{"id":"https://openalex.org/W2087188018","doi":"https://doi.org/10.1109/essderc.2012.6343353","title":"Manufacturing aspects of an ultra-thin chip technology","display_name":"Manufacturing aspects of an ultra-thin chip technology","publication_year":2012,"publication_date":"2012-09-01","ids":{"openalex":"https://openalex.org/W2087188018","doi":"https://doi.org/10.1109/essderc.2012.6343353","mag":"2087188018"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2012.6343353","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2012.6343353","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084029663","display_name":"Evangelos A. Angelopoulos","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Evangelos A. Angelopoulos","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053612346","display_name":"Muhammad Alshahed","orcid":"https://orcid.org/0000-0003-3485-9764"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Muhammad S. Al-Shahed","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110330120","display_name":"Wolfgang Appel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Wolfgang Appel","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022610279","display_name":"Stefan Endler","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Stefan Endler","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005291448","display_name":"Saleh Ferwana","orcid":"https://orcid.org/0000-0002-5995-7283"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Saleh Ferwana","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057256675","display_name":"Christine Harendt","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christine Harendt","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006540929","display_name":"Mahadi-Ul Hassan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mahadi-Ul Hassan","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044262074","display_name":"Horst Rempp","orcid":null},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Horst Rempp","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103112746","display_name":"Martin Zimmermann","orcid":"https://orcid.org/0000-0003-2540-2893"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Zimmermann","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074267030","display_name":"Joachim N. Burghartz","orcid":"https://orcid.org/0000-0002-6013-6677"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Joachim N. Burghartz","raw_affiliation_strings":["Institute for Microelectronics, Stuttgart, Stuttgart, Germany","Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics, Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]},{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS) Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5084029663"],"corresponding_institution_ids":["https://openalex.org/I4210164948"],"apc_list":null,"apc_paid":null,"fwci":1.964,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.87530601,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"141","last_page":"144"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8164750337600708},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8026332259178162},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.628233015537262},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5803845524787903},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5675036311149597},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.5300248265266418},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.47353097796440125},{"id":"https://openalex.org/keywords/compensation","display_name":"Compensation (psychology)","score":0.46697258949279785},{"id":"https://openalex.org/keywords/oxide","display_name":"Oxide","score":0.45265406370162964},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.44726768136024475},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.41237276792526245},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22048059105873108},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20729118585586548},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.10049760341644287},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.08186033368110657}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8164750337600708},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8026332259178162},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.628233015537262},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5803845524787903},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5675036311149597},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5300248265266418},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.47353097796440125},{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.46697258949279785},{"id":"https://openalex.org/C2779851234","wikidata":"https://www.wikidata.org/wiki/Q50690","display_name":"Oxide","level":2,"score":0.45265406370162964},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.44726768136024475},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.41237276792526245},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22048059105873108},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20729118585586548},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.10049760341644287},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08186033368110657},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/essderc.2012.6343353","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2012.6343353","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.4099999964237213}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W157852784","https://openalex.org/W1512808689","https://openalex.org/W2072415377","https://openalex.org/W2118791786","https://openalex.org/W2124703837","https://openalex.org/W2138757576"],"related_works":["https://openalex.org/W1998662473","https://openalex.org/W2075391483","https://openalex.org/W2742348144","https://openalex.org/W2038820605","https://openalex.org/W2121416564","https://openalex.org/W1985417357","https://openalex.org/W2955207210","https://openalex.org/W2115053376","https://openalex.org/W2367528910","https://openalex.org/W1991489478"],"abstract_inverted_index":{"Ultra-thin":[0],"silicon":[1],"(Si)":[2],"chips":[3,54,145],"fabricated":[4],"using":[5,163],"the":[6,45,52,65,68,86,93,101,106,110,120,138],"recently":[7],"developed":[8],"Chipfilm\u2122":[9,23],"technology":[10,24],"feature":[11],"three":[12],"distinct":[13],"manufacturing":[14],"issues,":[15],"which":[16,96],"are":[17,47,77,97],"discussed":[18],"in":[19,44],"this":[20],"paper.":[21],"In":[22],"a":[25,33,125],"thin":[26,53],"Si":[27,36,40],"membrane":[28,94],"is":[29,61,135,150,157],"firmly":[30],"attached":[31],"to":[32,50,85,100,147,159],"conventional":[34],"bulk":[35,102],"wafer":[37],"by":[38,63,105],"vertical":[39],"micro-anchors":[41],"which,":[42],"however,":[43],"end":[46],"controllably":[48],"fractured":[49],"make":[51],"detachable.":[55],"The":[56],"associated":[57],"mechanical":[58],"stability":[59],"window":[60],"widened":[62],"adjusting":[64],"arrangement":[66],"of":[67,133,142],"micro-anchors,":[69],"so":[70],"that":[71],"chip":[72,111],"detachment":[73],"yields":[74],"exceeding":[75],"99%":[76],"achieved.":[78],"Another":[79],"not":[80],"yet":[81],"reported":[82],"issue":[83],"relates":[84],"process":[87],"temperature":[88,90,126],"and":[89,108,119,152],"uniformity":[91],"within":[92],"areas,":[95],"thermally":[98],"connected":[99],"substrate":[103],"only":[104,160],"anchors":[107],"at":[109],"edges":[112],"during":[113],"processing.":[114],"Using":[115],"rapid":[116],"thermal":[117],"oxidation":[118],"local":[121],"oxide":[122,130],"thickness":[123,131],"as":[124],"monitor":[127],"an":[128],"on-chip":[129],"variation":[132,156],"\u00b13%":[134],"determined.":[136],"Finally,":[137],"inherent":[139],"deformation":[140],"(warpage)":[141],"free-standing":[143],"ultra-thin":[144],"due":[146],"internal":[148],"stresses":[149],"analyzed":[151],"their":[153],"surface":[154],"height":[155],"reduced":[158],"\u00b14":[161],"\u03bcm":[162],"stress":[164],"compensation":[165],"techniques.":[166]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}