Affairs, STMicroelectronics,Catania,Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"Italy Public Affairs, STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6953,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.85018934,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"35","last_page":"39"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.7768584489822388},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7289522290229797},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6057562232017517},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5681633353233337},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5294206738471985},{"id":"https://openalex.org/keywords/automotive-electronics","display_name":"Automotive electronics","score":0.527832567691803},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.5104038119316101},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.48914268612861633},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2549768090248108},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24804610013961792}],"concepts":[{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.7768584489822388},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7289522290229797},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6057562232017517},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5681633353233337},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5294206738471985},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.527832567691803},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.5104038119316101},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.48914268612861633},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2549768090248108},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24804610013961792},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2019.8901742","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901742","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.41999998688697815,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1989472626","https://openalex.org/W2019657740","https://openalex.org/W2040557976","https://openalex.org/W2047220457","https://openalex.org/W2071697832","https://openalex.org/W2095848836","https://openalex.org/W2105173314","https://openalex.org/W2134357750","https://openalex.org/W2145671267","https://openalex.org/W2165842238","https://openalex.org/W2509999191","https://openalex.org/W2735282048","https://openalex.org/W2737101607","https://openalex.org/W2744657634","https://openalex.org/W2791656386","https://openalex.org/W2793524951","https://openalex.org/W2891535831","https://openalex.org/W2909257964","https://openalex.org/W2965651616","https://openalex.org/W2973525978","https://openalex.org/W2974676986","https://openalex.org/W2988774712","https://openalex.org/W3048946113","https://openalex.org/W3141432254","https://openalex.org/W3143537468","https://openalex.org/W3147555153","https://openalex.org/W6674599211","https://openalex.org/W6681874161","https://openalex.org/W6782165737"],"related_works":["https://openalex.org/W2601440513","https://openalex.org/W1990897099","https://openalex.org/W2073124931","https://openalex.org/W2549730073","https://openalex.org/W1992148151","https://openalex.org/W2075934899","https://openalex.org/W1858099686","https://openalex.org/W2073680493","https://openalex.org/W3012473220","https://openalex.org/W2769855917"],"abstract_inverted_index":{"In":[0,50,82],"this":[1],"paper":[2],"an":[3],"overview":[4],"on":[5,70],"Power":[6,129],"Packages":[7],"challenges":[8,15],"and":[9,33,72,88,115],"technology":[10,94],"approaches":[11],"is":[12,75,96],"given.":[13],"These":[14],"mainly":[16],"originate":[17],"from":[18,54],"Silicon":[19,92],"Carbide":[20,93],"MOSFETs":[21],"superior":[22],"properties":[23],"allowing":[24],"high":[25,27,34],"power,":[26],"temperature":[28],"capability,":[29],"fast":[30],"switching":[31],"transients":[32],"electric":[35],"field":[36],"operations.":[37],"All":[38],"these":[39,59,79],"features":[40],"can":[41],"be":[42],"obtained":[43],"in":[44],"a":[45,67,113],"significant":[46],"reduced":[47],"chip":[48],"area.":[49],"order":[51],"to":[52,77,112,124],"benefit":[53],"the":[55,86,99,103,107,119,126],"disrupting":[56],"advantages":[57],"of":[58,85,122,128],"wide":[60],"band":[61],"gap":[62],"semiconductor":[63],"based":[64],"power":[65],"devices,":[66],"strong":[68,89],"focus":[69],"packaging":[71],"interconnection":[73],"technologies":[74],"needed":[76],"withstand":[78],"challenging":[80],"requirements.":[81],"addition":[83],"one":[84],"major":[87],"boost":[90],"for":[91,106],"development":[95],"given":[97],"by":[98],"car":[100],"electrification":[101],"trend:":[102],"strict":[104],"requirements":[105],"Automotive":[108],"Market":[109],"are":[110],"leading":[111],"design":[114],"engineering":[116],"oriented,":[117],"since":[118],"preliminary":[120],"stage":[121],"development,":[123],"optimize":[125],"reliability":[127],"Packages.":[130]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":4}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}