{"id":"https://openalex.org/W2974150280","doi":"https://doi.org/10.1109/coase.2019.8842835","title":"Optical In-Situ Verification of 3D-Printed Electronic Circuits","display_name":"Optical In-Situ Verification of 3D-Printed Electronic Circuits","publication_year":2019,"publication_date":"2019-08-01","ids":{"openalex":"https://openalex.org/W2974150280","doi":"https://doi.org/10.1109/coase.2019.8842835","mag":"2974150280"},"language":"en","primary_location":{"id":"doi:10.1109/coase.2019.8842835","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coase.2019.8842835","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009305666","display_name":"Florens Wasserfall","orcid":"https://orcid.org/0000-0002-2641-045X"},"institutions":[{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Florens Wasserfall","raw_affiliation_strings":["Computer Science Department, University of Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science Department, University of Hamburg, Germany","institution_ids":["https://openalex.org/I159176309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067654537","display_name":"Daniel Ahlers","orcid":"https://orcid.org/0000-0002-9751-626X"},"institutions":[{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Daniel Ahlers","raw_affiliation_strings":["Computer Science Department, University of Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science Department, University of Hamburg, Germany","institution_ids":["https://openalex.org/I159176309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086095248","display_name":"Norman Hendrich","orcid":"https://orcid.org/0000-0003-0499-886X"},"institutions":[{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Norman Hendrich","raw_affiliation_strings":["Computer Science Department, University of Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science Department, University of Hamburg, Germany","institution_ids":["https://openalex.org/I159176309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I159176309"],"apc_list":null,"apc_paid":null,"fwci":0.8931,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.77423649,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1302","last_page":"1307"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fused-deposition-modeling","display_name":"Fused deposition modeling","score":0.6375126838684082},{"id":"https://openalex.org/keywords/slicing","display_name":"Slicing","score":0.5922864079475403},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5887219309806824},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5668438673019409},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5531399250030518},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5239113569259644},{"id":"https://openalex.org/keywords/nozzle","display_name":"Nozzle","score":0.5019991397857666},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4819362163543701},{"id":"https://openalex.org/keywords/digital-light-processing","display_name":"Digital Light Processing","score":0.47199371457099915},{"id":"https://openalex.org/keywords/process-control","display_name":"Process control","score":0.4370338022708893},{"id":"https://openalex.org/keywords/conductive-ink","display_name":"Conductive ink","score":0.4313977360725403},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.42922353744506836},{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"Surface-mount technology","score":0.41876447200775146},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.37277141213417053},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3363451361656189},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2519705891609192},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.24492785334587097},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24331465363502502},{"id":"https://openalex.org/keywords/computer-graphics","display_name":"Computer graphics (images)","score":0.20343026518821716},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.11053326725959778}],"concepts":[{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.6375126838684082},{"id":"https://openalex.org/C2776190703","wikidata":"https://www.wikidata.org/wiki/Q488148","display_name":"Slicing","level":2,"score":0.5922864079475403},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5887219309806824},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5668438673019409},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5531399250030518},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5239113569259644},{"id":"https://openalex.org/C56200935","wikidata":"https://www.wikidata.org/wiki/Q250840","display_name":"Nozzle","level":2,"score":0.5019991397857666},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4819362163543701},{"id":"https://openalex.org/C64434820","wikidata":"https://www.wikidata.org/wiki/Q523366","display_name":"Digital Light Processing","level":3,"score":0.47199371457099915},{"id":"https://openalex.org/C155386361","wikidata":"https://www.wikidata.org/wiki/Q1649571","display_name":"Process control","level":3,"score":0.4370338022708893},{"id":"https://openalex.org/C2777892344","wikidata":"https://www.wikidata.org/wiki/Q5159386","display_name":"Conductive ink","level":4,"score":0.4313977360725403},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.42922353744506836},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.41876447200775146},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.37277141213417053},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3363451361656189},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2519705891609192},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.24492785334587097},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24331465363502502},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.20343026518821716},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.11053326725959778},{"id":"https://openalex.org/C66825105","wikidata":"https://www.wikidata.org/wiki/Q354718","display_name":"Sheet resistance","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2776865275","wikidata":"https://www.wikidata.org/wiki/Q311666","display_name":"Projector","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/coase.2019.8842835","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coase.2019.8842835","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6499999761581421,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":36,"referenced_works":["https://openalex.org/W1928555012","https://openalex.org/W1965009340","https://openalex.org/W1985357212","https://openalex.org/W1986529266","https://openalex.org/W2004241456","https://openalex.org/W2015954192","https://openalex.org/W2023493287","https://openalex.org/W2036931096","https://openalex.org/W2040732657","https://openalex.org/W2047947115","https://openalex.org/W2048524052","https://openalex.org/W2101544546","https://openalex.org/W2112565951","https://openalex.org/W2131828811","https://openalex.org/W2147555557","https://openalex.org/W2165949425","https://openalex.org/W2169042200","https://openalex.org/W2269560032","https://openalex.org/W2328269487","https://openalex.org/W2516346785","https://openalex.org/W2602037269","https://openalex.org/W2610436976","https://openalex.org/W2611819392","https://openalex.org/W2614031074","https://openalex.org/W2769827769","https://openalex.org/W2886783527","https://openalex.org/W3035462784","https://openalex.org/W3205609479","https://openalex.org/W3209482482","https://openalex.org/W3212266843","https://openalex.org/W4206610958","https://openalex.org/W6693985447","https://openalex.org/W6737709473","https://openalex.org/W6779253360","https://openalex.org/W6803059425","https://openalex.org/W6803344173"],"related_works":["https://openalex.org/W2393746923","https://openalex.org/W2075756453","https://openalex.org/W3006900399","https://openalex.org/W2943103049","https://openalex.org/W4367187299","https://openalex.org/W4235482809","https://openalex.org/W1496119948","https://openalex.org/W2907790441","https://openalex.org/W2908174425","https://openalex.org/W4312214999"],"abstract_inverted_index":{"With":[0],"3D-Printing":[1],"becoming":[2],"a":[3,41,52],"mainstream":[4],"technology":[5],"in":[6],"industry,":[7],"the":[8,67,93,96],"need":[9],"for":[10,25,49,59],"online":[11],"process":[12,63],"inspection":[13,27,97],"and":[14,56,62,78,102],"quality":[15],"control":[16],"arises.":[17],"In":[18],"this":[19],"paper,":[20],"we":[21],"propose":[22],"an":[23,46],"approach":[24],"optical":[26],"of":[28,95],"fused":[29],"deposition":[30],"modeling":[31],"(FDM)":[32],"printing":[33,72],"with":[34,45],"integrated":[35],"electronics.":[36],"Our":[37],"prototype":[38],"setup":[39],"combines":[40],"traditional":[42],"FDM":[43],"extruder":[44,48],"additional":[47],"conductive":[50],"ink,":[51],"vacuum":[53],"pick-and-place":[54],"nozzle,":[55],"two":[57],"cameras":[58],"object":[60],"alignment":[61],"control.":[64],"We":[65,90],"describe":[66,92],"camera":[68],"setup,":[69],"show":[70],"typical":[71],"faults":[73],"encountered":[74],"on":[75],"our":[76,80],"system,":[77],"explain":[79],"computer":[81],"vision":[82],"algorithms":[83],"to":[84],"detect":[85],"(and":[86],"repair)":[87],"those":[88],"faults.":[89],"also":[91],"integration":[94],"modules":[98],"into":[99],"existing":[100],"slicing-":[101],"3D-printsoftware.":[103]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}