{"id":"https://openalex.org/W2624767903","doi":"https://doi.org/10.1109/coolchips.2017.7946383","title":"A 216 GOPS flexible WDR Image Processor for ADAS SoC","display_name":"A 216 GOPS flexible WDR Image Processor for ADAS SoC","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2624767903","doi":"https://doi.org/10.1109/coolchips.2017.7946383","mag":"2624767903"},"language":"en","primary_location":{"id":"doi:10.1109/coolchips.2017.7946383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coolchips.2017.7946383","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044937170","display_name":"Mihir Mody","orcid":null},"institutions":[{"id":"https://openalex.org/I4210109535","display_name":"Texas Instruments (India)","ror":"https://ror.org/01t305n31","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210109535","https://openalex.org/I74760111"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Mihir Mody","raw_affiliation_strings":["Texas Instruments, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Bangalore, India","institution_ids":["https://openalex.org/I4210109535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064188494","display_name":"Hetul Sanghvi","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hetul Sanghvi","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017947135","display_name":"Niraj Nandan","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Niraj Nandan","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010369693","display_name":"Shashank Dabral","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shashank Dabral","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021348817","display_name":"Rajasekhar Allu","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rajasekhar Allu","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059790346","display_name":"Rajat Sagar","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rajat Sagar","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023124766","display_name":"Kedar Chitnis","orcid":null},"institutions":[{"id":"https://openalex.org/I4210109535","display_name":"Texas Instruments (India)","ror":"https://ror.org/01t305n31","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210109535","https://openalex.org/I74760111"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Kedar Chitnis","raw_affiliation_strings":["Texas Instruments, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Bangalore, India","institution_ids":["https://openalex.org/I4210109535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034046011","display_name":"Jason Jones","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jason Jones","raw_affiliation_strings":["Texas Instruments, Houston, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Houston, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112511078","display_name":"Brijesh Jadhav","orcid":null},"institutions":[{"id":"https://openalex.org/I4210109535","display_name":"Texas Instruments (India)","ror":"https://ror.org/01t305n31","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210109535","https://openalex.org/I74760111"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Brijesh Jadhav","raw_affiliation_strings":["Texas Instruments, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Bangalore, India","institution_ids":["https://openalex.org/I4210109535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008646560","display_name":"Sujith Shivalingappa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210109535","display_name":"Texas Instruments (India)","ror":"https://ror.org/01t305n31","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210109535","https://openalex.org/I74760111"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Sujith Shivalingappa","raw_affiliation_strings":["Texas Instruments, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Bangalore, India","institution_ids":["https://openalex.org/I4210109535"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036115173","display_name":"Aish Dubey","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aish Dubey","raw_affiliation_strings":["Texas Instruments, Dallas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5044937170"],"corresponding_institution_ids":["https://openalex.org/I4210109535"],"apc_list":null,"apc_paid":null,"fwci":0.2867,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.58179347,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"46","issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12153","display_name":"Advanced Optical Sensing Technologies","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12389","display_name":"Infrared Target Detection Methodologies","score":0.9793000221252441,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7328452467918396},{"id":"https://openalex.org/keywords/safer","display_name":"SAFER","score":0.5621809363365173},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.529995858669281},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5228081941604614},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5181695222854614},{"id":"https://openalex.org/keywords/advanced-driver-assistance-systems","display_name":"Advanced driver assistance systems","score":0.4938114583492279},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3843011260032654},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.3670099377632141},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.34451109170913696},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.21027988195419312},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16425171494483948},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11479157209396362},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.08097833395004272}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7328452467918396},{"id":"https://openalex.org/C2776654903","wikidata":"https://www.wikidata.org/wiki/Q2601463","display_name":"SAFER","level":2,"score":0.5621809363365173},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.529995858669281},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5228081941604614},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5181695222854614},{"id":"https://openalex.org/C87833898","wikidata":"https://www.wikidata.org/wiki/Q1060280","display_name":"Advanced driver assistance systems","level":2,"score":0.4938114583492279},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3843011260032654},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.3670099377632141},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.34451109170913696},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.21027988195419312},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16425171494483948},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11479157209396362},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.08097833395004272},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/coolchips.2017.7946383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coolchips.2017.7946383","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1986086848","https://openalex.org/W2007614029","https://openalex.org/W2077106471","https://openalex.org/W2125719717","https://openalex.org/W2127575220","https://openalex.org/W6652123063"],"related_works":["https://openalex.org/W2953205341","https://openalex.org/W2092643327","https://openalex.org/W235065745","https://openalex.org/W2029935773","https://openalex.org/W2787754950","https://openalex.org/W1979131826","https://openalex.org/W2370066713","https://openalex.org/W1984979050","https://openalex.org/W2978161533","https://openalex.org/W2379338802"],"abstract_inverted_index":{"Advanced":[0],"Driver":[1],"Assistance":[2],"Systems":[3],"(ADAS)":[4],"enhance":[5],"the":[6,28,40,61,79],"ability":[7],"of":[8,31,42,44,56,60,78,91,103,109,115],"a":[9,19,47],"vehicle":[10],"driver":[11],"to":[12,86],"avoid":[13],"possible":[14],"road":[15],"accidents":[16],"resulting":[17],"in":[18,39],"safer":[20],"driving":[21],"experience.":[22],"Front":[23],"camera":[24],"ADAS":[25],"is":[26,84],"probably":[27],"most":[29],"challenging":[30],"all.":[32],"These":[33],"systems":[34],"require":[35],"high":[36],"computational":[37],"processing,":[38],"range":[41],"hundreds":[43],"GOPS,":[45],"within":[46],"4":[48],"Watt":[49],"power":[50,113],"budget":[51],"driven":[52],"by":[53],"thermal":[54],"constraints":[55],"small":[57],"enclosed":[58],"assembly":[59],"final":[62],"system.":[63],"In":[64],"this":[65],"paper,":[66],"we":[67],"present,":[68],"Wide":[69],"Dynamic":[70],"Image":[71],"(WDR":[72],"or":[73],"HDR)":[74],"Processor":[75],"as":[76],"part":[77],"Imaging":[80],"Sub-system":[81],"(ISS)":[82],"that":[83],"flexible":[85],"interface":[87],"with":[88,106],"various":[89],"kinds":[90],"optical":[92],"sensor":[93],"across":[94],"different":[95],"manufactures.":[96],"The":[97],"design":[98],"achieves":[99],"an":[100],"overall":[101],"throughput":[102],"216":[104],"GOPS":[105],"performance":[107],"efficiency":[108],"66.4":[110],"GOPS/mm2":[111],"and":[112],"efficiently":[114],"1.8":[116],"TOPS/W.":[117]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}