{"id":"https://openalex.org/W2068342572","doi":"https://doi.org/10.1109/coase.2007.4341700","title":"Forecasting Final/Class Yield Based on Fabrication Process E-Test and Sort Data","display_name":"Forecasting Final/Class Yield Based on Fabrication Process E-Test and Sort Data","publication_year":2007,"publication_date":"2007-09-01","ids":{"openalex":"https://openalex.org/W2068342572","doi":"https://doi.org/10.1109/coase.2007.4341700","mag":"2068342572"},"language":"en","primary_location":{"id":"doi:10.1109/coase.2007.4341700","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coase.2007.4341700","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE International Conference on Automation Science and Engineering","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113627314","display_name":"WK Yip","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I4210142644","display_name":"Intel (Malaysia)","ror":"https://ror.org/048jw1p35","country_code":"MY","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210142644"]}],"countries":["MY","US"],"is_corresponding":false,"raw_author_name":"WK Yip","raw_affiliation_strings":["Analytic Solutions Development, Intel Malaysia, Malaysia","Intel Malaysia, Kuala Lumpur"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Analytic Solutions Development, Intel Malaysia, Malaysia","institution_ids":["https://openalex.org/I4210142644"]},{"raw_affiliation_string":"Intel Malaysia, Kuala Lumpur","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111802141","display_name":"KG Law","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I4210142644","display_name":"Intel (Malaysia)","ror":"https://ror.org/048jw1p35","country_code":"MY","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210142644"]}],"countries":["MY","US"],"is_corresponding":false,"raw_author_name":"KG Law","raw_affiliation_strings":["Netcom & Chipset Operation (NC06), PG6, Intel Malaysia, Malaysia","Yield Manager, Netcom & Chipset Operation (NC06), PG6, Intel Malaysia. phone: 604-253-1083; fax: 604-253-2273; e-mail: kg.law@intel.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Netcom & Chipset Operation (NC06), PG6, Intel Malaysia, Malaysia","institution_ids":["https://openalex.org/I4210142644"]},{"raw_affiliation_string":"Yield Manager, Netcom & Chipset Operation (NC06), PG6, Intel Malaysia. phone: 604-253-1083; fax: 604-253-2273; e-mail: kg.law@intel.com","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058721003","display_name":"W.J. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I4210142644","display_name":"Intel (Malaysia)","ror":"https://ror.org/048jw1p35","country_code":"MY","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210142644"]}],"countries":["MY","US"],"is_corresponding":false,"raw_author_name":"WJ Lee","raw_affiliation_strings":["Intel Malaysia, Malaysia","Technical/Department Manager, Analytic Solutions Development, Intel Malaysia. phone: 604-253-7549; fax: 604-253-2273; e-mail: wen.jau.lee@intel.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Malaysia, Malaysia","institution_ids":["https://openalex.org/I4210142644"]},{"raw_affiliation_string":"Technical/Department Manager, Analytic Solutions Development, Intel Malaysia. phone: 604-253-7549; fax: 604-253-2273; e-mail: wen.jau.lee@intel.com","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"478","last_page":"483"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9355000257492065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/sort","display_name":"sort","score":0.704319417476654},{"id":"https://openalex.org/keywords/chipset","display_name":"Chipset","score":0.6907379627227783},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5644093751907349},{"id":"https://openalex.org/keywords/pareto-analysis","display_name":"Pareto analysis","score":0.5464940071105957},{"id":"https://openalex.org/keywords/pareto-principle","display_name":"Pareto principle","score":0.47671785950660706},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.44626447558403015},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4360731840133667},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.41996967792510986},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3716636598110199},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3376971483230591},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.3276200294494629},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.32313644886016846},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.1361583173274994},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.12362095713615417},{"id":"https://openalex.org/keywords/database","display_name":"Database","score":0.11271601915359497},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.11160564422607422}],"concepts":[{"id":"https://openalex.org/C88548561","wikidata":"https://www.wikidata.org/wiki/Q347599","display_name":"sort","level":2,"score":0.704319417476654},{"id":"https://openalex.org/C73431340","wikidata":"https://www.wikidata.org/wiki/Q182656","display_name":"Chipset","level":3,"score":0.6907379627227783},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5644093751907349},{"id":"https://openalex.org/C118127601","wikidata":"https://www.wikidata.org/wiki/Q3797610","display_name":"Pareto