{"id":"https://openalex.org/W4232016558","doi":"https://doi.org/10.1109/date.2004.1269196","title":"An inductance modeling flow seamlessly integrated in the RF IC design chain","display_name":"An inductance modeling flow seamlessly integrated in the RF IC design chain","publication_year":2004,"publication_date":"2004-07-20","ids":{"openalex":"https://openalex.org/W4232016558","doi":"https://doi.org/10.1109/date.2004.1269196"},"language":"en","primary_location":{"id":"doi:10.1109/date.2004.1269196","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2004.1269196","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Design, Automation and Test in Europe Conference and Exhibition","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009103948","display_name":"S. Bantas","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. Bantas","raw_affiliation_strings":["Helic S.A., Athens, Greece"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Helic S.A., Athens, Greece","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024997343","display_name":"Y. Koutsoyannopoulos","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Y. Koutsoyannopoulos","raw_affiliation_strings":["Helic S.A., Athens, Greece"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Helic S.A., Athens, Greece","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023538916","display_name":"A. Liapis","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A. Liapis","raw_affiliation_strings":["Helic S.A., Athens, Greece"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Helic S.A., Athens, Greece","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.41122201,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"39","last_page":"43"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.9620397090911865},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.6629250049591064},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.6573676466941833},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6349364519119263},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.587602972984314},{"id":"https://openalex.org/keywords/equivalent-series-inductance","display_name":"Equivalent series inductance","score":0.5601224899291992},{"id":"https://openalex.org/keywords/substrate-coupling","display_name":"Substrate coupling","score":0.5337138175964355},{"id":"https://openalex.org/keywords/circuit-extraction","display_name":"Circuit extraction","score":0.5333675742149353},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.5298093557357788},{"id":"https://openalex.org/keywords/transformer","display_name":"Transformer","score":0.4745660126209259},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.46186262369155884},{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.4519082307815552},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.4185154139995575},{"id":"https://openalex.org/keywords/integrated-circuit-layout","display_name":"Integrated circuit layout","score":0.41771772503852844},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4161975383758545},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3355032801628113},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.30055469274520874},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26056674122810364},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25746941566467285},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2440449297428131},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.07917547225952148},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.07788434624671936}],"concepts":[{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.9620397090911865},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.6629250049591064},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.6573676466941833},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6349364519119263},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.587602972984314},{"id":"https://openalex.org/C141490761","wikidata":"https://www.wikidata.org/wiki/Q5384728","display_name":"Equivalent series inductance","level":4,"score":0.5601224899291992},{"id":"https://openalex.org/C51674796","wikidata":"https://www.wikidata.org/wiki/Q7632167","display_name":"Substrate coupling","level":4,"score":0.5337138175964355},{"id":"https://openalex.org/C26490066","wikidata":"https://www.wikidata.org/wiki/Q17006835","display_name":"Circuit extraction","level":4,"score":0.5333675742149353},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.5298093557357788},{"id":"https://openalex.org/C66322947","wikidata":"https://www.wikidata.org/wiki/Q11658","display_name":"Transformer","level":3,"score":0.4745660126209259},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.46186262369155884},{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.4519082307815552},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.4185154139995575},{"id":"https://openalex.org/C2765594","wikidata":"https://www.wikidata.org/wiki/Q2624187","display_name":"Integrated circuit layout","level":3,"score":0.41771772503852844},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4161975383758545},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3355032801628113},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.30055469274520874},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26056674122810364},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25746941566467285},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2440449297428131},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.07917547225952148},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.07788434624671936},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/date.2004.1269196","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2004.1269196","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Design, Automation and Test in Europe Conference and Exhibition","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Life below water","id":"https://metadata.un.org/sdg/14","score":0.6000000238418579}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2153429334"],"related_works":["https://openalex.org/W2350308400","https://openalex.org/W2030503305","https://openalex.org/W4292182797","https://openalex.org/W2583707817","https://openalex.org/W2148021977","https://openalex.org/W2142651762","https://openalex.org/W2304374807","https://openalex.org/W2253173388","https://openalex.org/W2128263596","https://openalex.org/W4232016558"],"abstract_inverted_index":{"A":[0,45],"novel":[1],"design":[2,46],"flow":[3,47,127],"is":[4,48,99],"introduced":[5,126],"based":[6],"on":[7,26,38,111],"an":[8],"efficient":[9],"inductance":[10,56,122],"modeler,":[11],"supporting":[12],"RLCk":[13],"extraction":[14,64],"for":[15,104,133],"spiral":[16],"inductors,":[17],"transformers":[18],"and":[19,43,62,88,98,118,139],"RF":[20,112,134],"interconnect":[21],"lines.":[22],"The":[23,90,125],"modeler":[24,57],"operates":[25],"a":[27,80,131],"set":[28,49],"of":[29,120],"EM-derived":[30],"algorithms":[31],"that":[32,72],"can":[33,73,128],"model":[34],"complex":[35],"cross-coupled":[36],"devices":[37,87],"any":[39],"silicon":[40,113],"substrate":[41],"rapidly":[42],"reliably.":[44],"up":[50],"in":[51,79],"Cadence":[52],"SKILL,":[53],"integrating":[54],"the":[55,59,116,121],"with":[58,76,84],"layout":[60,86],"editor":[61],"RCX":[63],"tools.":[65],"Spiral":[66],"inductor":[67],"parametric":[68],"cells":[69],"are":[70],"provided,":[71],"be":[74],"extracted":[75],"full":[77],"connectivity":[78],"single":[81],"netlist":[82,92],"along":[83],"other":[85],"parasitics.":[89],"resulting":[91],"includes":[93],"mutual":[94],"coupling":[95],"(k)":[96],"elements":[97],"produced":[100],"automatically":[101],"without":[102],"need":[103],"user":[105],"intervention":[106],"or":[107],"back-annotation.":[108],"Measured":[109],"results":[110],"circuitry":[114],"showcase":[115],"accuracy":[117],"efficiency":[119],"modeling":[123],"flow.":[124],"evolve":[129],"into":[130],"platform":[132],"intellectual":[135],"property":[136],"(IP)":[137],"evaluation":[138],"trade.":[140]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}