{"id":"https://openalex.org/W2509231602","doi":"https://doi.org/10.1109/dft.2016.7684059","title":"BTI aware thermal management for reliable DVFS designs","display_name":"BTI aware thermal management for reliable DVFS designs","publication_year":2016,"publication_date":"2016-09-01","ids":{"openalex":"https://openalex.org/W2509231602","doi":"https://doi.org/10.1109/dft.2016.7684059","mag":"2509231602"},"language":"en","primary_location":{"id":"doi:10.1109/dft.2016.7684059","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2016.7684059","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/11568/1026997","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016695099","display_name":"Hardeep Chahal","orcid":"https://orcid.org/0000-0002-7744-6786"},"institutions":[{"id":"https://openalex.org/I43439940","display_name":"University of Southampton","ror":"https://ror.org/01ryk1543","country_code":"GB","type":"education","lineage":["https://openalex.org/I43439940"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"Hardeep Chahal","raw_affiliation_strings":["ECS, University of Southampton, UK"],"affiliations":[{"raw_affiliation_string":"ECS, University of Southampton, UK","institution_ids":["https://openalex.org/I43439940"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021612104","display_name":"Vasileios Tenentes","orcid":"https://orcid.org/0000-0002-3980-3746"},"institutions":[{"id":"https://openalex.org/I43439940","display_name":"University of Southampton","ror":"https://ror.org/01ryk1543","country_code":"GB","type":"education","lineage":["https://openalex.org/I43439940"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Vasileios Tenentes","raw_affiliation_strings":["ECS, University of Southampton, UK"],"affiliations":[{"raw_affiliation_string":"ECS, University of Southampton, UK","institution_ids":["https://openalex.org/I43439940"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076546330","display_name":"Daniele Rossi","orcid":"https://orcid.org/0000-0002-9487-378X"},"institutions":[{"id":"https://openalex.org/I43439940","display_name":"University of Southampton","ror":"https://ror.org/01ryk1543","country_code":"GB","type":"education","lineage":["https://openalex.org/I43439940"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Daniele Rossi","raw_affiliation_strings":["ECS, University of Southampton, UK"],"affiliations":[{"raw_affiliation_string":"ECS, University of Southampton, UK","institution_ids":["https://openalex.org/I43439940"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012783672","display_name":"Bashir M. Al\u2010Hashimi","orcid":"https://orcid.org/0000-0002-3591-1328"},"institutions":[{"id":"https://openalex.org/I43439940","display_name":"University of Southampton","ror":"https://ror.org/01ryk1543","country_code":"GB","type":"education","lineage":["https://openalex.org/I43439940"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Bashir M. Al-Hashimi","raw_affiliation_strings":["ECS, University of Southampton, UK"],"affiliations":[{"raw_affiliation_string":"ECS, University of Southampton, UK","institution_ids":["https://openalex.org/I43439940"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5016695099"],"corresponding_institution_ids":["https://openalex.org/I43439940"],"apc_list":null,"apc_paid":null,"fwci":1.2863,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.82356603,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.7051184177398682},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5950667858123779},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4681931436061859},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4383881092071533},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3552544116973877},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17226645350456238},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0841875970363617},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.07375034689903259}],"concepts":[{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.7051184177398682},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5950667858123779},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4681931436061859},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4383881092071533},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3552544116973877},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17226645350456238},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0841875970363617},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.07375034689903259},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/dft.2016.7684059","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2016.7684059","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"},{"id":"pmh:oai:eprints.soton.ac.uk:399868","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S4306401019","display_name":"ePrints