{"id":"https://openalex.org/W2124433198","doi":"https://doi.org/10.1109/essderc.2014.6948785","title":"Manufacturing of 3D integrated sensors and circuits","display_name":"Manufacturing of 3D integrated sensors and circuits","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2124433198","doi":"https://doi.org/10.1109/essderc.2014.6948785","mag":"2124433198"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2014.6948785","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948785","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085528171","display_name":"M. Schrems","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":true,"raw_author_name":"Martin Schrems","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Joerg Siegert","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Joerg Siegert","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027692075","display_name":"Peter Dorfi","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Peter Dorfi","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112432111","display_name":"Jochen Kraft","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Jochen Kraft","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090562399","display_name":"Ewald Stueckler","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Ewald Stueckler","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111642415","display_name":"Franz Schrank","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Franz Schrank","raw_affiliation_strings":["Ams AG, Unterpremst\u00e4tten, Austria","ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria"],"affiliations":[{"raw_affiliation_string":"Ams AG, Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]},{"raw_affiliation_string":"ams AG, Tobelbaderstrasse 30, A-8141 Unterpremst\u00e4tten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043510129","display_name":"S. Selberherr","orcid":"https://orcid.org/0000-0002-5583-6177"},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Siegfried Selberherr","raw_affiliation_strings":["Institute for Microelectronics, TU Wien, Vienna, Austria","Institute for Microelectronics, TU Wien, Gu\u00dfhausstra\u00dfe 27-29, A-1040, Vienna, Austria"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, TU Wien, Vienna, Austria","institution_ids":["https://openalex.org/I145847075"]},{"raw_affiliation_string":"Institute for Microelectronics, TU Wien, Gu\u00dfhausstra\u00dfe 27-29, A-1040, Vienna, Austria","institution_ids":["https://openalex.org/I145847075"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5085528171"],"corresponding_institution_ids":["https://openalex.org/I154481106"],"apc_list":null,"apc_paid":null,"fwci":0.2129,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.62038043,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"50","issue":null,"first_page":"162","last_page":"165"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6861041188240051},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.598432719707489},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5657547116279602},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5383537411689758},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.5192285180091858},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.49000659584999084},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4665273129940033},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.46572133898735046},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.45389437675476074},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.426922082901001},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.42678719758987427},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.42662739753723145},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.4125678241252899},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3751794099807739},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2837558388710022},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25695687532424927},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.16968610882759094},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.16957300901412964}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6861041188240051},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.598432719707489},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5657547116279602},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5383537411689758},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.5192285180091858},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.49000659584999084},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4665273129940033},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.46572133898735046},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.45389437675476074},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.426922082901001},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.42678719758987427},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.42662739753723145},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.4125678241252899},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3751794099807739},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2837558388710022},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25695687532424927},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.16968610882759094},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16957300901412964},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2014.6948785","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948785","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W649890312","https://openalex.org/W1984431509","https://openalex.org/W1990828594","https://openalex.org/W2022290788","https://openalex.org/W2085064025","https://openalex.org/W2087813280","https://openalex.org/W2089970674","https://openalex.org/W2103535041","https://openalex.org/W2124589504","https://openalex.org/W2129868529","https://openalex.org/W2145670436","https://openalex.org/W2148045464","https://openalex.org/W2154677460","https://openalex.org/W2162427107","https://openalex.org/W2412959408","https://openalex.org/W4231988985","https://openalex.org/W6682055700","https://openalex.org/W6714861229"],"related_works":["https://openalex.org/W3214011388","https://openalex.org/W2096487736","https://openalex.org/W2513455916","https://openalex.org/W2138063101","https://openalex.org/W4231607772","https://openalex.org/W2919940117","https://openalex.org/W2136374712","https://openalex.org/W1512136356","https://openalex.org/W2970498257","https://openalex.org/W1965913935"],"abstract_inverted_index":{"3D":[0,53,65],"integration":[1],"of":[2,47,52,73],"functions":[3],"such":[4,70],"as":[5,71],"sensors":[6,56],"and":[7,12,24,33,42,57,78,82],"circuit":[8],"elements":[9],"enables":[10],"miniaturized":[11],"cost-effective":[13],"smart":[14],"systems.":[15],"Wirebonds":[16],"are":[17,80],"replaced":[18],"by":[19],"Through":[20],"Silicon":[21],"Vias":[22],"(TSVs)":[23],"Wafer":[25],"Level":[26],"Packaging":[27],"(WLP)":[28],"for":[29],"shorter":[30],"conductive":[31],"paths":[32],"reduced":[34],"form":[35],"factor.":[36],"This":[37],"paper":[38],"reviews":[39],"prior":[40],"art":[41],"presents":[43],"a":[44,60],"comprehensive":[45],"set":[46],"data":[48],"from":[49],"volume":[50],"manufacturing":[51,63],"integrated":[54],"optical":[55],"circuits":[58],"using":[59],"\u201cvia":[61],"last\u201d":[62],"flow.":[64],"specific":[66],"yield":[67],"detracting":[68],"processes":[69],"patterning":[72],"open":[74],"TSVs,":[75],"wafer":[76],"bonding,":[77],"etching":[79],"analyzed":[81],"discussed.":[83],"Functional":[84],"test":[85],"yields":[86,92],"equivalent":[87],"to":[88],"standard":[89],"CMOS":[90],"process":[91],"can":[93],"be":[94],"achieved.":[95]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-04-17T18:11:37.981687","created_date":"2025-10-10T00:00:00"}