{"id":"https://openalex.org/W4253181198","doi":"https://doi.org/10.1109/date.2004.1269010","title":"Nanometer design: what are the requirements for manufacturing test?","display_name":"Nanometer design: what are the requirements for manufacturing test?","publication_year":2004,"publication_date":"2004-07-20","ids":{"openalex":"https://openalex.org/W4253181198","doi":"https://doi.org/10.1109/date.2004.1269010"},"language":"en","primary_location":{"id":"doi:10.1109/date.2004.1269010","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2004.1269010","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Design, Automation and Test in Europe Conference and Exhibition","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072992062","display_name":"J. Rajski","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Rajski","raw_affiliation_strings":["Mentor Graphics Corporation, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5000081404","display_name":"K. Thapar","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Thapar","raw_affiliation_strings":["Mentor Graphics Corporation, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, USA","institution_ids":["https://openalex.org/I4210156212"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210156212"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"930","last_page":"935"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.16779999434947968,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.16779999434947968,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11890","display_name":"Scientific Measurement and Uncertainty Evaluation","score":0.15049999952316284,"subfield":{"id":"https://openalex.org/subfields/1804","display_name":"Statistics, Probability and Uncertainty"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.13650000095367432,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.7392717003822327},{"id":"https://openalex.org/keywords/manufacturing-cost","display_name":"Manufacturing cost","score":0.6721124649047852},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.5846665501594543},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4990668296813965},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4957021474838257},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4888293147087097},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.47450941801071167},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.42257049679756165},{"id":"https://openalex.org/keywords/automatic-test-equipment","display_name":"Automatic test equipment","score":0.4171372354030609},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.41364994645118713},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.41346582770347595},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4062842130661011},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.09340286254882812},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.07774749398231506},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.07493171095848083},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07470783591270447}],"concepts":[{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.7392717003822327},{"id":"https://openalex.org/C2778337023","wikidata":"https://www.wikidata.org/wiki/Q6753108","display_name":"Manufacturing cost","level":2,"score":0.6721124649047852},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.5846665501594543},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4990668296813965},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4957021474838257},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4888293147087097},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.47450941801071167},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42257049679756165},{"id":"https://openalex.org/C141842801","wikidata":"https://www.wikidata.org/wiki/Q363815","display_name":"Automatic test equipment","level":3,"score":0.4171372354030609},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.41364994645118713},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.41346582770347595},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4062842130661011},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.09340286254882812},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.07774749398231506},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.07493171095848083},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07470783591270447},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/date.2004.1269010","is_oa":false,"landing_page_url":"https://doi.org/10.1109/date.2004.1269010","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings Design, Automation and Test in Europe Conference and Exhibition","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W135912228","https://openalex.org/W1506537623","https://openalex.org/W1536055443","https://openalex.org/W2103586022","https://openalex.org/W2127184179","https://openalex.org/W2168209902","https://openalex.org/W2169213530","https://openalex.org/W2542699699","https://openalex.org/W4239237212","https://openalex.org/W6605576318"],"related_works":["https://openalex.org/W2157212570","https://openalex.org/W2543176856","https://openalex.org/W1897203488","https://openalex.org/W2104478015","https://openalex.org/W2616892825","https://openalex.org/W1837475237","https://openalex.org/W2624668974","https://openalex.org/W2146381271","https://openalex.org/W2168820524","https://openalex.org/W3088373974"],"abstract_inverted_index":{"Nanometer":[0],"technology":[1],"enables":[2],"manufacturing":[3,49,58],"of":[4,17,31,48],"very":[5],"large":[6],"SoC":[7],"designs":[8],"that":[9,76],"have":[10],"many":[11],"cores":[12,33],"originating":[13],"from":[14],"a":[15],"variety":[16],"sources.":[18],"The":[19,40,51,60,72],"challenge":[20],"here":[21],"is":[22,43,64,79],"to":[23,44],"integrate":[24],"different":[25],"test":[26,70,85],"solutions":[27],"provided":[28],"by":[29,81],"suppliers":[30],"those":[32],"into":[34],"one":[35],"comprehensive":[36],"chip":[37],"level":[38],"test.":[39,50,59],"principal":[41],"requirement":[42,54],"reduce":[45],"the":[46],"cost":[47,62],"DFT":[52],"methodologies":[53],"supports":[55],"high-quality":[56],"low-cost":[57],"low":[61],"ATE":[63],"used":[65],"for":[66,84],"reducing":[67],"mixed":[68],"signal":[69],"cost.":[71],"new":[73],"fault":[74],"structures":[75],"require":[77],"detection":[78],"done":[80],"ATPG":[82],"engines":[83],"generation":[86],"and":[87],"diagnosis.":[88]},"counts_by_year":[],"updated_date":"2026-07-28T07:46:37.118299","created_date":"2025-10-10T00:00:00"}