{"id":"https://openalex.org/W4236078836","doi":"https://doi.org/10.1109/date.2010.5457225","title":"Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers","display_name":"Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers","publication_year":2010,"publication_date":"2010-03-01","ids":{"openalex":"https://openalex.org/W4236078836","doi":"https://doi.org/10.1109/date.2010.5457225"},"language":"en","primary_location":{"id":"doi:10.1109/date.2010.5457225","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2010.5457225","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102461283","display_name":"Jieyi Long","orcid":null},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jieyi Long","raw_affiliation_strings":["Department of EECS, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111716641","display_name":"Seda \u00d6\u01e7renci Memik","orcid":null},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seda Ogrenci Memik","raw_affiliation_strings":["Department of EECS, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057155656","display_name":"M. Grayson","orcid":"https://orcid.org/0000-0003-4914-5043"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew Grayson","raw_affiliation_strings":["Department of EECS, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5102461283"],"corresponding_institution_ids":["https://openalex.org/I111979921"],"apc_list":null,"apc_paid":null,"fwci":0.77890852,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.71720296,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"117","last_page":"122"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tec","display_name":"TEC","score":0.9017564058303833},{"id":"https://openalex.org/keywords/thermoelectric-cooling","display_name":"Thermoelectric cooling","score":0.8486406803131104},{"id":"https://openalex.org/keywords/overheating","display_name":"Overheating (electricity)","score":0.7384318709373474},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6003744006156921},{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.5716680288314819},{"id":"https://openalex.org/keywords/software-deployment","display_name":"Software deployment","score":0.5555235147476196},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.477192759513855},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40285271406173706},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3293693959712982},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32314562797546387},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20910131931304932},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10000470280647278},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08322715759277344},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08131691813468933}],"concepts":[{"id":"https://openalex.org/C176379880","wikidata":"https://www.wikidata.org/wiki/Q18031939","display_name":"TEC","level":3,"score":0.9017564058303833},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.8486406803131104},{"id":"https://openalex.org/C2778284599","wikidata":"https://www.wikidata.org/wiki/Q25340000","display_name":"Overheating (electricity)","level":2,"score":0.7384318709373474},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6003744006156921},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.5716680288314819},{"id":"https://openalex.org/C105339364","wikidata":"https://www.wikidata.org/wiki/Q2297740","display_name":"Software deployment","level":2,"score":0.5555235147476196},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.477192759513855},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40285271406173706},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3293693959712982},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32314562797546387},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20910131931304932},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10000470280647278},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08322715759277344},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08131691813468933},{"id":"https://openalex.org/C1276947","wikidata":"https://www.wikidata.org/wiki/Q333","display_name":"Astronomy","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C116403925","wikidata":"https://www.wikidata.org/wiki/Q162219","display_name":"Ionosphere","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/date.2010.5457225","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2010.5457225","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7400000095367432,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W389868541","https://openalex.org/W1586698348","https://openalex.org/W1608956838","https://openalex.org/W2042538231","https://openalex.org/W2044206819","https://openalex.org/W2077613469","https://openalex.org/W2109567220","https://openalex.org/W2122087341","https://openalex.org/W2132090496","https://openalex.org/W2149237671","https://openalex.org/W2154857344","https://openalex.org/W2163517070","https://openalex.org/W2168615523","https://openalex.org/W2571826100","https://openalex.org/W3035235874","https://openalex.org/W3140903683","https://openalex.org/W4206255109","https://openalex.org/W4250589301","https://openalex.org/W6677935383","https://openalex.org/W6682200175","https://openalex.org/W6739515746","https://openalex.org/W6792941224","https://openalex.org/W6803537972"],"related_works":["https://openalex.org/W2027072495","https://openalex.org/W2275640069","https://openalex.org/W1972191873","https://openalex.org/W2900169294","https://openalex.org/W2795328362","https://openalex.org/W2803967615","https://openalex.org/W2102804271","https://openalex.org/W2028802659","https://openalex.org/W2804960083","https://openalex.org/W2954340170"],"abstract_inverted_index":{"In":[0],"this":[1,91],"paper,":[2],"we":[3,93,142],"explore":[4],"the":[5,27,32,52,64,67,70,83,87,95,98,119,132,137,148,169,177,182,185,196],"design":[6,110],"and":[7,102,124,172],"optimization":[8],"of":[9,47,66,77,86,97,121,139,176,184],"an":[10,44,56,144],"on-chip":[11],"active":[12],"cooling":[13,71],"system":[14,72],"based":[15,128],"on":[16,157],"thin-film":[17,37],"thermoelectric":[18],"coolers":[19],"(TEC).":[20],"We":[21,40,112,152,160],"start":[22],"our":[23,155,163],"investigation":[24],"by":[25,90,188],"establishing":[26],"compact":[28],"thermal":[29,84],"model":[30],"for":[31,130,147],"chip":[33],"package":[34],"with":[35,55],"integrated":[36,99,199],"TEC":[38,48,53,100,122,178,200],"devices.":[39,201],"observe":[41,161],"that":[42,162],"deploying":[43],"excessive":[45],"number":[46],"devices":[49,54,101,123,179],"and/or":[50],"providing":[51],"improper":[57],"supply":[58,78,104,133,173],"current":[59,79,105,134,149,174],"might":[60],"adversely":[61],"result":[62],"in":[63],"overheating":[65],"chip,":[68],"rendering":[69],"ineffective.":[73],"A":[74],"large":[75],"amount":[76],"could":[80],"even":[81],"cause":[82],"runaway":[85],"system.":[88],"Motivated":[89],"observation,":[92],"formulate":[94],"deployment":[96,120,171],"their":[103],"setting":[106,131,150],"as":[107,189,191],"a":[108,114,125],"system-level":[109],"problem.":[111],"propose":[113],"greedy":[115],"algorithm":[116],"to":[117,167,195],"determine":[118,168],"convex":[126],"programming":[127],"scheme":[129],"levels.":[135],"Leveraging":[136],"theory":[138],"inverse-positive":[140],"matrix,":[141],"provide":[143],"optimality":[145],"condition":[146],"algorithm.":[151],"have":[153],"tested":[154],"algorithms":[156,164],"various":[158],"benchmarks.":[159],"are":[165],"able":[166],"proper":[170],"level":[175],"which":[180],"reduces":[181],"temperatures":[183],"hot":[186],"spots":[187],"much":[190],"7.5":[192],"\u00b0C":[193],"compared":[194],"cases":[197],"without":[198]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}