{"id":"https://openalex.org/W2899111490","doi":"https://doi.org/10.1109/embc.2018.8513272","title":"Hermetic packaging for implantable microsystems: Effectiveness of sequentially electroplated AuSn alloy","display_name":"Hermetic packaging for implantable microsystems: Effectiveness of sequentially electroplated AuSn alloy","publication_year":2018,"publication_date":"2018-07-01","ids":{"openalex":"https://openalex.org/W2899111490","doi":"https://doi.org/10.1109/embc.2018.8513272","mag":"2899111490","pmid":"https://pubmed.ncbi.nlm.nih.gov/30441204"},"language":"en","primary_location":{"id":"doi:10.1109/embc.2018.8513272","is_oa":false,"landing_page_url":"https://doi.org/10.1109/embc.2018.8513272","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024609809","display_name":"Katarzyna M. Szostak","orcid":"https://orcid.org/0000-0002-9565-6816"},"institutions":[{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Katarzyna M. Szostak","raw_affiliation_strings":["Imperial College London, London, London, GB"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imperial College London, London, London, GB","institution_ids":["https://openalex.org/I47508984"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017596402","display_name":"Timothy G. Constandinou","orcid":"https://orcid.org/0000-0001-9778-1162"},"institutions":[{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Timothy G. Constandinou","raw_affiliation_strings":["Imperial College London, London, London, GB"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imperial College London, London, London, GB","institution_ids":["https://openalex.org/I47508984"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I47508984"],"apc_list":null,"apc_paid":null,"fwci":0.5304,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.59486748,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"2018","issue":null,"first_page":"3849","last_page":"3853"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6501729488372803},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.6149595975875854},{"id":"https://openalex.org/keywords/eutectic-bonding","display_name":"Eutectic bonding","score":0.5014736652374268},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.4962614178657532},{"id":"https://openalex.org/keywords/microsystem","display_name":"Microsystem","score":0.47302794456481934},{"id":"https://openalex.org/keywords/eutectic-system","display_name":"Eutectic system","score":0.4721275269985199},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4633384943008423},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.443063348531723},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3380581736564636},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.286179780960083},{"id":"https://openalex.org/keywords/alloy","display_name":"Alloy","score":0.247505784034729},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1781761348247528},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17496326565742493},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.09954172372817993},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.092623770236969}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6501729488372803},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.6149595975875854},{"id":"https://openalex.org/C37487178","wikidata":"https://www.wikidata.org/wiki/Q5414402","display_name":"Eutectic bonding","level":4,"score":0.5014736652374268},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4962614178657532},{"id":"https://openalex.org/C151054161","wikidata":"https://www.wikidata.org/wiki/Q379385","display_name":"Microsystem","level":2,"score":0.47302794456481934},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.4721275269985199},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4633384943008423},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.443063348531723},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3380581736564636},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.286179780960083},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.247505784034729},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1781761348247528},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17496326565742493},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.09954172372817993},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.092623770236969}],"mesh":[{"descriptor_ui":"D000497","descriptor_name":"Alloys","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D000497","descriptor_name":"Alloys","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D000497","descriptor_name":"Alloys","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004349","descriptor_name":"Drug Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004349","descriptor_name":"Drug Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004349","descriptor_name":"Drug Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006046","descriptor_name":"Gold","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006046","descriptor_name":"Gold","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006046","descriptor_name":"Gold","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014001","descriptor_name":"Tin","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014001","descriptor_name":"Tin","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014001","descriptor_name":"Tin","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019064","descriptor_name":"Product Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019064","descriptor_name":"Product Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019064","descriptor_name":"Product