{"id":"https://openalex.org/W2532724619","doi":"https://doi.org/10.1109/emccompo.2013.6735170","title":"Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator","display_name":"Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator","publication_year":2013,"publication_date":"2013-12-01","ids":{"openalex":"https://openalex.org/W2532724619","doi":"https://doi.org/10.1109/emccompo.2013.6735170","mag":"2532724619"},"language":"en","primary_location":{"id":"doi:10.1109/emccompo.2013.6735170","is_oa":false,"landing_page_url":"https://doi.org/10.1109/emccompo.2013.6735170","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074135131","display_name":"Naoya Azuma","orcid":null},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"N. Azuma","raw_affiliation_strings":["Graduate School of System Informatics, Kobe Univ., Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe Univ., Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011574865","display_name":"S. Shimazaki","orcid":null},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Shimazaki","raw_affiliation_strings":["Graduate School of System Informatics, Kobe Univ., Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe Univ., Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032938283","display_name":"Noriyuki Miura","orcid":"https://orcid.org/0000-0002-0072-6114"},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"N. Miura","raw_affiliation_strings":["Graduate School of System Informatics, Kobe Univ., Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe Univ., Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070370721","display_name":"Makoto Nagata","orcid":"https://orcid.org/0000-0002-0625-9107"},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Nagata","raw_affiliation_strings":["Graduate School of System Informatics, Kobe Univ., Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe Univ., Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110400365","display_name":"Takuya Kitamura","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Kitamura","raw_affiliation_strings":["Renesas Mobile Corp., Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Mobile Corp., Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050010293","display_name":"Satoru Takahashi","orcid":"https://orcid.org/0000-0002-6555-9409"},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Takahashi","raw_affiliation_strings":["Renesas Mobile Corp., Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Mobile Corp., Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005213477","display_name":"M. Murakami","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Murakami","raw_affiliation_strings":["Renesas Electronics Corp., Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics Corp., Kawasaki, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066943092","display_name":"K. Hori","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Hori","raw_affiliation_strings":["Renesas Electronics Corp., Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics Corp., Kawasaki, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018620798","display_name":"Atsushi Nakamura","orcid":"https://orcid.org/0000-0003-0788-2221"},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"A. Nakamura","raw_affiliation_strings":["Renesas Electronics Corp., Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics Corp., Kawasaki, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113959245","display_name":"Kenta Tsukamoto","orcid":null},"institutions":[{"id":"https://openalex.org/I118347220","display_name":"NEC (Japan)","ror":"https://ror.org/04jndar25","country_code":"JP","type":"company","lineage":["https://openalex.org/I118347220"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Tsukamoto","raw_affiliation_strings":["NEC Corporation, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"NEC Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I118347220"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085235913","display_name":"M. Iwanami","orcid":null},"institutions":[{"id":"https://openalex.org/I118347220","display_name":"NEC (Japan)","ror":"https://ror.org/04jndar25","country_code":"JP","type":"company","lineage":["https://openalex.org/I118347220"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Iwanami","raw_affiliation_strings":["NEC Corporation, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"NEC Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I118347220"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046239956","display_name":"Eiji Hankui","orcid":null},"institutions":[{"id":"https://openalex.org/I118347220","display_name":"NEC (Japan)","ror":"https://ror.org/04jndar25","country_code":"JP","type":"company","lineage":["https://openalex.org/I118347220"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"E. Hankui","raw_affiliation_strings":["NEC Corporation, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"NEC Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I118347220"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002936511","display_name":"Sho Muroga","orcid":"https://orcid.org/0000-0003-0567-4752"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Muroga","raw_affiliation_strings":["Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051751580","display_name":"Yasushi Endo","orcid":"https://orcid.org/0000-0002-7813-7977"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y. Endo","raw_affiliation_strings":["Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003140792","display_name":"Satoshi Tanaka","orcid":"https://orcid.org/0000-0003-2720-775X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Tanaka","raw_affiliation_strings":["Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077884354","display_name":"Masahiro