{"id":"https://openalex.org/W4280509923","doi":"https://doi.org/10.1109/educon52537.2022.9766647","title":"Formation of Skill standards for Printed Circuit Board Assembly Inspection by Define-Measure-Analyze- Improve-Control method","display_name":"Formation of Skill standards for Printed Circuit Board Assembly Inspection by Define-Measure-Analyze- Improve-Control method","publication_year":2022,"publication_date":"2022-03-28","ids":{"openalex":"https://openalex.org/W4280509923","doi":"https://doi.org/10.1109/educon52537.2022.9766647"},"language":"en","primary_location":{"id":"doi:10.1109/educon52537.2022.9766647","is_oa":false,"landing_page_url":"https://doi.org/10.1109/educon52537.2022.9766647","pdf_url":null,"source":{"id":"https://openalex.org/S4363607828","display_name":"2022 IEEE Global Engineering Education Conference (EDUCON)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Global Engineering Education Conference (EDUCON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007963813","display_name":"Wararuk Saimsakul","orcid":null},"institutions":[{"id":"https://openalex.org/I60837268","display_name":"King Mongkut's University of Technology Thonburi","ror":"https://ror.org/0057ax056","country_code":"TH","type":"education","lineage":["https://openalex.org/I60837268"]}],"countries":["TH"],"is_corresponding":false,"raw_author_name":"Wararuk Saimsakul","raw_affiliation_strings":["King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand","s University of Technology Thonburi, Bangkok, Thailand"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand","institution_ids":["https://openalex.org/I60837268"]},{"raw_affiliation_string":"s University of Technology Thonburi, Bangkok, Thailand","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5034292644","display_name":"Komkrit Chomsuwan","orcid":"https://orcid.org/0009-0008-6651-9418"},"institutions":[{"id":"https://openalex.org/I60837268","display_name":"King Mongkut's University of Technology Thonburi","ror":"https://ror.org/0057ax056","country_code":"TH","type":"education","lineage":["https://openalex.org/I60837268"]}],"countries":["TH"],"is_corresponding":false,"raw_author_name":"Komkrit Chomsuwan","raw_affiliation_strings":["King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand","s University of Technology Thonburi, Bangkok, Thailand"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand","institution_ids":["https://openalex.org/I60837268"]},{"raw_affiliation_string":"s University of Technology Thonburi, Bangkok, Thailand","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I60837268"],"apc_list":null,"apc_paid":null,"fwci":0.8812,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.67777778,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":"3","issue":null,"first_page":"1291","last_page":"1295"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13706","display_name":"Management and Optimization Techniques","score":0.9677000045776367,"subfield":{"id":"https://openalex.org/subfields/1408","display_name":"Strategy and Management"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},"topics":[{"id":"https://openalex.org/T13706","display_name":"Management and Optimization Techniques","score":0.9677000045776367,"subfield":{"id":"https://openalex.org/subfields/1408","display_name":"Strategy and Management"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T10164","display_name":"Quality and Supply Management","score":0.960099995136261,"subfield":{"id":"https://openalex.org/subfields/1404","display_name":"Management Information Systems"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T13164","display_name":"Quality and Management Systems","score":0.9369999766349792,"subfield":{"id":"https://openalex.org/subfields/1408","display_name":"Strategy and Management"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dmaic","display_name":"DMAIC","score":0.9120755791664124},{"id":"https://openalex.org/keywords/six-sigma","display_name":"Six Sigma","score":0.6814237833023071},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5538121461868286},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5392282605171204},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.5174444317817688},{"id":"https://openalex.org/keywords/control","display_name":"Control (management)","score":0.51466304063797},{"id":"https://openalex.org/keywords/measure","display_name":"Measure (data warehouse)","score":0.5113324522972107},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.509428083896637},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.4973454773426056},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.469819575548172},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31934213638305664},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.15957236289978027},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.1160602867603302},{"id":"https://openalex.org/keywords/lean-manufacturing","display_name":"Lean