Packaging","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D055616","descriptor_name":"Microtechnology","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055616","descriptor_name":"Microtechnology","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D055616","descriptor_name":"Microtechnology","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false}],"locations_count":3,"locations":[{"id":"doi:10.1109/embc.2018.8513272","is_oa":false,"landing_page_url":"https://doi.org/10.1109/embc.2018.8513272","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)","raw_type":"proceedings-article"},{"id":"pmid:30441204","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/30441204","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference","raw_type":null},{"id":"pmh:oai:spiral.imperial.ac.uk:10044/1/58747","is_oa":false,"landing_page_url":"http://hdl.handle.net/10044/1/58747","pdf_url":null,"source":{"id":"https://openalex.org/S4306401396","display_name":"Spiral (Imperial College London)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I47508984","host_organization_name":"Imperial College London","host_organization_lineage":["https://openalex.org/I47508984"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)","raw_type":"Conference Paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1170537370","display_name":null,"funder_award_id":"102037/Z/13/Z","funder_id":"https://openalex.org/F4320311904","funder_display_name":"Wellcome Trust"},{"id":"https://openalex.org/G2232561414","display_name":"Empowering Next Generation Implantable Neural Interfaces","funder_award_id":"EP/M020975/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G5134990810","display_name":"Application for Strategic Equipment: Wafer Bonder at LCN","funder_award_id":"EP/K02454X/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G6287538826","display_name":null,"funder_award_id":"EP/K02454X/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G6855896970","display_name":null,"funder_award_id":"EP/M020975/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"}],"funders":[{"id":"https://openalex.org/F4320311904","display_name":"Wellcome Trust","ror":"https://ror.org/029chgv08"},{"id":"https://openalex.org/F4320334627","display_name":"Engineering and Physical Sciences Research Council","ror":"https://ror.org/0439y7842"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1987796903","https://openalex.org/W1993982884","https://openalex.org/W2005502092","https://openalex.org/W2036082632","https://openalex.org/W2146797484","https://openalex.org/W2162637911","https://openalex.org/W2166722928","https://openalex.org/W2482664618","https://openalex.org/W2744736738","https://openalex.org/W2767894500","https://openalex.org/W2775133029"],"related_works":["https://openalex.org/W1988460209","https://openalex.org/W1495423923","https://openalex.org/W2005078723","https://openalex.org/W2289396372","https://openalex.org/W2884343688","https://openalex.org/W2377074248","https://openalex.org/W4245910120","https://openalex.org/W2089788581","https://openalex.org/W2159935278","https://openalex.org/W2387275654"],"abstract_inverted_index":{"With":[0],"modern":[1],"microtechnology,":[2],"there":[3],"is":[4,21,75],"an":[5,12],"aggressive":[6],"miniaturization":[7],"of":[8,15,64,83,91,115,149,156,163],"smart":[9],"devices,":[10,57],"despite":[11],"increasing":[13],"level":[14],"integration":[16,90],"and":[17,93,110,139,152],"overall":[18],"complexity.":[19],"It":[20],"therefore":[22,86],"becoming":[23],"increasingly":[24],"important":[25],"to":[26,47],"be":[27,78],"achieve":[28,69],"reliable,":[29],"compact":[30,66],"packaging.":[31],"For":[32,55],"implantable":[33],"medical":[34],"devices":[35],"(IMDs),":[36],"the":[37,49,52,62,89,131,161],"package":[38],"must":[39],"additionally":[40],"provide":[41],"a":[42,99],"high":[43],"quality":[44],"hermetic":[45,164],"environment":[46],"protect":[48],"device":[50],"from":[51],"human":[53],"body.":[54],"chip-scale":[56],"AuSn":[58,150],"eutectic":[59,132,165],"bonding":[60],"offers":[61],"possibility":[63],"forming":[65],"seals":[67,118],"that":[68],"ultra-low":[70],"permeability.":[71],"A":[72],"key":[73],"feature":[74],"this":[76,122,124],"can":[77],"achieved":[79],"at":[80],"process":[81,140,159],"temperatures":[82],"below":[84],"350315\u00b0C,":[85],"allowing":[87],"for":[88,160],"sensors":[92],"microsystems":[94],"with":[95],"CMOS":[96],"electronics":[97],"within":[98],"single":[100],"package.":[101],"Issues":[102],"however":[103],"such":[104],"as":[105],"solder":[106],"wetting,":[107],"void":[108],"formation":[109,114,162],"controlling":[111,146],"composition":[112],"make":[113],"high-quality":[116],"repeatable":[117],"highly":[119],"challenging.":[120],"Towards":[121],"aim,":[123],"paper":[125],"presents":[126],"our":[127,137,143],"experimental":[128],"work":[129],"characterizing":[130],"stack":[133],"deposition.":[134],"We":[135],"detail":[136],"designmethods":[138],"flow,":[141],"share":[142],"experiences":[144],"in":[145],"electrochemical":[147],"deposition":[148],"alloy":[151],"finally":[153],"discuss":[154],"usability":[155],"sequential":[157],"electroplating":[158],"bonds.":[166]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}