Yamaguchi","orcid":"https://orcid.org/0000-0002-3601-7619"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Yamaguchi","raw_affiliation_strings":["Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":16,"corresponding_author_ids":["https://openalex.org/A5074135131"],"corresponding_institution_ids":["https://openalex.org/I65837984"],"apc_list":null,"apc_paid":null,"fwci":2.3645,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.89978551,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"42","last_page":"46"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/substrate-coupling","display_name":"Substrate coupling","score":0.79506516456604},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6543593406677246},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5633981227874756},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5373998880386353},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.47873160243034363},{"id":"https://openalex.org/keywords/noise-temperature","display_name":"Noise temperature","score":0.4606488049030304},{"id":"https://openalex.org/keywords/flicker-noise","display_name":"Flicker noise","score":0.4592691659927368},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.45119261741638184},{"id":"https://openalex.org/keywords/noise-figure","display_name":"Noise figure","score":0.45053809881210327},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4399282932281494},{"id":"https://openalex.org/keywords/low-noise-amplifier","display_name":"Low-noise amplifier","score":0.426789790391922},{"id":"https://openalex.org/keywords/noise-generator","display_name":"Noise generator","score":0.4250553548336029},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41419315338134766},{"id":"https://openalex.org/keywords/phase-noise","display_name":"Phase noise","score":0.3270278573036194},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2713627517223358},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.22613409161567688},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.18019339442253113}],"concepts":[{"id":"https://openalex.org/C51674796","wikidata":"https://www.wikidata.org/wiki/Q7632167","display_name":"Substrate coupling","level":4,"score":0.79506516456604},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6543593406677246},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5633981227874756},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5373998880386353},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.47873160243034363},{"id":"https://openalex.org/C52660251","wikidata":"https://www.wikidata.org/wiki/Q17083145","display_name":"Noise temperature","level":3,"score":0.4606488049030304},{"id":"https://openalex.org/C113873419","wikidata":"https://www.wikidata.org/wiki/Q1410810","display_name":"Flicker noise","level":5,"score":0.4592691659927368},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.45119261741638184},{"id":"https://openalex.org/C112806910","wikidata":"https://www.wikidata.org/wiki/Q746825","display_name":"Noise figure","level":4,"score":0.45053809881210327},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4399282932281494},{"id":"https://openalex.org/C155332784","wikidata":"https://www.wikidata.org/wiki/Q1151304","display_name":"Low-noise amplifier","level":4,"score":0.426789790391922},{"id":"https://openalex.org/C74342258","wikidata":"https://www.wikidata.org/wiki/Q2133526","display_name":"Noise generator","level":5,"score":0.4250553548336029},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41419315338134766},{"id":"https://openalex.org/C89631360","wikidata":"https://www.wikidata.org/wiki/Q1428766","display_name":"Phase noise","level":2,"score":0.3270278573036194},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2713627517223358},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.22613409161567688},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.18019339442253113},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/emccompo.2013.6735170","is_oa":false,"landing_page_url":"https://doi.org/10.1109/emccompo.2013.6735170","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5899999737739563,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320325628","display_name":"Ministry of Internal Affairs and Communications","ror":"https://ror.org/00vs1pz50"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1490674876","https://openalex.org/W1520187900","https://openalex.org/W2062664760","https://openalex.org/W2170046261","https://openalex.org/W2180333551"],"related_works":["https://openalex.org/W4236509694","https://openalex.org/W3021392142","https://openalex.org/W2134436426","https://openalex.org/W1973248898","https://openalex.org/W286594222","https://openalex.org/W4243333603","https://openalex.org/W2014396867","https://openalex.org/W3150676548","https://openalex.org/W2115379395","https://openalex.org/W2107607160"],"abstract_inverted_index":{"Substrate":[0],"noise":[1,40,49,58,70,77,97,115],"coupling":[2,41],"in":[3,26,78,120],"RF":[4,67],"receiver":[5],"front":[6],"end":[7],"circuitry":[8],"for":[9],"LTE":[10],"wireless":[11],"communication":[12,122],"was":[13],"examined":[14],"by":[15],"full-chip":[16,37],"level":[17,38],"simulation":[18,34,65],"and":[19,81,88],"on-chip":[20],"measurements,":[21],"with":[22,52,84,90],"a":[23,27,43,53,79],"demonstrator":[24],"built":[25],"65":[28],"nm":[29],"CMOS":[30,114],"technology.":[31],"A":[32],"complete":[33],"flow":[35],"of":[36,57,66,75,95,105,112],"substrate":[39,48,76,96],"uses":[42],"decoupled":[44],"modeling":[45],"approach,":[46],"where":[47],"waveforms":[50],"drawn":[51],"unified":[54],"package-chip":[55],"model":[56],"source":[59],"circuits":[60],"are":[61,86],"given":[62],"to":[63],"mixed-level":[64],"chains":[68],"as":[69],"sensitive":[71],"circuits.":[72],"The":[73,93],"distribution":[74],"chip":[80],"the":[82,91,99,109,113,121],"attenuation":[83],"distance":[85],"simulated":[87],"compare":[89],"measurements.":[92],"interference":[94],"at":[98,124],"17":[100],"<sup":[101],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[102],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">th</sup>":[103],"harmonics":[104],"124.8":[106],"MHz":[107],"-":[108],"operating":[110],"frequency":[111],"emulator":[116],"creates":[117],"spurious":[118],"tones":[119],"bandwidth":[123],"2.1":[125],"GHz.":[126]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}