{"id":"https://openalex.org/W2546812064","doi":"https://doi.org/10.1109/emccompo.2013.6735208","title":"Immunity simulation method for automotive power module using electromagnetic analysis","display_name":"Immunity simulation method for automotive power module using electromagnetic analysis","publication_year":2013,"publication_date":"2013-12-01","ids":{"openalex":"https://openalex.org/W2546812064","doi":"https://doi.org/10.1109/emccompo.2013.6735208","mag":"2546812064"},"language":"en","primary_location":{"id":"doi:10.1109/emccompo.2013.6735208","is_oa":false,"landing_page_url":"https://doi.org/10.1109/emccompo.2013.6735208","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031085745","display_name":"Yosuke Kondo","orcid":"https://orcid.org/0000-0001-6354-3270"},"institutions":[{"id":"https://openalex.org/I4210132650","display_name":"Denso (Japan)","ror":"https://ror.org/04hkpfa76","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210132650"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Yosuke Kondo","raw_affiliation_strings":["Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan"],"affiliations":[{"raw_affiliation_string":"Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan","institution_ids":["https://openalex.org/I4210132650"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008108429","display_name":"Kei Tsunada","orcid":null},"institutions":[{"id":"https://openalex.org/I4210132650","display_name":"Denso (Japan)","ror":"https://ror.org/04hkpfa76","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210132650"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kei Tsunada","raw_affiliation_strings":["Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan"],"affiliations":[{"raw_affiliation_string":"Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan","institution_ids":["https://openalex.org/I4210132650"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101066488","display_name":"Norimasa Oka","orcid":null},"institutions":[{"id":"https://openalex.org/I4210132650","display_name":"Denso (Japan)","ror":"https://ror.org/04hkpfa76","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210132650"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Norimasa Oka","raw_affiliation_strings":["Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan"],"affiliations":[{"raw_affiliation_string":"Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan","institution_ids":["https://openalex.org/I4210132650"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5035488738","display_name":"Masato Izumichi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210132650","display_name":"Denso (Japan)","ror":"https://ror.org/04hkpfa76","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210132650"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masato Izumichi","raw_affiliation_strings":["Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan"],"affiliations":[{"raw_affiliation_string":"Electronics Device Business Unit DENSO CORPORATION, Kariya, Japan","institution_ids":["https://openalex.org/I4210132650"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5031085745"],"corresponding_institution_ids":["https://openalex.org/I4210132650"],"apc_list":null,"apc_paid":null,"fwci":0.4729,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.72212223,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"243","last_page":"248"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11851","display_name":"Electromagnetic Compatibility and Measurements","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.7429516911506653},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.6474007964134216},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.6069997549057007},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.6020138263702393},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.4322047531604767},{"id":"https://openalex.org/keywords/electronic-circuit-simulation","display_name":"Electronic circuit simulation","score":0.42656394839286804},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.42111796140670776},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3919994831085205},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.374798983335495},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.345669150352478},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3291172981262207},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.28565406799316406},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.12444722652435303},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11448544263839722}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7429516911506653},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6474007964134216},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.6069997549057007},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.6020138263702393},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.4322047531604767},{"id":"https://openalex.org/C46205389","wikidata":"https://www.wikidata.org/wiki/Q1270401","display_name":"Electronic circuit simulation","level":3,"score":0.42656394839286804},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.42111796140670776},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3919994831085205},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.374798983335495},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.345669150352478},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3291172981262207},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.28565406799316406},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.12444722652435303},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11448544263839722},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/emccompo.2013.6735208","is_oa":false,"landing_page_url":"https://doi.org/10.1109/emccompo.2013.6735208","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/16","score":0.6600000262260437,"display_name":"Peace, Justice and strong institutions"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1512679175","https://openalex.org/W2123745214","https://openalex.org/W2125080123","https://openalex.org/W2746395757","https://openalex.org/W6743345474"],"related_works":["https://openalex.org/W2520095274","https://openalex.org/W1585883623","https://openalex.org/W4387120501","https://openalex.org/W4390244953","https://openalex.org/W2899194221","https://openalex.org/W2548709385","https://openalex.org/W2119000671","https://openalex.org/W2099918449","https://openalex.org/W2196564664","https://openalex.org/W4394789737"],"abstract_inverted_index":{"This":[0],"paper":[1],"provides":[2],"an":[3,24],"immunity":[4],"simulation":[5],"method":[6,26],"for":[7,27,110,128],"product-level":[8,117],"automotive":[9],"power":[10,38,112,130],"modules":[11],"that":[12],"contain":[13],"printed":[14],"circuit":[15,65,73],"boards":[16],"(PCBs).":[17],"A":[18],"stress-strength":[19],"model":[20],"is":[21,32,47,66,74],"adopted":[22],"as":[23],"estimation":[25],"the":[28,33,36,45,48,53,60,63,71,77,83,88,91,103,107,125,129],"susceptibility.":[29],"The":[30,68,97],"stress":[31,50,61,84],"value":[34],"of":[35,52,62,70,87],"RF":[37],"injected":[39],"into":[40],"a":[41,111,115,121],"victim":[42,54,64,72,89],"circuit,":[43,90],"and":[44,85,119],"strength":[46,69,86],"acceptance":[49],"criteria":[51],"circuit.":[55],"By":[56,81],"using":[57],"electromagnetic":[58],"simulation,":[59],"calculated.":[67],"determined":[75],"by":[76],"DPI":[78,108],"test":[79,109,127],"result.":[80],"comparing":[82],"susceptibility":[92],"thresholds":[93],"can":[94],"be":[95],"predicted.":[96],"results":[98,105],"show":[99],"good":[100,122],"agreement":[101],"with":[102,124],"experimental":[104],"in":[106],"module":[113],"containing":[114],"complex":[116],"PCB":[118],"exhibit":[120],"correlation":[123],"BCI":[126],"module.":[131]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2015,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}