{"id":"https://openalex.org/W2784086611","doi":"https://doi.org/10.1109/dft.2017.8244463","title":"A dynamic test compaction method on low power test generation based on capture safe test vectors","display_name":"A dynamic test compaction method on low power test generation based on capture safe test vectors","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2784086611","doi":"https://doi.org/10.1109/dft.2017.8244463","mag":"2784086611"},"language":"en","primary_location":{"id":"doi:10.1109/dft.2017.8244463","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2017.8244463","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113865938","display_name":"Toshinori Hosokawa","orcid":null},"institutions":[{"id":"https://openalex.org/I52706244","display_name":"College of Industrial Technology","ror":"https://ror.org/054a9s036","country_code":"JP","type":"education","lineage":["https://openalex.org/I52706244"]},{"id":"https://openalex.org/I104946051","display_name":"Nihon University","ror":"https://ror.org/05jk51a88","country_code":"JP","type":"education","lineage":["https://openalex.org/I104946051"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Toshinori Hosokawa","raw_affiliation_strings":["College of Industrial Technology, Nihon University, Chiba, JAPAN"],"affiliations":[{"raw_affiliation_string":"College of Industrial Technology, Nihon University, Chiba, JAPAN","institution_ids":["https://openalex.org/I52706244","https://openalex.org/I104946051"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000273019","display_name":"Atsushi Hirai","orcid":null},"institutions":[{"id":"https://openalex.org/I104946051","display_name":"Nihon University","ror":"https://ror.org/05jk51a88","country_code":"JP","type":"education","lineage":["https://openalex.org/I104946051"]},{"id":"https://openalex.org/I52706244","display_name":"College of Industrial Technology","ror":"https://ror.org/054a9s036","country_code":"JP","type":"education","lineage":["https://openalex.org/I52706244"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Atsushi Hirai","raw_affiliation_strings":["College of Industrial Technology, Nihon University, Chiba, JAPAN"],"affiliations":[{"raw_affiliation_string":"College of Industrial Technology, Nihon University, Chiba, JAPAN","institution_ids":["https://openalex.org/I52706244","https://openalex.org/I104946051"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015411968","display_name":"Hiroshi Yamazaki","orcid":"https://orcid.org/0000-0001-9434-2957"},"institutions":[{"id":"https://openalex.org/I104946051","display_name":"Nihon University","ror":"https://ror.org/05jk51a88","country_code":"JP","type":"education","lineage":["https://openalex.org/I104946051"]},{"id":"https://openalex.org/I52706244","display_name":"College of Industrial Technology","ror":"https://ror.org/054a9s036","country_code":"JP","type":"education","lineage":["https://openalex.org/I52706244"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Yamazaki","raw_affiliation_strings":["College of Industrial Technology, Nihon University, Chiba, JAPAN"],"affiliations":[{"raw_affiliation_string":"College of Industrial Technology, Nihon University, Chiba, JAPAN","institution_ids":["https://openalex.org/I52706244","https://openalex.org/I104946051"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033483661","display_name":"Masayuki Arai","orcid":"https://orcid.org/0000-0002-4636-6310"},"institutions":[{"id":"https://openalex.org/I104946051","display_name":"Nihon University","ror":"https://ror.org/05jk51a88","country_code":"JP","type":"education","lineage":["https://openalex.org/I104946051"]},{"id":"https://openalex.org/I52706244","display_name":"College of Industrial Technology","ror":"https://ror.org/054a9s036","country_code":"JP","type":"education","lineage":["https://openalex.org/I52706244"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masayuki Arai","raw_affiliation_strings":["College of Industrial Technology, Nihon University, Chiba, JAPAN"],"affiliations":[{"raw_affiliation_string":"College of Industrial Technology, Nihon University, Chiba, JAPAN","institution_ids":["https://openalex.org/I52706244","https://openalex.org/I104946051"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5113865938"],"corresponding_institution_ids":["https://openalex.org/I104946051","https://openalex.org/I52706244"],"apc_list":null,"apc_paid":null,"fwci":0.2253,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.54446958,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"47","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fault-coverage","display_name":"Fault coverage","score":0.804956316947937},{"id":"https://openalex.org/keywords/test-vector","display_name":"Test vector","score":0.7019216418266296},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.6875771284103394},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.6056478023529053},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.5752962827682495},{"id":"https://openalex.org/keywords/dynamic-compaction","display_name":"Dynamic compaction","score":0.5163732767105103},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4963684678077698},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4499092400074005},{"id":"https://openalex.org/keywords/test-method","display_name":"Test method","score":0.41769614815711975},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.41111087799072266},{"id":"https://openalex.org/keywords/test-set","display_name":"Test