{"id":"https://openalex.org/W4308089494","doi":"https://doi.org/10.1109/esscirc55480.2022.9911398","title":"The Future of Short Reach Interconnect","display_name":"The Future of Short Reach Interconnect","publication_year":2022,"publication_date":"2022-09-19","ids":{"openalex":"https://openalex.org/W4308089494","doi":"https://doi.org/10.1109/esscirc55480.2022.9911398"},"language":"en","primary_location":{"id":"doi:10.1109/esscirc55480.2022.9911398","is_oa":false,"landing_page_url":"https://doi.org/10.1109/esscirc55480.2022.9911398","pdf_url":null,"source":{"id":"https://openalex.org/S4363608323","display_name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026887332","display_name":"Davide Tonietto","orcid":"https://orcid.org/0000-0002-7319-143X"},"institutions":[{"id":"https://openalex.org/I4210115038","display_name":"Huawei Technologies (Canada)","ror":"https://ror.org/026venb53","country_code":"CA","type":"company","lineage":["https://openalex.org/I2250955327","https://openalex.org/I4210115038"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Davide Tonietto","raw_affiliation_strings":["Huawei Technologies Canada Ltd.,Ottawa,Canada","Huawei Technologies Canada Ltd., Ottawa, Canada"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Canada Ltd.,Ottawa,Canada","institution_ids":["https://openalex.org/I4210115038"]},{"raw_affiliation_string":"Huawei Technologies Canada Ltd., Ottawa, Canada","institution_ids":["https://openalex.org/I4210115038"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5026887332"],"corresponding_institution_ids":["https://openalex.org/I4210115038"],"apc_list":null,"apc_paid":null,"fwci":0.9657,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.70397904,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7357975244522095},{"id":"https://openalex.org/keywords/optical-interconnect","display_name":"Optical interconnect","score":0.6333329677581787},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6169518232345581},{"id":"https://openalex.org/keywords/serdes","display_name":"SerDes","score":0.6123030781745911},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5841991305351257},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5683683156967163},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.519413948059082},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3893227279186249},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33379945158958435},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29818353056907654},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.293423056602478}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7357975244522095},{"id":"https://openalex.org/C2777759342","wikidata":"https://www.wikidata.org/wiki/Q7098860","display_name":"Optical interconnect","level":3,"score":0.6333329677581787},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6169518232345581},{"id":"https://openalex.org/C19707634","wikidata":"https://www.wikidata.org/wiki/Q6510662","display_name":"SerDes","level":2,"score":0.6123030781745911},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5841991305351257},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5683683156967163},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.519413948059082},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3893227279186249},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33379945158958435},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29818353056907654},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.293423056602478},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/esscirc55480.2022.9911398","is_oa":false,"landing_page_url":"https://doi.org/10.1109/esscirc55480.2022.9911398","pdf_url":null,"source":{"id":"https://openalex.org/S4363608323","display_name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8799999952316284}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2518432791","https://openalex.org/W2800106855","https://openalex.org/W2921538540","https://openalex.org/W2970690226","https://openalex.org/W2983878317","https://openalex.org/W3015421532","https://openalex.org/W3087893936","https://openalex.org/W3135215869","https://openalex.org/W3192636176","https://openalex.org/W4220690542","https://openalex.org/W4220804507","https://openalex.org/W4220990651","https://openalex.org/W6776076501","https://openalex.org/W6791170761"],"related_works":["https://openalex.org/W3029046703","https://openalex.org/W2145876553","https://openalex.org/W1989581220","https://openalex.org/W2489653725","https://openalex.org/W2376960824","https://openalex.org/W2063611292","https://openalex.org/W4308089494","https://openalex.org/W2090203567","https://openalex.org/W2115623896","https://openalex.org/W157165136"],"abstract_inverted_index":{"The":[0,121],"unprecedented":[1],"information":[2],"explosion":[3],"and":[4,11,17,52,61,73,82,91,97,117,131],"its":[5],"increasing":[6],"demands":[7],"on":[8,101],"data":[9,53],"traffic":[10],"processing":[12],"are":[13,85,99,107],"pushing":[14],"a":[15],"rapid":[16],"diverse":[18],"evolution":[19],"in":[20,42,56,64],"short":[21],"reach":[22],"interconnect":[23,60,105],"technologies.":[24],"In":[25],"the":[26,36,86,112],"background":[27],"of":[28,123],"this":[29,124,138],"race,":[30],"CMOS":[31],"technology":[32,141],"is":[33,126],"not":[34],"providing":[35],"usual":[37],"node":[38,40],"over":[39],"boost":[41],"performance":[43],"to":[44,109,111,127,135],"help":[45,136],"SerDes":[46],"developers":[47],"cope":[48],"with":[49],"higher":[50],"bandwidth":[51],"rates.":[54],"Breakthroughs":[55],"high":[57],"speed":[58],"electrical":[59],"new":[62,90],"approaches":[63],"optical":[65],"interconnect,":[66],"such":[67,94],"SiPho,":[68],"NPO":[69],"(near":[70],"package":[71],"optics)":[72,76],"CPO":[74],"(co-packaged":[75],"promise":[77],"improved":[78],"performance,":[79],"energy":[80],"efficiency":[81],"density.":[83],"What":[84],"specific":[87],"challenges":[88],"that":[89],"emerging":[92],"applications":[93],"as":[95],"AI":[96],"HPC":[98],"posing":[100],"interconnect?":[102],"How":[103],"various":[104],"technologies":[106],"going":[108],"respond":[110],"need":[113],"for":[114],"die":[115],"disaggregation":[116],"multi-die":[118],"IC":[119],"products?":[120],"focus":[122],"paper":[125],"provide":[128],"some":[129],"directions":[130],"an":[132],"underlying":[133],"logic":[134],"navigate":[137],"very":[139],"complex":[140],"landscape.":[142]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}