manufacturing","score":0.07864871621131897}],"concepts":[{"id":"https://openalex.org/C205400985","wikidata":"https://www.wikidata.org/wiki/Q380179","display_name":"DMAIC","level":4,"score":0.9120755791664124},{"id":"https://openalex.org/C23119410","wikidata":"https://www.wikidata.org/wiki/Q236908","display_name":"Six Sigma","level":3,"score":0.6814237833023071},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5538121461868286},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5392282605171204},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.5174444317817688},{"id":"https://openalex.org/C2775924081","wikidata":"https://www.wikidata.org/wiki/Q55608371","display_name":"Control (management)","level":2,"score":0.51466304063797},{"id":"https://openalex.org/C2780009758","wikidata":"https://www.wikidata.org/wiki/Q6804172","display_name":"Measure (data warehouse)","level":2,"score":0.5113324522972107},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.509428083896637},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.4973454773426056},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.469819575548172},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31934213638305664},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.15957236289978027},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1160602867603302},{"id":"https://openalex.org/C137335462","wikidata":"https://www.wikidata.org/wiki/Q380772","display_name":"Lean manufacturing","level":2,"score":0.07864871621131897},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/educon52537.2022.9766647","is_oa":false,"landing_page_url":"https://doi.org/10.1109/educon52537.2022.9766647","pdf_url":null,"source":{"id":"https://openalex.org/S4363607828","display_name":"2022 IEEE Global Engineering Education Conference (EDUCON)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Global Engineering Education Conference (EDUCON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"id":"https://metadata.un.org/sdg/8","display_name":"Decent work and economic growth"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320337495","display_name":"Technology Development","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2945210869","https://openalex.org/W3041555586"],"related_works":["https://openalex.org/W2757064773","https://openalex.org/W1584919102","https://openalex.org/W1969848021","https://openalex.org/W2046319294","https://openalex.org/W2259171508","https://openalex.org/W2075656146","https://openalex.org/W4243556880","https://openalex.org/W1973251412","https://openalex.org/W2790529218","https://openalex.org/W2801437856"],"abstract_inverted_index":{"In":[0,132],"printed":[1],"circuit":[2],"board":[3],"assembly":[4],"(PCBA)":[5],"process,":[6],"quality":[7,30,48],"control":[8,31],"is":[9,24,36,82,88],"critical":[10],"for":[11,91,189],"reduction":[12,65],"of":[13,17,66,106,111,140,157,173,180],"customer":[14],"feedback":[15],"and":[16,34,44,73,116,128,163],"waste":[18],"form":[19],"product":[20,150],"rejection.":[21],"Therefore,":[22,118],"it":[23,153],"very":[25],"important":[26],"to":[27,38,55,64,75,124,134,154,171,192],"ensure":[28],"the":[29,83,102,148,178],"(QC)":[32],"process":[33,92,104],"this":[35,181],"lead":[37],"often":[39],"required":[40],"QC":[41,158],"employee":[42,77,119],"training":[43],"expertise":[45],"in":[46,59,62],"PCBA":[47,60,175,196],"control.":[49],"This":[50],"research":[51],"applied":[52],"Define-Measure-Analyze-Improve-Control":[53],"(DMAIC)":[54],"establish":[56],"skill":[57,95,136,161],"standards":[58],"inspection":[61,67,147,168],"order":[63,133],"errors.":[68],"Skill":[69],"matrix":[70,96,162],"was":[71,98],"created":[72],"used":[74,90,185],"identify":[76],"performance.":[78],"The":[79],"DMAIC":[80,103],"methodology":[81],"Six":[84],"Sigma":[85],"tools":[86],"which":[87,109],"usually":[89],"improvement.":[93],"And":[94],"creation":[97],"done":[99],"by":[100,145],"applying":[101],"composed":[105],"five":[107],"steps,":[108],"are":[110],"Define,":[112],"Measure,":[113],"Analysis,":[114],"Improve":[115],"Control.":[117],"performance":[120,130,139,195],"can":[121,183],"be":[122,184],"categorized":[123],"3":[125],"competency":[126],"groups":[127],"4":[129],"levels.":[131],"verify":[135],"matrix,":[137],"working":[138],"employees":[141,159,190],"were":[142],"followed":[143],"up":[144],"sampling":[146],"finished":[149],"before":[151],"transferring":[152],"customer.":[155],"Mapping":[156],"into":[160],"organizing":[164],"them":[165],"on":[166],"suitable":[167],"section":[169],"effects":[170],"reduce":[172],"incorrect":[174],"inspection.":[176,197],"Furthermore,":[177],"findings":[179],"study":[182],"as":[186],"a":[187],"guideline":[188],"development":[191],"obtained":[193],"high":[194]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}