{"id":"https://openalex.org/W2947313265","doi":"https://doi.org/10.1109/ddecs.2019.8724657","title":"Modular Data Link Layer Processing for THz communication","display_name":"Modular Data Link Layer Processing for THz communication","publication_year":2019,"publication_date":"2019-04-01","ids":{"openalex":"https://openalex.org/W2947313265","doi":"https://doi.org/10.1109/ddecs.2019.8724657","mag":"2947313265"},"language":"en","primary_location":{"id":"doi:10.1109/ddecs.2019.8724657","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ddecs.2019.8724657","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 22nd International Symposium on Design and Diagnostics of Electronic Circuits &amp; Systems (DDECS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5046504896","display_name":"\u0141ukasz \u0141opaci\u0144ski","orcid":"https://orcid.org/0000-0002-2349-298X"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"L. Lopacinski","raw_affiliation_strings":["IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037911538","display_name":"Mohamed Hussein Eissa","orcid":"https://orcid.org/0000-0001-6232-6979"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. H. Eissa","raw_affiliation_strings":["IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074593147","display_name":"Goran Pani\u0107","orcid":"https://orcid.org/0000-0002-3702-0828"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"G. Panic","raw_affiliation_strings":["IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP \u2013 Leibniz-Institut f\u00efr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039139388","display_name":"Alireza Hasani","orcid":"https://orcid.org/0000-0002-0946-0324"},"institutions":[{"id":"https://openalex.org/I51783024","display_name":"Brandenburg University of Technology Cottbus-Senftenberg","ror":"https://ror.org/02wxx3e24","country_code":"DE","type":"education","lineage":["https://openalex.org/I51783024"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"A. Hasani","raw_affiliation_strings":["Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany"],"affiliations":[{"raw_affiliation_string":"Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany","institution_ids":["https://openalex.org/I51783024"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111617436","display_name":"Rolf Kraemer","orcid":null},"institutions":[{"id":"https://openalex.org/I51783024","display_name":"Brandenburg University of Technology Cottbus-Senftenberg","ror":"https://ror.org/02wxx3e24","country_code":"DE","type":"education","lineage":["https://openalex.org/I51783024"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"R. Kraemer","raw_affiliation_strings":["Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany"],"affiliations":[{"raw_affiliation_string":"Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany","institution_ids":["https://openalex.org/I51783024"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5046504896"],"corresponding_institution_ids":["https://openalex.org/I92894754"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.03853464,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10125","display_name":"Advanced Wireless Communication Techniques","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.7045801281929016},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6779493093490601},{"id":"https://openalex.org/keywords/link","display_name":"Link (geometry)","score":0.6227183938026428},{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"Terahertz radiation","score":0.5491251945495605},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5418539643287659},{"id":"https://openalex.org/keywords/link-layer","display_name":"Link layer","score":0.49518242478370667},{"id":"https://openalex.org/keywords/data-link","display_name":"Data link","score":0.46966254711151123},{"id":"https://openalex.org/keywords/data-link-layer","display_name":"Data link layer","score":0.4651632606983185},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.32338136434555054},{"id":"https://openalex.org/keywords/physical-layer","display_name":"Physical layer","score":0.30189040303230286},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.29078787565231323},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.28293782472610474},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2153899073600769},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1495944857597351},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.0911741554737091},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.07133522629737854}],"concepts":[{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.7045801281929016},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6779493093490601},{"id":"https://openalex.org/C2778753846","wikidata":"https://www.wikidata.org/wiki/Q6554239","display_name":"Link (geometry)","level":2,"score":0.6227183938026428},{"id":"https://openalex.org/C107816215","wikidata":"https://www.wikidata.org/wiki/Q647887","display_name":"Terahertz radiation","level":2,"score":0.5491251945495605},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5418539643287659},{"id":"https://openalex.org/C12570599","wikidata":"https://www.wikidata.org/wiki/Q2891044","display_name":"Link layer","level":3,"score":0.49518242478370667},{"id":"https://openalex.org/C182132293","wikidata":"https://www.wikidata.org/wiki/Q1172466","display_name":"Data link","level":2,"score":0.46966254711151123},{"id":"https://openalex.org/C192835768","wikidata":"https://www.wikidata.org/wiki/Q194134","display_name":"Data link layer","level":4,"score":0.4651632606983185},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.32338136434555054},{"id":"https://openalex.org/C19247436","wikidata":"https://www.wikidata.org/wiki/Q192727","display_name":"Physical layer","level":3,"score":0.30189040303230286},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.29078787565231323},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.28293782472610474},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2153899073600769},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1495944857597351},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0911741554737091},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.07133522629737854},{"id":"https://openalex.org/C158379750","wikidata":"https://www.wikidata.org/wiki/Q214111","display_name":"Network packet","level":2,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ddecs.2019.8724657","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ddecs.2019.8724657","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 22nd International Symposium on Design and Diagnostics of Electronic Circuits &amp; Systems (DDECS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321114","display_name":"Bundesministerium f\u00fcr Bildung und Forschung","ror":"https://ror.org/04pz7b180"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2568075268","https://openalex.org/W2734474589","https://openalex.org/W2783744197","https://openalex.org/W2787505009","https://openalex.org/W2789608006","https://openalex.org/W2790412449","https://openalex.org/W2810517520","https://openalex.org/W2884795725","https://openalex.org/W2886539720","https://openalex.org/W2886776623","https://openalex.org/W2893535437","https://openalex.org/W2912086120","https://openalex.org/W6748138558"],"related_works":["https://openalex.org/W2294314814","https://openalex.org/W2088164889","https://openalex.org/W2376716091","https://openalex.org/W2610280046","https://openalex.org/W2374213870","https://openalex.org/W3147980268","https://openalex.org/W3148825529","https://openalex.org/W2091813995","https://openalex.org/W2329272387","https://openalex.org/W1525011639"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3,34],"demonstrate":[4],"a":[5,22,48,57],"modular":[6,9],"baseband":[7,40,113],"and":[8,41,55,84,145,159],"data":[10,42,80,104,117],"link":[11,43,81,105],"layer":[12,44,82,106],"processors":[13],"for":[14,21],"wireless":[15],"communication,":[16],"which":[17],"has":[18],"been":[19],"designed":[20],"200":[23],"GHz":[24,60],"frontend.":[25],"Although":[26],"the":[27,36,71,75,79,92,95,100,103,112,121,139],"individual":[28],"system":[29],"elements":[30,73],"are":[31,163],"well":[32],"known,":[33],"combine":[35,52],"performance":[37,93],"of":[38,74,94],"parallel":[39],"cores":[45,54],"to":[46,143,152],"cover":[47],"larger":[49],"bandwidth.":[50],"We":[51,90],"three":[53],"achieve":[56],"single":[58],"1.5":[59],"channel":[61],"(3":[62],"\u00d7":[63],"500":[64],"MHz).":[65],"This":[66],"paper":[67],"is":[68,109,124],"focused":[69],"on":[70,78,102,135],"digital":[72],"demonstrator,":[76,98],"especially":[77],"aspects":[83],"field-programmable":[85],"gate":[86],"array":[87],"(FPGA)":[88],"processing.":[89],"discuss":[91],"back-to-back":[96],"connected":[97],"with":[99],"focus":[101],"implementation":[107],"that":[108],"included":[110],"in":[111],"chip.":[114],"The":[115,127],"peak":[116],"rate":[118,141,149],"achieved":[119],"by":[120],"presented":[122],"demonstrator":[123],"1920":[125],"Mbps.":[126],"solution":[128],"uses":[129],"forward":[130],"error":[131,148],"correction":[132],"mechanisms":[133],"based":[134],"convolutional":[136],"codes":[137],"at":[138],"code":[140],"equal":[142],"3/4":[144],"accepts":[146],"bit":[147],"(BER)":[150],"up":[151],"10":[153],"<sup":[154],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[155],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">-2</sup>":[156],".":[157],"Point-to-point":[158],"mesh":[160],"network":[161],"topologies":[162],"supported.":[164]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}