{"id":"https://openalex.org/W4386764043","doi":"https://doi.org/10.1109/dac56929.2023.10247752","title":"Toward Optimal Filler Cell Insertion with Complex Implant Layer Constraints","display_name":"Toward Optimal Filler Cell Insertion with Complex Implant Layer Constraints","publication_year":2023,"publication_date":"2023-07-09","ids":{"openalex":"https://openalex.org/W4386764043","doi":"https://doi.org/10.1109/dac56929.2023.10247752"},"language":"en","primary_location":{"id":"doi:10.1109/dac56929.2023.10247752","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dac56929.2023.10247752","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 60th ACM/IEEE Design Automation Conference (DAC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5002478857","display_name":"Peng Zou","orcid":"https://orcid.org/0000-0002-8345-0976"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Zou","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045304391","display_name":"Guohao Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guohao Chen","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101664594","display_name":"Zhifeng Lin","orcid":"https://orcid.org/0000-0002-4597-4322"},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhifeng Lin","raw_affiliation_strings":["Fuzhou University,Center for Discrete Mathematics and Theoretical Computer Science,Fuzhou,China","Center for Discrete Mathematics and Theoretical Computer Science, Fuzhou University, Fuzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fuzhou University,Center for Discrete Mathematics and Theoretical Computer Science,Fuzhou,China","institution_ids":["https://openalex.org/I80947539"]},{"raw_affiliation_string":"Center for Discrete Mathematics and Theoretical Computer Science, Fuzhou University, Fuzhou, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084275232","display_name":"Jun Yu","orcid":"https://orcid.org/0000-0003-2360-5873"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Yu","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101854580","display_name":"Jianli Chen","orcid":"https://orcid.org/0000-0002-1391-2696"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianli Chen","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/filler","display_name":"Filler (materials)","score":0.6133471727371216},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5778864622116089},{"id":"https://openalex.org/keywords/identifier","display_name":"Identifier","score":0.5489448308944702},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5412243604660034},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4742029011249542},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.41653937101364136},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.4050742983818054},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2558304965496063},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1969248354434967},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.17244523763656616},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.11972689628601074},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09991520643234253},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09393838047981262}],"concepts":[{"id":"https://openalex.org/C2778223994","wikidata":"https://www.wikidata.org/wiki/Q905592","display_name":"Filler (materials)","level":2,"score":0.6133471727371216},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5778864622116089},{"id":"https://openalex.org/C154504017","wikidata":"https://www.wikidata.org/wiki/Q853614","display_name":"Identifier","level":2,"score":0.5489448308944702},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5412243604660034},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4742029011249542},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.41653937101364136},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.4050742983818054},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2558304965496063},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1969248354434967},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.17244523763656616},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.11972689628601074},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09991520643234253},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09393838047981262},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/dac56929.2023.10247752","is_oa":false,"landing_page_url":"https://doi.org/10.1109/dac56929.2023.10247752","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 60th ACM/IEEE Design Automation Conference (DAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2022147648","https://openalex.org/W2046053394","https://openalex.org/W2060631289","https://openalex.org/W2131862714","https://openalex.org/W2398997130","https://openalex.org/W2535234615","https://openalex.org/W2584186471","https://openalex.org/W2899615972","https://openalex.org/W3093788071","https://openalex.org/W4254095899","https://openalex.org/W4280546382"],"related_works":["https://openalex.org/W2094969048","https://openalex.org/W994558755","https://openalex.org/W3035935536","https://openalex.org/W2010746423","https://openalex.org/W2372119205","https://openalex.org/W2117710422","https://openalex.org/W1987106725","https://openalex.org/W1787300689","https://openalex.org/W4283270028","https://openalex.org/W1891369868"],"abstract_inverted_index":{"Modern":[0],"circuits":[1],"often":[2],"contain":[3],"standard":[4],"cells":[5,29],"of":[6,119],"different":[7],"threshold":[8],"voltages":[9],"(multi-VTs)":[10],"to":[11,22,54,77,91,105],"achieve":[12],"a":[13,49,85,100],"better":[14],"trade-off":[15],"between":[16],"timing":[17],"and":[18,51,65,140],"power":[19],"consumption.":[20],"Due":[21],"the":[23,27,37,56,93,117,131],"heterogeneous":[24],"cell":[25,41],"structures,":[26],"multi-VTs":[28],"impose":[30],"various":[31],"implant":[32,62,94],"layer":[33,63,95],"constraints,":[34],"further":[35,106],"complicating":[36],"already":[38],"time-consuming":[39],"filler":[40,57,67,146],"insertion":[42,58,87,147],"process.":[43],"In":[44],"this":[45],"paper,":[46],"we":[47,98,134],"present":[48],"fast":[50],"near-optimal":[52],"algorithm":[53,76,114],"solve":[55,141],"problem":[59],"with":[60,123,127],"complex":[61],"rules":[64],"minimum":[66],"width":[68],"constraints.":[69],"We":[70],"first":[71],"propose":[72],"an":[73],"inference-driven":[74],"detecting":[75],"identify":[78],"each":[79],"design":[80,99],"rule":[81],"violation":[82,102],"accurately.":[83],"Then,":[84],"dynamic-programming-based":[86],"method":[88],"is":[89],"developed":[90],"reduce":[92,116],"violations.":[96],"Finally,":[97],"contour-driven":[101],"refinement":[103],"strategy":[104],"improve":[107],"manufacturability.":[108],"Experimental":[109],"results":[110],"show":[111],"that":[112],"our":[113,128],"can":[115,135],"number":[118],"violations":[120,144],"significantly":[121],"compared":[122],"state-of-the-art":[124],"works.":[125],"Besides,":[126],"identifier":[129],"in":[130,138,148],"legalization":[132],"stage,":[133],"avoid":[136],"conflicts":[137],"advance":[139],"almost":[142],"all":[143],"after":[145],"industrial":[149],"cases.":[150]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}