{"id":"https://openalex.org/W4414198397","doi":"https://doi.org/10.1109/dac63849.2025.11132784","title":"LVM-MO: A Large Vision Model Pioneer on Full-Chip Mask Optimization","display_name":"LVM-MO: A Large Vision Model Pioneer on Full-Chip Mask Optimization","publication_year":2025,"publication_date":"2025-06-22","ids":{"openalex":"https://openalex.org/W4414198397","doi":"https://doi.org/10.1109/dac63849.2025.11132784"},"language":"en","primary_location":{"id":"doi:10.1109/dac63849.2025.11132784","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dac63849.2025.11132784","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 62nd ACM/IEEE Design Automation Conference (DAC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5104091958","display_name":"Yiwen Wu","orcid":"https://orcid.org/0000-0003-3653-0444"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yiwen Wu","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065963551","display_name":"Yuyang Chen","orcid":"https://orcid.org/0000-0002-0677-8433"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuyang Chen","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100602012","display_name":"Shuo Yin","orcid":"https://orcid.org/0000-0001-7893-8814"},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]},{"id":"https://openalex.org/I4210140242","display_name":"Cyber University of Korea","ror":"https://ror.org/03t85np98","country_code":"KR","type":"education","lineage":["https://openalex.org/I4210140242"]}],"countries":["HK","KR"],"is_corresponding":false,"raw_author_name":"Shuo Yin","raw_affiliation_strings":["CUHK,Dept. CSE"],"affiliations":[{"raw_affiliation_string":"CUHK,Dept. CSE","institution_ids":["https://openalex.org/I4210140242","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5115695307","display_name":"Nan Wang","orcid":"https://orcid.org/0009-0003-9735-4314"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Nan Wang","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103108204","display_name":"Tao Wu","orcid":"https://orcid.org/0000-0003-1563-2994"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tao Wu","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015970030","display_name":"Xuming He","orcid":"https://orcid.org/0000-0003-2150-1237"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuming He","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101413344","display_name":"Hao Geng","orcid":"https://orcid.org/0000-0002-0943-7714"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hao Geng","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101500646","display_name":"Jingyi Yu","orcid":"https://orcid.org/0000-0001-9198-6853"},"institutions":[{"id":"https://openalex.org/I30809798","display_name":"ShanghaiTech University","ror":"https://ror.org/030bhh786","country_code":"CN","type":"education","lineage":["https://openalex.org/I30809798"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jingyi Yu","raw_affiliation_strings":["ShanghaiTech University"],"affiliations":[{"raw_affiliation_string":"ShanghaiTech University","institution_ids":["https://openalex.org/I30809798"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5104091958"],"corresponding_institution_ids":["https://openalex.org/I30809798"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.23439038,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9868000149726868,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9746000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6219000220298767},{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"Optical proximity correction","score":0.6046000123023987},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5094000101089478},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.4706999957561493},{"id":"https://openalex.org/keywords/machine-vision","display_name":"Machine vision","score":0.4672999978065491},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.41019999980926514},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.39719998836517334},{"id":"https://openalex.org/keywords/high-resolution","display_name":"High resolution","score":0.34540000557899475}],"concepts":[{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6219000220298767},{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.6046000123023987},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5906999707221985},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5094000101089478},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4968999922275543},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.4952000081539154},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.4706999957561493},{"id":"https://openalex.org/C5339829","wikidata":"https://www.wikidata.org/wiki/Q1425977","display_name":"Machine