Soton (University of Southampton)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I43439940","host_organization_name":"University of Southampton","host_organization_lineage":["https://openalex.org/I43439940"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"","raw_type":"Conference or Workshop Item"},{"id":"pmh:oai:arpi.unipi.it:11568/1026997","is_oa":true,"landing_page_url":"http://hdl.handle.net/11568/1026997","pdf_url":null,"source":{"id":"https://openalex.org/S4377196265","display_name":"CINECA IRIS Institutial research information system (University of Pisa)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I108290504","host_organization_name":"University of Pisa","host_organization_lineage":["https://openalex.org/I108290504"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":{"id":"pmh:oai:arpi.unipi.it:11568/1026997","is_oa":true,"landing_page_url":"http://hdl.handle.net/11568/1026997","pdf_url":null,"source":{"id":"https://openalex.org/S4377196265","display_name":"CINECA IRIS Institutial research information system (University of Pisa)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I108290504","host_organization_name":"University of Pisa","host_organization_lineage":["https://openalex.org/I108290504"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/conferenceObject"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G5747769951","display_name":null,"funder_award_id":"EP/K000810/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G7639885267","display_name":null,"funder_award_id":"EP/K034448/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"}],"funders":[{"id":"https://openalex.org/F4320334627","display_name":"Engineering and Physical Sciences Research Council","ror":"https://ror.org/0439y7842"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1525945405","https://openalex.org/W1999919743","https://openalex.org/W2020404011","https://openalex.org/W2021389045","https://openalex.org/W2042689564","https://openalex.org/W2074324895","https://openalex.org/W2075787867","https://openalex.org/W2077419807","https://openalex.org/W2105619224","https://openalex.org/W2126394324","https://openalex.org/W2134111163","https://openalex.org/W2170569687","https://openalex.org/W2176877009","https://openalex.org/W2343750816"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2371237473","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2086636458","https://openalex.org/W4390188998"],"abstract_inverted_index":{"In":[0,61],"this":[1],"paper,":[2],"we":[3,74,116],"show":[4,31,143],"that":[5,32,45,144],"dynamic":[6,172],"voltage":[7],"and":[8,27,49,90,102,159,183,188],"frequency":[9],"scaling":[10],"(DVFS)":[11],"designs,":[12],"together":[13],"with":[14,131,185],"stress-induced":[15],"BTI":[16,21,81,197],"variability,":[17,22],"exhibit":[18],"high":[19],"temperature-induced":[20,36],"depending":[23],"on":[24,38],"their":[25],"workload":[26,89,101],"operating":[28],"modes.":[29],"We":[30,142],"the":[33,53,57,80,109,113,118,122,126,163,171],"impact":[34],"of":[35,84,108,121,152],"variability":[37],"circuit":[39,58,124],"lifetime":[40,69,120,151],"can":[41,147],"be":[42],"higher":[43,190],"than":[44],"due":[46],"to":[47,63,157,168,178],"stress":[48],"exceed":[50],"50%":[51],"over":[52],"value":[54],"estimated":[55],"considering":[56,98],"average":[59],"temperature.":[60],"order":[62,177],"account":[64],"for":[65,79,88,137],"these":[66],"variabilities":[67],"in":[68,176],"estimation":[70],"at":[71],"design":[72,146],"time,":[73],"propose":[75],"a":[76,132,194],"simulation":[77],"framework":[78,115,165],"degradation":[82],"analysis":[83],"DVFS":[85,153],"designs":[86,154],"accounting":[87],"actual":[91],"temperature":[92],"profiles.":[93],"A":[94],"profile":[95],"is":[96],"generated":[97],"statistically":[99],"probable":[100],"thermal":[103,139,173],"management":[104,140,174],"constraints":[105,175],"by":[106,155],"means":[107],"HotSpot":[110],"tool.":[111],"Using":[112],"proposed":[114,164],"explore":[117],"expected":[119],"ethernet":[123],"from":[125],"IWLS05":[127],"benchmark":[128],"suite,":[129],"synthesized":[130],"32nm":[133],"CMOS":[134],"technology":[135],"library,":[136],"various":[138],"constraints.":[141],"margin-based":[145],"underestimate":[148],"or":[149],"overestimate":[150],"up":[156],"67.8%":[158],"61.9%,":[160],"respectively.":[161],"Therefore,":[162],"allows":[166],"designers":[167],"select":[169],"appropriately":[170],"tradeoff":[179],"long-term":[180],"reliability":[181],"(lifetime)":[182],"performance":[184],"upto":[186],"35.8%":[187],"26.3%":[189],"accuracy,":[191],"respectively,":[192],"against":[193],"temperature-variability":[195],"unaware":[196],"analysis.":[198]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2016-09-16T00:00:00"}