{"id":"https://openalex.org/W2131327859","doi":"https://doi.org/10.1109/cscwd.2012.6221923","title":"A new morphology-based approach for similarity searching on wafer bin maps in semiconductor manufacturing","display_name":"A new morphology-based approach for similarity searching on wafer bin maps in semiconductor manufacturing","publication_year":2012,"publication_date":"2012-05-01","ids":{"openalex":"https://openalex.org/W2131327859","doi":"https://doi.org/10.1109/cscwd.2012.6221923","mag":"2131327859"},"language":"en","primary_location":{"id":"doi:10.1109/cscwd.2012.6221923","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2012.6221923","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 IEEE 16th International Conference on Computer Supported Cooperative Work in Design (CSCWD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006961093","display_name":"Tsung-Jung Hsieh","orcid":"https://orcid.org/0000-0002-5838-0582"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tsung-Jung Hsieh","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005241000","display_name":"Chung-Shou Liao","orcid":"https://orcid.org/0000-0001-9196-4478"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chung-Shou Liao","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008979006","display_name":"Yu-Syuan Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Syuan Huang","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020132059","display_name":"Chen\u2013Fu Chien","orcid":"https://orcid.org/0000-0003-3328-4946"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chen-Fu Chien","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsinghua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management, National Tsing Hua University, NTHU, Hsinchu 300, Taiwan ROC","institution_ids":["https://openalex.org/I25846049"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I25846049"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":null,"first_page":"869","last_page":"874"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9929999709129333,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/similarity","display_name":"Similarity (geometry)","score":0.6743571758270264},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.665512204170227},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6312556266784668},{"id":"https://openalex.org/keywords/categorization","display_name":"Categorization","score":0.6041790843009949},{"id":"https://openalex.org/keywords/support-vector-machine","display_name":"Support vector machine","score":0.5886819958686829},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5746332406997681},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.5457337498664856},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.5327727198600769},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5216924548149109},{"id":"https://openalex.org/keywords/dimension","display_name":"Dimension (graph theory)","score":0.49641114473342896},{"id":"https://openalex.org/keywords/sample","display_name":"Sample (material)","score":0.45548099279403687},{"id":"https://openalex.org/keywords/bin","display_name":"Bin","score":0.41544416546821594},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.3642394542694092},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.3418264389038086},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.214165598154068},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.19921335577964783},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.16323420405387878},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.08703413605690002}],"concepts":[{"id":"https://openalex.org/C103278499","wikidata":"https://www.wikidata.org/wiki/Q254465","display_name":"Similarity (geometry)","level":3,"score":0.6743571758270264},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.665512204170227},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6312556266784668},{"id":"https://openalex.org/C94124525","wikidata":"https://www.wikidata.org/wiki/Q912550","display_name":"Categorization","level":2,"score":0.6041790843009949},{"id":"https://openalex.org/C12267149","wikidata":"https://www.wikidata.org/wiki/Q282453","display_name":"Support vector machine","level":2,"score":0.5886819958686829},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5746332406997681},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.5457337498664856},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.5327727198600769},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5216924548149109},{"id":"https://openalex.org/C33676613","wikidata":"https://www.wikidata.org/wiki/Q13415176","display_name":"Dimension (graph theory)","level":2,"score":0.49641114473342896},{"id":"https://openalex.org/C198531522","wikidata":"https://www.wikidata.org/wiki/Q485146","display_name":"Sample (material)","level":2,"score":0.45548099279403687},{"id":"https://openalex.org/C156273044","wikidata":"https://www.wikidata.org/wiki/Q4913766","display_name":"Bin","level":2,"score":0.41544416546821594},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.3642394542694092},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.3418264389038086},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.214165598154068},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.19921335577964783},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.16323420405387878},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08703413605690002},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cscwd.2012.6221923","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2012.6221923","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 IEEE 16th International Conference on Computer Supported Cooperative Work in Design (CSCWD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5899999737739563,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W150019511","https://openalex.org/W1528719827","https://openalex.org/W1965266460","https://openalex.org/W1985914844","https://openalex.org/W2007218960","https://openalex.org/W2016973091","https://openalex.org/W2032437475","https://openalex.org/W2049151613","https://openalex.org/W2056945148","https://openalex.org/W2119821739","https://openalex.org/W2132549764","https://openalex.org/W2147709193","https://openalex.org/W2149684865","https://openalex.org/W2156909104","https://openalex.org/W2170193684","https://openalex.org/W2172000360","https://openalex.org/W4239510810","https://openalex.org/W6631569088"],"related_works":["https://openalex.org/W2107701374","https://openalex.org/W2950072893","https://openalex.org/W2165912799","https://openalex.org/W1616588898","https://openalex.org/W2735662278","https://openalex.org/W4249504934","https://openalex.org/W151699219","https://openalex.org/W2085633464","https://openalex.org/W2992897358","https://openalex.org/W2631724279"],"abstract_inverted_index":{"Due":[0],"to":[1,40,84,104,122],"increases":[2],"in":[3,9,102,125,138,144],"the":[4,42,73,85,117,133,139],"complexity":[5],"of":[6,25,31,44,88,96,119,135,141],"processes":[7],"involved":[8],"semiconductor":[10,145],"manufacturing,":[11],"increasingly":[12],"high":[13],"inspection":[14],"costs":[15],"associated":[16],"with":[17],"defective":[18],"wafers":[19],"has":[20],"become":[21],"a":[22,59],"critical":[23],"concern":[24],"modern":[26],"manufacturers.":[27],"More":[28],"importantly,":[29],"because":[30],"high-dimensional":[32],"wafer":[33],"bin":[34],"maps":[35],"(WBMs),":[36],"it":[37],"is":[38],"difficult":[39],"capture":[41],"variations":[43],"each":[45],"dimension":[46],"via":[47],"traditional":[48],"pattern":[49,120],"recognition":[50,121],"or":[51],"classification":[52],"methods.":[53],"By":[54],"contrast,":[55],"this":[56],"work":[57],"proposes":[58],"novel":[60],"two-phase":[61],"morphology-based":[62,91],"similarity":[63,114],"search":[64],"consisting":[65],"of:":[66],"(1)":[67],"training":[68],"sample":[69,127],"generation":[70],"based":[71],"on":[72],"morphological":[74],"method":[75],"and":[76],"(2)":[77],"SVM":[78,112],"categorization":[79],"for":[80,113],"test":[81],"datasets":[82],"according":[83],"variant":[86],"degrees":[87],"similarities.":[89],"The":[90,108,129],"samples":[92],"contain":[93],"five":[94],"kinds":[95],"features,":[97],"including":[98],"original":[99],"morphology":[100],"definitions":[101],"addition":[103],"our":[105,136],"proposed":[106],"features.":[107],"second":[109],"phase,":[110],"using":[111],"searches,":[115],"extends":[116],"usage":[118],"real":[123],"applications":[124],"large":[126],"dimensions.":[128],"preliminary":[130],"results":[131],"demonstrate":[132],"usefulness":[134],"approach":[137],"context":[140],"yield":[142],"improvements":[143],"manufacturing.":[146]},"counts_by_year":[{"year":2021,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}