vision","level":2,"score":0.4672999978065491},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.41019999980926514},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.39719998836517334},{"id":"https://openalex.org/C3020199158","wikidata":"https://www.wikidata.org/wiki/Q210521","display_name":"High resolution","level":2,"score":0.34540000557899475},{"id":"https://openalex.org/C138268822","wikidata":"https://www.wikidata.org/wiki/Q1051925","display_name":"Resolution (logic)","level":2,"score":0.3237000107765198},{"id":"https://openalex.org/C26760741","wikidata":"https://www.wikidata.org/wiki/Q160402","display_name":"Perception","level":2,"score":0.31949999928474426},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.3156000077724457},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3109000027179718},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3100999891757965},{"id":"https://openalex.org/C137836250","wikidata":"https://www.wikidata.org/wiki/Q984063","display_name":"Optimization problem","level":2,"score":0.27950000762939453},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.2750000059604645},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.27489998936653137},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.27149999141693115},{"id":"https://openalex.org/C164752517","wikidata":"https://www.wikidata.org/wiki/Q5570875","display_name":"Global optimization","level":2,"score":0.26649999618530273},{"id":"https://openalex.org/C193581530","wikidata":"https://www.wikidata.org/wiki/Q683778","display_name":"Structured light","level":2,"score":0.2660999894142151},{"id":"https://openalex.org/C205372480","wikidata":"https://www.wikidata.org/wiki/Q210521","display_name":"Image resolution","level":2,"score":0.2621999979019165},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.2517000138759613}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/dac63849.2025.11132784","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dac63849.2025.11132784","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 62nd ACM/IEEE Design Automation Conference (DAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1975807217","https://openalex.org/W2033627854","https://openalex.org/W2971516606","https://openalex.org/W3013607396","https://openalex.org/W3138516171","https://openalex.org/W3198572068","https://openalex.org/W4367307875","https://openalex.org/W4367307908","https://openalex.org/W4390874575","https://openalex.org/W4392678671","https://openalex.org/W4409248769"],"related_works":[],"abstract_inverted_index":{"Moving":[0],"toward":[1],"the":[2,42,106,144],"post-Moore":[3],"era,":[4],"full-chip":[5,58,81,148],"mask":[6,59,82],"optimization":[7,60,83],"(MO)":[8],"has":[9],"become":[10],"a":[11,37,79,87,97],"pivotal":[12],"step":[13],"for":[14],"semiconductor":[15],"designers":[16],"and":[17,47,71,120,143],"manufacturers":[18],"in":[19,111,136],"extending":[20],"current":[21],"resolution":[22,139],"enhancement":[23],"techniques.":[24],"The":[25],"majority":[26],"of":[27,44,105,109,123,138],"recent":[28],"research":[29],"efforts":[30],"have":[31],"focused":[32],"on":[33,86],"clip-level":[34],"restoration,":[35],"employing":[36],"divide-and-conquer":[38],"approach":[39,95],"to":[40,146],"mitigate":[41],"impacts":[43],"optical":[45,118],"proximity":[46],"process":[48],"bias":[49],"across":[50],"entire":[51],"chips.":[52],"Nevertheless,":[53],"when":[54],"confronted":[55],"with":[56,69,127],"industrial":[57],"challenges,":[61],"these":[62],"works":[63],"exhibit":[64],"limited":[65],"correction":[66,141],"capabilities,":[67],"struggle":[68],"generalization,":[70],"are":[72],"time-inefficient.":[73],"In":[74],"this":[75],"paper,":[76],"we":[77],"propose":[78],"novel":[80],"paradigm":[84],"based":[85],"massive":[88],"lithography":[89],"data-driven":[90],"large":[91],"vision":[92],"model.":[93],"Our":[94],"features":[96],"foundation":[98],"layout":[99],"feature":[100],"extractor,":[101],"which":[102],"is":[103],"aware":[104],"mutual":[107],"influence":[108],"polygons":[110],"long-range":[112],"pattern":[113],"perception":[114],"as":[115,117],"well":[116],"physics":[119],"chemical":[121],"characteristics":[122],"lithography,":[124],"matters.":[125],"Compared":[126],"state-of-the-art":[128],"(SOTA)":[129],"works,":[130],"our":[131],"work":[132],"demonstrates":[133],"significant":[134],"advantages":[135],"terms":[137],"fidelity,":[140],"speed,":[142],"ability":[145],"handle":[147],"scale":[149],"layouts.":[150]},"counts_by_year":[],"updated_date":"2026-04-09T08:11:56.329763","created_date":"2025-10-10T00:00:00"}