{"id":"https://openalex.org/W2889501180","doi":"https://doi.org/10.1109/ecoc.2018.8535123","title":"3D-Printed Optics for Wafer-Scale Probing","display_name":"3D-Printed Optics for Wafer-Scale Probing","publication_year":2018,"publication_date":"2018-09-01","ids":{"openalex":"https://openalex.org/W2889501180","doi":"https://doi.org/10.1109/ecoc.2018.8535123","mag":"2889501180"},"language":"en","primary_location":{"id":"doi:10.1109/ecoc.2018.8535123","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ecoc.2018.8535123","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 European Conference on Optical Communication (ECOC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072366855","display_name":"Mareike Trappen","orcid":null},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Mareike Trappen","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077985614","display_name":"Matthias Blaicher","orcid":null},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Matthias Blaicher","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110573995","display_name":"Philipp\u2010Immanuel Dietrich","orcid":null},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Philipp-Immanuel Dietrich","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023539628","display_name":"T. Hoose","orcid":null},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tobias Hoose","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062724166","display_name":"Yilin Xu","orcid":"https://orcid.org/0000-0002-2991-9198"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Yilin Xu","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112364116","display_name":"Muhammad Rodlin Billah","orcid":"https://orcid.org/0000-0003-1814-8882"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Muhammad Rodlin Billah","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031186156","display_name":"W. Freude","orcid":"https://orcid.org/0000-0002-8797-7687"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Wolfgang Freude","raw_affiliation_strings":["Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany"],"affiliations":[{"raw_affiliation_string":"Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5026468546","display_name":"C. Koos","orcid":"https://orcid.org/0000-0003-2690-0691"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christian Koos","raw_affiliation_strings":["Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Germany","institution_ids":["https://openalex.org/I102335020"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5072366855"],"corresponding_institution_ids":["https://openalex.org/I102335020"],"apc_list":null,"apc_paid":null,"fwci":0.1288,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.48149972,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.7797099351882935},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7284029722213745},{"id":"https://openalex.org/keywords/nanophotonics","display_name":"Nanophotonics","score":0.7168748378753662},{"id":"https://openalex.org/keywords/photonics","display_name":"Photonics","score":0.6540780067443848},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5874081254005432},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.5387170910835266},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5272347331047058},{"id":"https://openalex.org/keywords/integrated-optics","display_name":"Integrated optics","score":0.5111923813819885},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4892983138561249},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.4869998097419739},{"id":"https://openalex.org/keywords/photonic-integrated-circuit","display_name":"Photonic integrated circuit","score":0.4757908582687378},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.45753979682922363},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4261184632778168},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.41798219084739685},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3683249354362488},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.3682137727737427},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19851231575012207},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.19714614748954773},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.16968879103660583},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13607171177864075}],"concepts":[{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.7797099351882935},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7284029722213745},{"id":"https://openalex.org/C27289702","wikidata":"https://www.wikidata.org/wiki/Q2475861","display_name":"Nanophotonics","level":2,"score":0.7168748378753662},{"id":"https://openalex.org/C20788544","wikidata":"https://www.wikidata.org/wiki/Q467054","display_name":"Photonics","level":2,"score":0.6540780067443848},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5874081254005432},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.5387170910835266},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5272347331047058},{"id":"https://openalex.org/C2984692560","wikidata":"https://www.wikidata.org/wiki/Q523846","display_name":"Integrated optics","level":2,"score":0.5111923813819885},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4892983138561249},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.4869998097419739},{"id":"https://openalex.org/C22799297","wikidata":"https://www.wikidata.org/wiki/Q523846","display_name":"Photonic integrated circuit","level":3,"score":0.4757908582687378},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.45753979682922363},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4261184632778168},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.41798219084739685},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3683249354362488},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3682137727737427},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19851231575012207},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.19714614748954773},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16968879103660583},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13607171177864075},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ecoc.2018.8535123","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ecoc.2018.8535123","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 European Conference on Optical Communication (ECOC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322014","display_name":"Ministry of Food and Drug Safety","ror":"https://ror.org/01f7dp456"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2082149954","https://openalex.org/W2147205998","https://openalex.org/W2147608639","https://openalex.org/W2152607426","https://openalex.org/W2468172470","https://openalex.org/W2562098796","https://openalex.org/W2793218304","https://openalex.org/W2963245459"],"related_works":["https://openalex.org/W2047908229","https://openalex.org/W2511954106","https://openalex.org/W2898757829","https://openalex.org/W3158695919","https://openalex.org/W1974215384","https://openalex.org/W2560651747","https://openalex.org/W2315640387","https://openalex.org/W1863397725","https://openalex.org/W1919231054","https://openalex.org/W2165734044"],"abstract_inverted_index":{"Mass":[0],"production":[1],"of":[2,23,28],"photonic":[3],"integrated":[4],"circuits":[5],"requires":[6],"high-throughput":[7],"wafer-level":[8],"testing.":[9],"We":[10],"demonstrate":[11],"that":[12],"optical":[13],"probes":[14],"equipped":[15],"with":[16],"3D-printed":[17],"elements":[18],"allow":[19],"for":[20],"efficient":[21],"coupling":[22],"light":[24],"to":[25,36],"etched":[26],"facets":[27],"nanophotonic":[29],"waveguides.":[30],"The":[31],"technique":[32],"is":[33],"widely":[34],"applicable":[35],"different":[37],"integration":[38],"platforms.":[39]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}