{"id":"https://openalex.org/W2138772892","doi":"https://doi.org/10.1109/esscir.2005.1541631","title":"Electrical measurement of alignment for 3D stacked chips","display_name":"Electrical measurement of alignment for 3D stacked chips","publication_year":2005,"publication_date":"2005-01-01","ids":{"openalex":"https://openalex.org/W2138772892","doi":"https://doi.org/10.1109/esscir.2005.1541631","mag":"2138772892"},"language":"en","primary_location":{"id":"doi:10.1109/esscir.2005.1541631","is_oa":false,"landing_page_url":"https://doi.org/10.1109/esscir.2005.1541631","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044201884","display_name":"R. Canegallo","orcid":"https://orcid.org/0000-0002-3381-0697"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"R. Canegallo","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Italy","STMicroelectronics, Agrate-Brianza, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics, Agrate-Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073943667","display_name":"M. Mirandola","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"M. Mirandola","raw_affiliation_strings":["ARCES University of Bologna, Bologna, Italy"],"affiliations":[{"raw_affiliation_string":"ARCES University of Bologna, Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091297097","display_name":"A. Fazzi","orcid":"https://orcid.org/0000-0001-5384-9962"},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"A. Fazzi","raw_affiliation_strings":["ARCES University of Bologna, Bologna, Italy"],"affiliations":[{"raw_affiliation_string":"ARCES University of Bologna, Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021451362","display_name":"L. Magagni","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Magagni","raw_affiliation_strings":["ARCES University of Bologna, Bologna, Italy"],"affiliations":[{"raw_affiliation_string":"ARCES University of Bologna, Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040667886","display_name":"R. Guerrieri","orcid":"https://orcid.org/0000-0002-8601-6884"},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"R. Guerrieri","raw_affiliation_strings":["ARCES University of Bologna, Bologna, Italy"],"affiliations":[{"raw_affiliation_string":"ARCES University of Bologna, Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5007300399","display_name":"K. Kaschlun","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Kaschlun","raw_affiliation_strings":["Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5044201884"],"corresponding_institution_ids":["https://openalex.org/I4210154781"],"apc_list":null,"apc_paid":null,"fwci":0.2468,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.61095935,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"347","last_page":"350"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.7481794357299805},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6814554333686829},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6208353638648987},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6123766899108887},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.48129621148109436},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4770059883594513},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42352113127708435},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.35034650564193726},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3446745276451111},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1728704273700714},{"id":"https://openalex.org/keywords/nuclear-magnetic-resonance","display_name":"Nuclear magnetic resonance","score":0.08393821120262146}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.7481794357299805},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6814554333686829},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6208353638648987},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6123766899108887},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48129621148109436},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4770059883594513},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42352113127708435},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.35034650564193726},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3446745276451111},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1728704273700714},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.08393821120262146}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/esscir.2005.1541631","is_oa":false,"landing_page_url":"https://doi.org/10.1109/esscir.2005.1541631","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005.","raw_type":"proceedings-article"},{"id":"pmh:oai:cris.unibo.it:11585/7903","is_oa":false,"landing_page_url":"http://hdl.handle.net/11585/7903","pdf_url":null,"source":{"id":"https://openalex.org/S4306402579","display_name":"Archivio istituzionale della ricerca (Alma Mater Studiorum Universit\u00e0 di Bologna)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210117483","host_organization_name":"Istituto di Ematologia di Bologna","host_organization_lineage":["https://openalex.org/I4210117483"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:fraunhofer.de:N-173114","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-173114.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IZM","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/350439","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/350439","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8799999952316284,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1524885163","https://openalex.org/W1551097785","https://openalex.org/W1812090578","https://openalex.org/W2166863436"],"related_works":["https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W4241625287","https://openalex.org/W2050788868","https://openalex.org/W2389800961","https://openalex.org/W1995389502"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"an":[3],"electronic":[4],"system":[5,65],"based":[6,66],"on":[7,67],"integrated":[8],"CMOS":[9,58],"capacitive":[10,71],"sensors":[11],"that":[12],"enables":[13],"to":[14,60,80],"determine":[15],"the":[16,35,62],"alignment":[17,39,64],"between":[18],"two":[19],"chips":[20],"assembled":[21],"in":[22,52],"a":[23,81,88],"three-dimensional":[24],"(3D)":[25],"stacking":[26],"configuration.":[27],"Two":[28],"different":[29],"interface":[30],"circuits":[31],"are":[32,97],"described":[33],"for":[34],"on-chip":[36],"measurement":[37],"of":[38,74,84,90],"along":[40],"vertical":[41],"Z-axis":[42],"and":[43,104],"lateral":[44],"X/Y-axis.":[45],"A":[46,70],"test":[47,61],"chip":[48],"has":[49,93],"been":[50,94],"fabricated":[51],"0.13/spl":[53],"mu/m,":[54],"6":[55],"metal":[56],"standard":[57],"process":[59],"multi-axis":[63],"3D":[68],"sensors.":[69],"charge":[72],"variation":[73],"1":[75],"fF":[76],"over":[77,87],"15fF":[78],"corresponding":[79],"resolution":[82],"accuracy":[83],"0.5/spl":[85],"mu/m":[86,92,99,103],"range":[89],"50/spl":[91],"measured.":[95],"Sensors":[96],"120/spl":[98],"/spl":[100],"times/":[101],"30/spl":[102],"power":[105],"consumption":[106],"is":[107],"200/spl":[108],"mu/W.":[109]},"counts_by_year":[{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}