analysis","level":3,"score":0.5464940071105957},{"id":"https://openalex.org/C137635306","wikidata":"https://www.wikidata.org/wiki/Q182667","display_name":"Pareto principle","level":2,"score":0.47671785950660706},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.44626447558403015},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4360731840133667},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.41996967792510986},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3716636598110199},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3376971483230591},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.3276200294494629},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.32313644886016846},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.1361583173274994},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.12362095713615417},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.11271601915359497},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.11160564422607422},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/coase.2007.4341700","is_oa":false,"landing_page_url":"https://doi.org/10.1109/coase.2007.4341700","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE International Conference on Automation Science and Engineering","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.550000011920929}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2070493638","https://openalex.org/W2082026549","https://openalex.org/W2115243262","https://openalex.org/W2140667280","https://openalex.org/W2505320678","https://openalex.org/W4285719527","https://openalex.org/W6724897404"],"related_works":["https://openalex.org/W2347219288","https://openalex.org/W2157404973","https://openalex.org/W3020967476","https://openalex.org/W4220950790","https://openalex.org/W1971887980","https://openalex.org/W2543446632","https://openalex.org/W2135329032","https://openalex.org/W3125421190","https://openalex.org/W3088444635","https://openalex.org/W2068342572"],"abstract_inverted_index":{"This":[0],"paper":[1,31],"presents":[2,33],"an":[3],"application":[4],"of":[5,44,95],"data":[6],"mining":[7],"using":[8],"gradient":[9],"boosting":[10],"trees":[11],"to":[12,56,85,123,125,153],"predict":[13],"class":[14],"test":[15],"yield":[16,68,140,158],"performance":[17],"at":[18,51,70,145],"high":[19,97],"volume":[20],"manufacturing":[21,162],"(HVM)":[22],"based":[23],"on":[24],"e-test":[25,86],"and":[26,41,47,61,87,113,119,142,149,163],"sort":[27,88],"ancestry":[28],"parameters.":[29],"The":[30,129],"also":[32,90,104],"a":[34,135],"framework":[35],"for":[36,76,93,138],"the":[37,45,58,62,101,114,157],"predictive":[38,131],"capability":[39,132],"system":[40],"highlights":[42],"some":[43],"techniques":[46],"implementation":[48],"details.":[49],"Modeling":[50],"wafer":[52,66],"level":[53,67,75],"was":[54],"found":[55],"give":[57],"best":[59],"accuracy":[60,69,74],"analytic":[63],"model":[64],"provides":[65],"97%":[71],"within":[72],"plusmn2%":[73],"Intel":[77,146],"chipset":[78],"products.":[79],"Certain":[80],"functional":[81],"bins":[82],"that":[83,109],"correlate":[84],"can":[89],"be":[91],"modeled":[92],"identification":[94],"possible":[96],"fallouts.":[98],"In":[99],"addition,":[100],"modeling":[102],"process":[103],"produced":[105],"Pareto":[106],"analysis":[107],"reports":[108],"lists":[110],"dominant":[111],"influencers":[112],"dependency":[115],"plots,":[116],"enabling":[117],"Assembly":[118],"Test":[120],"(ATM)":[121],"engineers":[122],"feedback":[124],"upstream":[126],"operation":[127],"engineers.":[128],"overall":[130],"has":[133],"set":[134],"new":[136],"standard":[137],"proactive":[139],"monitoring":[141],"excursion":[143],"management":[144],"ATM":[147],"factories":[148],"it":[150],"is":[151],"useful":[152],"various":[154],"functions":[155],"including":[156],"engineering,":[159,161],"product":[160],"planning.":[164]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}