{"id":"https://openalex.org/W2896309480","doi":"https://doi.org/10.1109/essderc.2018.8486875","title":"Why SPICE Is Just As Good And Just As Bad For IC Design As It Was 40 Years Ago","display_name":"Why SPICE Is Just As Good And Just As Bad For IC Design As It Was 40 Years Ago","publication_year":2018,"publication_date":"2018-09-01","ids":{"openalex":"https://openalex.org/W2896309480","doi":"https://doi.org/10.1109/essderc.2018.8486875","mag":"2896309480"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2018.8486875","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2018.8486875","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 48th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025448913","display_name":"Laurence W. Nagel","orcid":"https://orcid.org/0000-0003-1249-176X"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Laurence W. Nagel","raw_affiliation_strings":["Omega Enterprises Consulting, Kensington, CA"],"affiliations":[{"raw_affiliation_string":"Omega Enterprises Consulting, Kensington, CA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018185112","display_name":"Colin C. McAndrew","orcid":"https://orcid.org/0000-0002-1901-8169"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Colin C. McAndrew","raw_affiliation_strings":["NXP Semiconductors, Chandler, AZ"],"affiliations":[{"raw_affiliation_string":"NXP Semiconductors, Chandler, AZ","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5025448913"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.10069166,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"170","last_page":"173"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9897000193595886,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9894000291824341,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.9326304793357849},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5023088455200195},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.32800307869911194},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25799763202667236},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2230778932571411}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.9326304793357849},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5023088455200195},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.32800307869911194},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25799763202667236},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2230778932571411}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2018.8486875","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2018.8486875","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 48th European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.6399999856948853,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320309411","display_name":"University of California Berkeley","ror":"https://ror.org/01an7q238"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1580969046","https://openalex.org/W1978981235","https://openalex.org/W2012857900","https://openalex.org/W2012991867","https://openalex.org/W2020790719","https://openalex.org/W2023354763","https://openalex.org/W2095296441","https://openalex.org/W2106401334","https://openalex.org/W2134883472","https://openalex.org/W2153138227","https://openalex.org/W2179390928","https://openalex.org/W6674071985","https://openalex.org/W6674083071"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2204879205","https://openalex.org/W2096437374","https://openalex.org/W1943174035","https://openalex.org/W1928481607","https://openalex.org/W3135165657","https://openalex.org/W1485582195","https://openalex.org/W57337972"],"abstract_inverted_index":{"The":[0],"modern":[1],"EDA":[2],"industry":[3],"has":[4,111,117],"its":[5],"roots":[6],"at":[7,106,114,130],"UC":[8],"Berkeley":[9],"in":[10,14,50,58,74,124],"the":[11,16,21,61,64,68,71],"1970's,":[12],"and":[13,52,67,87,91,135,147],"particular":[15],"spread":[17],"of":[18,23,63,70,101],"SPICE":[19,41,75,116,143],"fueled":[20],"growth":[22],"this":[24,131],"industry.":[25,59],"Evolving":[26],"from":[27],"a":[28,32,36],"teaching":[29],"tool":[30,34],"to":[31,35,46,53,84,92,119,122,141],"research":[33,139],"production":[37,55],"IC":[38,48,56],"design":[39,49,57],"tool,":[40],"is":[42],"still":[43],"universally":[44],"used":[45],"teach":[47],"academia":[51],"do":[54],"Both":[60],"capabilities":[62],"simulation":[65],"algorithms":[66],"accuracy":[69],"compact":[72],"models":[73],"have":[76,104],"improved":[77],"dramatically":[78],"over":[79],"time.":[80],"However,":[81],"designer":[82],"expectations,":[83],"handle":[85],"larger":[86],"more":[88,94,98],"complex":[89],"circuits":[90],"give":[93],"accuracte":[95],"results":[96],"for":[97],"detailed":[99],"aspects":[100],"circuit":[102],"behavior,":[103],"increased":[105],"least":[107],"as":[108],"fast.":[109],"This":[110,126],"meant":[112],"that,":[113],"best,":[115],"had":[118],"\u201crun":[120],"just":[121],"stay":[123],"place.\u201d":[125],"paper":[127],"looks":[128],"back":[129],"escalating":[132],"arms":[133],"race,":[134],"proposes":[136],"some":[137,145],"future":[138],"directions":[140],"help":[142],"make":[144],"headway":[146],"\u201cswim":[148],"upstream.\u201d":[149]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}