{"id":"https://openalex.org/W1979921607","doi":"https://doi.org/10.1109/essderc.2014.6948764","title":"Flexible thermoelectric generator based on transfer printed Si microwires","display_name":"Flexible thermoelectric generator based on transfer printed Si microwires","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W1979921607","doi":"https://doi.org/10.1109/essderc.2014.6948764","mag":"1979921607"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2014.6948764","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948764","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Saleem Khan","orcid":null},"institutions":[{"id":"https://openalex.org/I193223587","display_name":"University of Trento","ror":"https://ror.org/05trd4x28","country_code":"IT","type":"education","lineage":["https://openalex.org/I193223587"]},{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"Saleem Khan","raw_affiliation_strings":["Fondazione Bruno Kessler, Trento, Italy","University of Trento, Italy"],"affiliations":[{"raw_affiliation_string":"Fondazione Bruno Kessler, Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]},{"raw_affiliation_string":"University of Trento, Italy","institution_ids":["https://openalex.org/I193223587"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085150253","display_name":"Ravinder Dahiya","orcid":"https://orcid.org/0000-0002-3858-3841"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"R. S. Dahiya","raw_affiliation_strings":["Electronics and Nanoscale Engineering Research Division, University of Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Electronics and Nanoscale Engineering Research Division, University of Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077221056","display_name":"Leandro Lorenzelli","orcid":"https://orcid.org/0000-0003-4624-170X"},"institutions":[{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Lorenzelli","raw_affiliation_strings":["Fondazione Bruno Kessler, Trento, Italy"],"affiliations":[{"raw_affiliation_string":"Fondazione Bruno Kessler, Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I193223587","https://openalex.org/I2277624104"],"apc_list":null,"apc_paid":null,"fwci":1.8595,"has_fulltext":false,"cited_by_count":28,"citation_normalized_percentile":{"value":0.84891572,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"86","last_page":"89"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.824462890625},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7620301246643066},{"id":"https://openalex.org/keywords/polydimethylsiloxane","display_name":"Polydimethylsiloxane","score":0.7395675182342529},{"id":"https://openalex.org/keywords/thermoelectric-generator","display_name":"Thermoelectric generator","score":0.6155474185943604},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5735440254211426},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.5349892973899841},{"id":"https://openalex.org/keywords/transfer-printing","display_name":"Transfer printing","score":0.5232055187225342},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.5225065350532532},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.521365761756897},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4934205114841461},{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.48160430788993835},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.42878106236457825},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4268772602081299},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2867068648338318},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.220414400100708}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.824462890625},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7620301246643066},{"id":"https://openalex.org/C2779849746","wikidata":"https://www.wikidata.org/wiki/Q411955","display_name":"Polydimethylsiloxane","level":2,"score":0.7395675182342529},{"id":"https://openalex.org/C117127486","wikidata":"https://www.wikidata.org/wiki/Q11569191","display_name":"Thermoelectric generator","level":3,"score":0.6155474185943604},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5735440254211426},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.5349892973899841},{"id":"https://openalex.org/C2776226143","wikidata":"https://www.wikidata.org/wiki/Q954883","display_name":"Transfer printing","level":2,"score":0.5232055187225342},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.5225065350532532},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.521365761756897},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4934205114841461},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.48160430788993835},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.42878106236457825},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4268772602081299},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2867068648338318},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.220414400100708},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/essderc.2014.6948764","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948764","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},{"id":"pmh:oai:eprints.gla.ac.uk:96810","is_oa":false,"landing_page_url":"http://eprints.gla.ac.uk/96810/","pdf_url":null,"source":{"id":"https://openalex.org/S4210235606","display_name":"ENLIGHTEN (Jurnal Bimbingan dan Konseling Islam)","issn_l":"2622-8912","issn":["2622-8912","2622-8920"],"is_oa":false,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Proceedings"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G4717790331","display_name":null,"funder_award_id":"EP/M002527/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"}],"funders":[{"id":"https://openalex.org/F4320334627","display_name":"Engineering and Physical Sciences Research Council","ror":"https://ror.org/0439y7842"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W1844204486","https://openalex.org/W1966524213","https://openalex.org/W1968253090","https://openalex.org/W1976856814","https://openalex.org/W1989937017","https://openalex.org/W1995213905","https://openalex.org/W2001632794","https://openalex.org/W2012380511","https://openalex.org/W2024807010","https://openalex.org/W2028285928","https://openalex.org/W2054768064","https://openalex.org/W2066445049","https://openalex.org/W2067432857","https://openalex.org/W2070093297","https://openalex.org/W2127442061","https://openalex.org/W2137377473","https://openalex.org/W2140943816","https://openalex.org/W2142404795","https://openalex.org/W2152131785","https://openalex.org/W2159782350","https://openalex.org/W2163911639","https://openalex.org/W2165394838","https://openalex.org/W2166016439","https://openalex.org/W2170213865","https://openalex.org/W4254531944","https://openalex.org/W7019083744"],"related_works":["https://openalex.org/W1985565313","https://openalex.org/W2299488725","https://openalex.org/W4297921203","https://openalex.org/W4382045974","https://openalex.org/W2082412438","https://openalex.org/W2898710372","https://openalex.org/W4386752455","https://openalex.org/W2062109818","https://openalex.org/W1873175566","https://openalex.org/W4387633099"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"development":[3],"of":[4,24,27,100,134,151,160],"a":[5,39,148],"flexible":[6,143],"thermoelectric":[7,19],"energy":[8],"harvester":[9],"by":[10,86],"using":[11,45,87],"transfer":[12,88,95,107],"printed":[13],"doped":[14,30],"Silicon":[15],"(Si)":[16],"microwires.":[17],"The":[18,51,72],"generator":[20],"(TEG)":[21],"module,":[22],"consisting":[23],"an":[25],"array":[26],"34":[28],"alternately":[29],"p-type":[31],"and":[32,48,63,114],"n-type":[33],"Si":[34,40,52],"microwires,":[35],"is":[36,70],"developed":[37],"on":[38,41],"insulator":[42],"(SOI)":[43],"wafer":[44,79,111],"standard":[46],"photolithography":[47],"etching":[49],"techniques.":[50],"wires":[53,69,101],"in":[54,104,118,129],"the":[55,64,105,119,142,161],"TEG":[56,73,145],"module":[57],"are":[58,75,102,116],"5mm":[59],"long,":[60],"50\u03bcm":[61],"wide,":[62],"spacing":[65],"between":[66],"two":[67,158],"adjacent":[68],"50\u03bcm.":[71],"modules":[74],"transferred":[76,103,117],"from":[77,110,141],"SOI":[78],"to":[80,112,124],"Poly":[81],"(ethylene":[82],"terephthalate)":[83],"(PET)":[84],"substrate":[85],"printing":[89],"method,":[90],"with":[91,147],"Polydimethylsiloxane":[92],"(PDMS)":[93],"as":[94],"substrate.":[96],"More":[97],"than":[98],"90%":[99],"first":[106],"step":[108,121],"(i.e.":[109,122],"PDMS)":[113],"100%":[115],"second":[120],"PDMS":[123],"PET)":[125],"has":[126],"been":[127],"achieved":[128],"this":[130],"process.":[131],"A":[132],"maximum":[133],"9.3mV":[135],"open":[136],"circuit":[137],"voltage":[138],"was":[139],"recorded":[140],"micro":[144],"prototype":[146],"temperature":[149],"difference":[150],"54":[152],"<sup":[153],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[154],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">o</sup>":[155],"C":[156],"at":[157],"ends":[159],"wires.":[162]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":2}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}