{"id":"https://openalex.org/W2167378621","doi":"https://doi.org/10.1109/cscwd.2010.5471872","title":"Structural optimization of honeycomb paperboard mould by sensitivity analysis","display_name":"Structural optimization of honeycomb paperboard mould by sensitivity analysis","publication_year":2010,"publication_date":"2010-04-01","ids":{"openalex":"https://openalex.org/W2167378621","doi":"https://doi.org/10.1109/cscwd.2010.5471872","mag":"2167378621"},"language":"en","primary_location":{"id":"doi:10.1109/cscwd.2010.5471872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2010.5471872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 2010 14th International Conference on Computer Supported Cooperative Work in Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060147560","display_name":"Suchang Ma","orcid":null},"institutions":[{"id":"https://openalex.org/I133270356","display_name":"Tianjin University of Technology and Education","ror":"https://ror.org/035gwtk09","country_code":"CN","type":"education","lineage":["https://openalex.org/I133270356"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Ma Suchang","raw_affiliation_strings":["Tianjin Key Laboratory of High Speed Cutting &Precision Machining, Tianjin University of Technology and Education, Tianjin, China"],"affiliations":[{"raw_affiliation_string":"Tianjin Key Laboratory of High Speed Cutting &Precision Machining, Tianjin University of Technology and Education, Tianjin, China","institution_ids":["https://openalex.org/I133270356"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Liu Xuebin","orcid":null},"institutions":[{"id":"https://openalex.org/I133270356","display_name":"Tianjin University of Technology and Education","ror":"https://ror.org/035gwtk09","country_code":"CN","type":"education","lineage":["https://openalex.org/I133270356"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liu Xuebin","raw_affiliation_strings":["Tianjin Key Laboratory of High Speed Cutting & Precision Machining, Tianjin University of Technology and Education, Tianjin, China"],"affiliations":[{"raw_affiliation_string":"Tianjin Key Laboratory of High Speed Cutting & Precision Machining, Tianjin University of Technology and Education, Tianjin, China","institution_ids":["https://openalex.org/I133270356"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101552575","display_name":"Wei Zhao","orcid":"https://orcid.org/0000-0002-2895-7192"},"institutions":[{"id":"https://openalex.org/I133270356","display_name":"Tianjin University of Technology and Education","ror":"https://ror.org/035gwtk09","country_code":"CN","type":"education","lineage":["https://openalex.org/I133270356"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhao Wei","raw_affiliation_strings":["Tianjin Key Laboratory of High Speed Cutting &Precision Machining, Tianjin University of Technology and Education, Tianjin, China"],"affiliations":[{"raw_affiliation_string":"Tianjin Key Laboratory of High Speed Cutting &Precision Machining, Tianjin University of Technology and Education, Tianjin, China","institution_ids":["https://openalex.org/I133270356"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5060147560"],"corresponding_institution_ids":["https://openalex.org/I133270356"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.17734276,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"33","issue":null,"first_page":"778","last_page":"782"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.942799985408783,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.942799985408783,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10707","display_name":"Cellular and Composite Structures","score":0.9208999872207642,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/paperboard","display_name":"Paperboard","score":0.9783836603164673},{"id":"https://openalex.org/keywords/honeycomb","display_name":"Honeycomb","score":0.8539917469024658},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.6714242696762085},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.5607340335845947},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.5088884830474854},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4698461592197418},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.4561774432659149},{"id":"https://openalex.org/keywords/honeycomb-structure","display_name":"Honeycomb structure","score":0.4558606743812561},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3541889488697052},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18869441747665405}],"concepts":[{"id":"https://openalex.org/C193987312","wikidata":"https://www.wikidata.org/wiki/Q14934005","display_name":"Paperboard","level":2,"score":0.9783836603164673},{"id":"https://openalex.org/C145665481","wikidata":"https://www.wikidata.org/wiki/Q123339","display_name":"Honeycomb","level":2,"score":0.8539917469024658},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.6714242696762085},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.5607340335845947},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.5088884830474854},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4698461592197418},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4561774432659149},{"id":"https://openalex.org/C171736797","wikidata":"https://www.wikidata.org/wiki/Q1934298","display_name":"Honeycomb structure","level":2,"score":0.4558606743812561},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3541889488697052},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18869441747665405},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cscwd.2010.5471872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cscwd.2010.5471872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 2010 14th International Conference on Computer Supported Cooperative Work in Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2372956013","https://openalex.org/W2351400080","https://openalex.org/W2364717720","https://openalex.org/W2121135815","https://openalex.org/W2354262561","https://openalex.org/W2382987663","https://openalex.org/W2361785448","https://openalex.org/W2739756059","https://openalex.org/W3015630144","https://openalex.org/W2365941427"],"abstract_inverted_index":{"Taking":[0,41],"the":[1,7,32,49,52,66,70],"honeycomb":[2,20,71],"paperboard":[3,21,72],"mould":[4,22,73],"for":[5],"example,":[6],"sensitivity":[8,39],"analysis":[9,37],"and":[10,38,45,75],"structural":[11,53],"optimization":[12,54],"are":[13,29],"studied":[14],"under":[15],"Pro/MECHANICA.":[16],"Three-dimensional":[17],"model":[18],"of":[19,34,55,69,78],"is":[23,57],"built.":[24],"The":[25],"important":[26],"design":[27],"parameters":[28],"determined":[30],"by":[31],"structure":[33],"punch":[35,56],"static":[36],"analysis.":[40],"minimum":[42,46],"stress,":[43],"strain":[44],"deformation":[47],"as":[48],"target":[50],"function,":[51],"finished.":[58],"Study":[59],"shows":[60],"that":[61],"this":[62],"method":[63],"can":[64],"solute":[65],"fatigue":[67],"failures":[68],"effectively":[74],"enhance":[76],"efficiency":[77],"optimal":[79],"design.":[80]},"counts_by_year":[],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}