{"id":"https://openalex.org/W2155110193","doi":"https://doi.org/10.1109/ecctd.2011.6043358","title":"Recent research in analog placement considering thermal gradient","display_name":"Recent research in analog placement considering thermal gradient","publication_year":2011,"publication_date":"2011-08-01","ids":{"openalex":"https://openalex.org/W2155110193","doi":"https://doi.org/10.1109/ecctd.2011.6043358","mag":"2155110193"},"language":"en","primary_location":{"id":"doi:10.1109/ecctd.2011.6043358","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ecctd.2011.6043358","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 20th European Conference on Circuit Theory and Design (ECCTD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020643571","display_name":"Mark Po-Hung Lin","orcid":"https://orcid.org/0000-0003-2292-2308"},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Mark Po-Hung Lin","raw_affiliation_strings":["Department of Electrical Engineering, National Chung Cheng University, Chiayi, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Chung Cheng University, Chiayi, Taiwan","institution_ids":["https://openalex.org/I148099254"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5020643571"],"corresponding_institution_ids":["https://openalex.org/I148099254"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.25607242,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"220","issue":null,"first_page":"349","last_page":"352"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.7342142462730408},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"Temperature gradient","score":0.5531953573226929},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5240400433540344},{"id":"https://openalex.org/keywords/analogue-electronics","display_name":"Analogue electronics","score":0.4798135757446289},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.47078365087509155},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4665662348270416},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40749573707580566},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.34753626585006714},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3050681948661804},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18358004093170166},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10789629817008972},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0732596218585968}],"concepts":[{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.7342142462730408},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.5531953573226929},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5240400433540344},{"id":"https://openalex.org/C29074008","wikidata":"https://www.wikidata.org/wiki/Q174925","display_name":"Analogue electronics","level":3,"score":0.4798135757446289},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.47078365087509155},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4665662348270416},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40749573707580566},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.34753626585006714},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3050681948661804},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18358004093170166},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10789629817008972},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0732596218585968},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ecctd.2011.6043358","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ecctd.2011.6043358","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 20th European Conference on Circuit Theory and Design (ECCTD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320323900","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95"},{"id":"https://openalex.org/F4320332222","display_name":"University of Illinois at Urbana-Champaign","ror":"https://ror.org/047426m28"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W100767074","https://openalex.org/W560265616","https://openalex.org/W1512408618","https://openalex.org/W1555778358","https://openalex.org/W1566907904","https://openalex.org/W1974278299","https://openalex.org/W1995053109","https://openalex.org/W2015090561","https://openalex.org/W2024060531","https://openalex.org/W2042419182","https://openalex.org/W2099508120","https://openalex.org/W2115311846","https://openalex.org/W2117754533","https://openalex.org/W2127012874","https://openalex.org/W2127708750","https://openalex.org/W2135511173","https://openalex.org/W2148495153","https://openalex.org/W2165288609","https://openalex.org/W4242842879","https://openalex.org/W6630766465","https://openalex.org/W6677049116","https://openalex.org/W6677366507","https://openalex.org/W6678589545"],"related_works":["https://openalex.org/W613678788","https://openalex.org/W2376025746","https://openalex.org/W2079520963","https://openalex.org/W1995476798","https://openalex.org/W1997916620","https://openalex.org/W4323318772","https://openalex.org/W4401446308","https://openalex.org/W2013797933","https://openalex.org/W2209982021","https://openalex.org/W2375192119"],"abstract_inverted_index":{"With":[0],"the":[1,12,20,25,59,72,91],"thermal":[2,13,26,46,61,67,87,98],"effect,":[3],"improper":[4],"analog":[5,29,55,81,95],"placements":[6],"may":[7],"degrade":[8],"circuit":[9],"performance":[10],"because":[11],"gradient":[14],"can":[15],"affect":[16],"electrical":[17],"characteristics":[18],"of":[19],"thermally-sensitive":[21],"devices.":[22],"To":[23],"mitigate":[24],"effect":[27],"in":[28,42],"layout":[30],"design,":[31],"it":[32],"is":[33],"required":[34],"to":[35,44],"reduce":[36],"thermally-induced":[37],"mismatches":[38],"among":[39],"matched":[40],"devices":[41],"addition":[43],"eliminating":[45],"hot":[47],"spots.":[48],"This":[49],"paper":[50],"presents":[51],"major":[52],"challenges":[53],"for":[54,80,94],"placement":[56,74,82,96],"arising":[57],"from":[58],"chip":[60],"gradient,":[62],"introduces":[63],"non-uniform":[64,84],"and":[65,85,89],"uniform":[66,86],"profiles":[68],"as":[69,71],"well":[70],"corresponding":[73],"configurations,":[75],"surveys":[76],"key":[77],"existing":[78],"techniques":[79],"under":[83],"profiles,":[88],"provides":[90],"experimental":[92],"results":[93],"with":[97],"consideration.":[99]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}