{"id":"https://openalex.org/W2124154749","doi":"https://doi.org/10.1109/cscwd.2012.6221901","title":"An integrated and improved dispatching approach to reduce cycle time of wet etch and furnace operations in semiconductor fabrication","display_name":"An integrated and improved dispatching approach to reduce cycle time of wet etch and furnace operations in semiconductor fabrication","publication_year":2012,"publication_date":"2012-05-01","ids":{"openalex":"https://openalex.org/W2124154749","doi":"https://doi.org/10.1109/cscwd.2012.6221901","mag":"2124154749"},"language":"en","primary_location":{"id":"doi:10.1109/cscwd.2012.6221901","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2012.6221901","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 IEEE 16th International Conference on Computer Supported Cooperative Work in Design (CSCWD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061056892","display_name":"Chia-Yu Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Yu Chang","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management National Tsing Hua University, Taiwan","Dept. of Industrial Engineering and Engineering Management, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Dept. of Industrial Engineering and Engineering Management, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028910589","display_name":"Kuo-Hao Chang","orcid":"https://orcid.org/0000-0002-3828-960X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuo-Hao Chang","raw_affiliation_strings":["Department of Industrial Engineering and Engineering Management National Tsing Hua University, Taiwan","Dept. of Industrial Engineering and Engineering Management, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering and Engineering Management National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Dept. of Industrial Engineering and Engineering Management, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I25846049"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"734","last_page":"741"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12176","display_name":"Optimization and Packing Problems","score":0.988099992275238,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.7539085745811462},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6478939652442932},{"id":"https://openalex.org/keywords/selection","display_name":"Selection (genetic algorithm)","score":0.6031908988952637},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5821570158004761},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.37628400325775146},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.3642171025276184},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3531769812107086},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26836392283439636},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08265140652656555}],"concepts":[{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.7539085745811462},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6478939652442932},{"id":"https://openalex.org/C81917197","wikidata":"https://www.wikidata.org/wiki/Q628760","display_name":"Selection (genetic algorithm)","level":2,"score":0.6031908988952637},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5821570158004761},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.37628400325775146},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.3642171025276184},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3531769812107086},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26836392283439636},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08265140652656555},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cscwd.2012.6221901","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2012.6221901","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 IEEE 16th International Conference on Computer Supported Cooperative Work in Design (CSCWD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1612003148","https://openalex.org/W1880262756","https://openalex.org/W2014034914","https://openalex.org/W2024916210","https://openalex.org/W2074334106","https://openalex.org/W2089150068","https://openalex.org/W2102837457","https://openalex.org/W2123775065","https://openalex.org/W2126707169","https://openalex.org/W2132273100","https://openalex.org/W2134071838","https://openalex.org/W2134731454","https://openalex.org/W2135527346","https://openalex.org/W2159602768","https://openalex.org/W2170726572","https://openalex.org/W2322096602","https://openalex.org/W2384510379","https://openalex.org/W4235505822","https://openalex.org/W4237791300","https://openalex.org/W6636440780","https://openalex.org/W6989907535"],"related_works":["https://openalex.org/W1571475181","https://openalex.org/W2053663974","https://openalex.org/W2077328348","https://openalex.org/W2384968155","https://openalex.org/W303715527","https://openalex.org/W2080254140","https://openalex.org/W2097417402","https://openalex.org/W2367557013","https://openalex.org/W2226740602","https://openalex.org/W2170887603"],"abstract_inverted_index":{"The":[0],"dispatching":[1,41],"rules":[2,42],"for":[3,88],"the":[4,15,48,57,60,83,96,102,109],"process":[5],"of":[6,18,59],"wet":[7],"etch":[8],"and":[9,25,43,52,82],"furnace":[10],"are":[11],"complex":[12],"due":[13],"to":[14,46,108],"multiple":[16],"considerations":[17],"waiting":[19],"time":[20,104],"constraints,":[21],"batch":[22],"size":[23],"forming,":[24],"load":[26],"balancing.":[27],"This":[28],"paper":[29],"proposes":[30],"an":[31,65],"effective":[32],"three-stage":[33],"approach":[34,98],"based":[35,68],"on":[36,69],"multi-factors":[37],"selection,":[38],"integrating":[39],"developed":[40,97],"LR-ratio":[44],"method,":[45],"decide":[47],"most":[49],"appropriate":[50],"scheduler":[51],"sequencing":[53],"order.":[54],"To":[55],"verify":[56],"viability":[58],"proposed":[61,84],"approach,":[62],"we":[63],"conduct":[64],"empirical":[66],"study":[67],"real":[70],"data":[71],"collected":[72],"in":[73],"a":[74],"semiconductor":[75],"manufacturing.":[76],"A":[77],"simulation":[78],"model":[79],"is":[80,86],"constructed":[81],"method":[85],"applied":[87],"evaluating":[89],"its":[90],"performance.":[91],"Numerical":[92],"results":[93],"show":[94],"that":[95],"can":[99],"significantly":[100],"reduce":[101],"cycle":[103],"by":[105],"8%":[106],"compared":[107],"existing":[110],"approach.":[111]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}