set","score":0.4090278446674347},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.35115373134613037},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3477821946144104},{"id":"https://openalex.org/keywords/compaction","display_name":"Compaction","score":0.28970852494239807},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.1476353406906128},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.13410407304763794},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11439576745033264},{"id":"https://openalex.org/keywords/statistics","display_name":"Statistics","score":0.07503870129585266},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.07382532954216003}],"concepts":[{"id":"https://openalex.org/C126953365","wikidata":"https://www.wikidata.org/wiki/Q5438152","display_name":"Fault coverage","level":3,"score":0.804956316947937},{"id":"https://openalex.org/C100767440","wikidata":"https://www.wikidata.org/wiki/Q7705816","display_name":"Test vector","level":3,"score":0.7019216418266296},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.6875771284103394},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.6056478023529053},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.5752962827682495},{"id":"https://openalex.org/C2777882295","wikidata":"https://www.wikidata.org/wiki/Q5318957","display_name":"Dynamic compaction","level":3,"score":0.5163732767105103},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4963684678077698},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4499092400074005},{"id":"https://openalex.org/C132519959","wikidata":"https://www.wikidata.org/wiki/Q3077373","display_name":"Test method","level":2,"score":0.41769614815711975},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.41111087799072266},{"id":"https://openalex.org/C169903167","wikidata":"https://www.wikidata.org/wiki/Q3985153","display_name":"Test set","level":2,"score":0.4090278446674347},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.35115373134613037},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3477821946144104},{"id":"https://openalex.org/C196715460","wikidata":"https://www.wikidata.org/wiki/Q1414356","display_name":"Compaction","level":2,"score":0.28970852494239807},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.1476353406906128},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.13410407304763794},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11439576745033264},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.07503870129585266},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.07382532954216003},{"id":"https://openalex.org/C187320778","wikidata":"https://www.wikidata.org/wiki/Q1349130","display_name":"Geotechnical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/dft.2017.8244463","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2017.8244463","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1497488929","https://openalex.org/W1568407911","https://openalex.org/W1849928240","https://openalex.org/W1900996732","https://openalex.org/W1966348745","https://openalex.org/W1968575517","https://openalex.org/W1988075706","https://openalex.org/W2039868523","https://openalex.org/W2071586481","https://openalex.org/W2095853358","https://openalex.org/W2096146619","https://openalex.org/W2118744758","https://openalex.org/W2125014350","https://openalex.org/W2127888903","https://openalex.org/W2128426877","https://openalex.org/W2132881562","https://openalex.org/W2134293563","https://openalex.org/W2145554447","https://openalex.org/W2146893269","https://openalex.org/W2151526282","https://openalex.org/W2154695555","https://openalex.org/W2166163625","https://openalex.org/W2170506040","https://openalex.org/W3151076167","https://openalex.org/W6639759450","https://openalex.org/W6678356202","https://openalex.org/W6682775469","https://openalex.org/W6684847144"],"related_works":["https://openalex.org/W2786111245","https://openalex.org/W2098752843","https://openalex.org/W2154529098","https://openalex.org/W4285708951","https://openalex.org/W2019719714","https://openalex.org/W2151556234","https://openalex.org/W2607923094","https://openalex.org/W2014298968","https://openalex.org/W2915076116","https://openalex.org/W2096843010"],"abstract_inverted_index":{"In":[0,74,99],"at-speed":[1],"scan":[2],"testing,":[3],"capture":[4,46,56,71,87],"power":[5,13,47,72,88],"is":[6,25],"a":[7,22,69,79,130,145,149],"serious":[8],"problem":[9],"because":[10],"the":[11,19,85,93,100,107,159],"high":[12,32,70],"dissipation":[14],"that":[15,118,128,155],"can":[16],"occur":[17],"when":[18],"response":[20],"for":[21,148],"test":[23,48,58,63,81,89,97,102,146,163],"vector":[24,147],"captured":[26],"by":[27,144,165],"flip-flops":[28],"results":[29,153],"in":[30,60,138],"circuit-damaging":[31],"temperature":[33],"and":[34,133],"timing":[35],"errors,":[36],"which":[37,141],"may":[38],"cause":[39],"significant":[40],"capture-induced":[41],"yield":[42],"loss.":[43],"A":[44],"low":[45,86],"generation":[49,90],"method":[50,83,157],"based":[51],"on":[52,84,167],"fault":[53,119,132],"simulation":[54],"using":[55],"safe":[57],"vectors":[59,164],"an":[61],"initial":[62],"set":[64],"was":[65],"proposed":[66],"to":[67,91,105],"resolve":[68],"problem.":[73],"this":[75,156],"paper,":[76],"we":[77],"propose":[78],"dynamic":[80,101],"compaction":[82],"reduce":[92],"number":[94,160],"of":[95,122,129,161],"capture-safe":[96,162],"vectors.":[98],"compaction,":[103],"faults":[104,124,135],"satisfy":[106],"following":[108],"conditions":[109,116],"are":[110,117,125,136,142],"selected":[111],"as":[112],"secondary":[113,123,134],"faults.":[114],"The":[115],"excitation":[120],"cubes":[121],"compatible":[126],"with":[127],"primary":[131,150],"located":[137],"fanout-free":[139],"regions":[140],"sensitized":[143],"fault.":[151],"Experimental":[152],"show":[154],"reduces":[158],"18%":[166],"average.":[168]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}