{"id":"https://openalex.org/W2009570976","doi":"https://doi.org/10.1109/dft.2014.6962067","title":"TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip","display_name":"TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2009570976","doi":"https://doi.org/10.1109/dft.2014.6962067","mag":"2009570976"},"language":"en","primary_location":{"id":"doi:10.1109/dft.2014.6962067","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2014.6962067","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109252027","display_name":"Ashkan Eghbal","orcid":null},"institutions":[{"id":"https://openalex.org/I204250578","display_name":"University of California, Irvine","ror":"https://ror.org/04gyf1771","country_code":"US","type":"education","lineage":["https://openalex.org/I204250578"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ashkan Eghbal","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, University of California, Irvine","Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of California, Irvine","institution_ids":["https://openalex.org/I204250578"]},{"raw_affiliation_string":"Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#","institution_ids":["https://openalex.org/I204250578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111842809","display_name":"Pooria M. Yaghini","orcid":null},"institutions":[{"id":"https://openalex.org/I204250578","display_name":"University of California, Irvine","ror":"https://ror.org/04gyf1771","country_code":"US","type":"education","lineage":["https://openalex.org/I204250578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pooria M. Yaghini","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, University of California, Irvine","Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of California, Irvine","institution_ids":["https://openalex.org/I204250578"]},{"raw_affiliation_string":"Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#","institution_ids":["https://openalex.org/I204250578"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056066676","display_name":"Siavash Yazdi","orcid":null},"institutions":[{"id":"https://openalex.org/I204250578","display_name":"University of California, Irvine","ror":"https://ror.org/04gyf1771","country_code":"US","type":"education","lineage":["https://openalex.org/I204250578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Siavash S. Yazdi","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, University of California, Irvine","Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of California, Irvine","institution_ids":["https://openalex.org/I204250578"]},{"raw_affiliation_string":"Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#","institution_ids":["https://openalex.org/I204250578"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012004974","display_name":"Nader Bagherzadeh","orcid":"https://orcid.org/0000-0001-7216-0546"},"institutions":[{"id":"https://openalex.org/I204250578","display_name":"University of California, Irvine","ror":"https://ror.org/04gyf1771","country_code":"US","type":"education","lineage":["https://openalex.org/I204250578"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nader Bagherzadeh","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, University of California, Irvine","Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of California, Irvine","institution_ids":["https://openalex.org/I204250578"]},{"raw_affiliation_string":"Center for Pervasive Communications and Computing, Department of Electrical Engineering and Computer Science, University of California, Irvine#TAB#","institution_ids":["https://openalex.org/I204250578"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5109252027"],"corresponding_institution_ids":["https://openalex.org/I204250578"],"apc_list":null,"apc_paid":null,"fwci":1.884,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.87142775,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"2","issue":null,"first_page":"92","last_page":"97"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7082974910736084},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5567469596862793},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.5279019474983215},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.4718848466873169},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4716942608356476},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.46718862652778625},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.4646332561969757},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4513491690158844},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.4438436031341553},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4412142336368561},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37838035821914673},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29456958174705505},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29029470682144165},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2291087806224823},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.1741039752960205},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.15887990593910217},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12037050724029541}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7082974910736084},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5567469596862793},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.5279019474983215},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.4718848466873169},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4716942608356476},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.46718862652778625},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.4646332561969757},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4513491690158844},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.4438436031341553},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4412142336368561},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37838035821914673},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29456958174705505},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29029470682144165},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2291087806224823},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.1741039752960205},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.15887990593910217},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12037050724029541},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/dft.2014.6962067","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dft.2014.6962067","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7900000214576721}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1982553332","https://openalex.org/W2012516973","https://openalex.org/W2017619982","https://openalex.org/W2051300390","https://openalex.org/W2070638731","https://openalex.org/W2077395645","https://openalex.org/W2109314689","https://openalex.org/W2128516899","https://openalex.org/W2132231716","https://openalex.org/W2133279383","https://openalex.org/W2137223869","https://openalex.org/W2141410210","https://openalex.org/W2152102280","https://openalex.org/W2156151932","https://openalex.org/W2166475850","https://openalex.org/W2326166417","https://openalex.org/W4250450018"],"related_works":["https://openalex.org/W2289987414","https://openalex.org/W2142764951","https://openalex.org/W2530741851","https://openalex.org/W2107268071","https://openalex.org/W2038892969","https://openalex.org/W2051282954","https://openalex.org/W2546191054","https://openalex.org/W2743461185","https://openalex.org/W4231272740","https://openalex.org/W2805905939"],"abstract_inverted_index":{"A":[0,67,79],"reliable":[1],"Three":[2],"Dimensional":[3],"Network-on-Chip":[4],"(3D":[5],"NoC)":[6],"is":[7,16,51,73,83],"required":[8],"for":[9,62,75,98],"future":[10],"many-core":[11],"systems.":[12],"Through-silicon":[13],"Via":[14],"(TSV)":[15],"the":[17,87,93],"prominent":[18],"component":[19],"of":[20,65,69],"3D":[21],"NoC":[22],"to":[23,85],"support":[24],"better":[25],"performance":[26],"and":[27,42,59],"lower":[28],"power":[29],"consumption.":[30],"Inductive":[31],"TSV":[32,48,57,60,77,101],"coupling":[33,50,71,89],"has":[34],"large":[35],"disruptive":[36],"effects":[37,90],"on":[38,54],"Signal":[39],"Integrity":[40],"(SI)":[41],"transmission":[43],"delay.":[44],"In":[45],"this":[46],"paper,":[47],"inductive":[49,70,88],"analyzed":[52],"based":[53],"technology":[55],"process,":[56],"length,":[58],"radius":[61],"a":[63,99],"range":[64],"frequencies.":[66],"classification":[68],"voltage":[72,106],"presented":[74],"different":[76],"configurations.":[78],"novel":[80],"coding":[81],"technique":[82],"devised":[84],"mitigate":[86],"by":[91],"adjusting":[92],"current":[94],"flow":[95],"pattern.":[96],"Simulations":[97],"4\u00d78":[100],"matrix":[102],"show":[103],"23%":[104],"coupled":[105],"mitigation,":[107],"imposing":[108],"12.5%":[109],"information":[110],"redundancy.":[111]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":5}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}