{"id":"https://openalex.org/W2896428780","doi":"https://doi.org/10.1109/essderc.2018.8486894","title":"Unleashing Technology Solutions for a New Era of Connected Intelligence","display_name":"Unleashing Technology Solutions for a New Era of Connected Intelligence","publication_year":2018,"publication_date":"2018-09-01","ids":{"openalex":"https://openalex.org/W2896428780","doi":"https://doi.org/10.1109/essderc.2018.8486894","mag":"2896428780"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2018.8486894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2018.8486894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 48th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034923844","display_name":"G.L. Patton","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Gary L. Patton","raw_affiliation_strings":["CTO GLOBALFOUNDRIES, USA"],"affiliations":[{"raw_affiliation_string":"CTO GLOBALFOUNDRIES, USA","institution_ids":["https://openalex.org/I35662394"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5034923844"],"corresponding_institution_ids":["https://openalex.org/I35662394"],"apc_list":null,"apc_paid":null,"fwci":0.5536,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.70849101,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"2","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10273","display_name":"IoT and Edge/Fog Computing","score":0.9607999920845032,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10273","display_name":"IoT and Edge/Fog Computing","score":0.9607999920845032,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6118875741958618},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5651543736457825},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.5062069296836853},{"id":"https://openalex.org/keywords/on-demand","display_name":"On demand","score":0.48496556282043457},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4111974835395813},{"id":"https://openalex.org/keywords/multimedia","display_name":"Multimedia","score":0.3012235462665558}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6118875741958618},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5651543736457825},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.5062069296836853},{"id":"https://openalex.org/C2983523559","wikidata":"https://www.wikidata.org/wiki/Q410657","display_name":"On demand","level":2,"score":0.48496556282043457},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4111974835395813},{"id":"https://openalex.org/C49774154","wikidata":"https://www.wikidata.org/wiki/Q131765","display_name":"Multimedia","level":1,"score":0.3012235462665558}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2018.8486894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2018.8486894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 48th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5699999928474426,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2317123011","https://openalex.org/W304855073","https://openalex.org/W2036193034","https://openalex.org/W938111471","https://openalex.org/W2511882081","https://openalex.org/W2518250394","https://openalex.org/W2032169142","https://openalex.org/W2037330166","https://openalex.org/W3131627289","https://openalex.org/W2129317693"],"abstract_inverted_index":{"Chip":[0],"demand":[1,32,45],"is":[2,29],"no":[3],"longer":[4],"only":[5],"being":[6],"driven":[7],"by":[8],"the":[9],"needs":[10],"of":[11,20,43,56],"computer":[12],"and":[13,22,33,59,70,72],"smartphone":[14],"manufacturers.":[15],"Now,":[16],"a":[17,53],"growing":[18],"number":[19],"new":[21,38],"varied":[23],"applications":[24],"within":[25],"many":[26],"different":[27],"industries":[28],"both":[30],"creating":[31],"pushing":[34],"chip":[35],"technology":[36,49],"in":[37],"directions.":[39],"The":[40],"major":[41],"drivers":[42],"semiconductor":[44],"will":[46],"come":[47],"from":[48],"innovations":[50],"that":[51],"enable":[52],"high":[54],"degree":[55],"sensing,":[57],"processing":[58],"communications":[60],"capability":[61],"for":[62],"autonomous":[63],"vehicles":[64],"(AV),":[65],"artificial":[66],"intelligence/machine":[67],"learning":[68],"(AI/ML)":[69],"5G":[71],"wireless":[73],"networking.":[74]},"counts_by_year":[{"year":2019,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}