{"id":"https://openalex.org/W2537769410","doi":"https://doi.org/10.1109/cmpcon.1994.282904","title":"A workstation I/O system on a chip","display_name":"A workstation I/O system on a chip","publication_year":2002,"publication_date":"2002-12-17","ids":{"openalex":"https://openalex.org/W2537769410","doi":"https://doi.org/10.1109/cmpcon.1994.282904","mag":"2537769410"},"language":"en","primary_location":{"id":"doi:10.1109/cmpcon.1994.282904","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cmpcon.1994.282904","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of COMPCON '94","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023206873","display_name":"Todd Spencer","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Spencer","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078841520","display_name":"F. Lettang","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Lettang","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022273370","display_name":"Curtis McAllister","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. McAllister","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037197387","display_name":"T. Riccio","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Riccio","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041772078","display_name":"J. Orth","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Orth","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012825824","display_name":"D. Weiss","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Weiss","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5024375886","display_name":"B. Arnold","orcid":"https://orcid.org/0000-0002-1229-9092"},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Arnold","raw_affiliation_strings":["Hewlett Packard Company, Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I1324840837"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1324840837"],"apc_list":null,"apc_paid":null,"fwci":0.2297,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.63371202,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"369","last_page":"374"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9848999977111816,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9848999977111816,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.982699990272522,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9771999716758728,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/workstation","display_name":"Workstation","score":0.8492348194122314},{"id":"https://openalex.org/keywords/compatibility","display_name":"Compatibility (geochemistry)","score":0.6487545967102051},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5940161943435669},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5878772735595703},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5809265375137329},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5602653622627258},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5291227102279663},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.48981401324272156},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.35568180680274963},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.35535335540771484},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25053656101226807},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1744091808795929}],"concepts":[{"id":"https://openalex.org/C67953723","wikidata":"https://www.wikidata.org/wiki/Q192525","display_name":"Workstation","level":2,"score":0.8492348194122314},{"id":"https://openalex.org/C2778648169","wikidata":"https://www.wikidata.org/wiki/Q967768","display_name":"Compatibility (geochemistry)","level":2,"score":0.6487545967102051},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5940161943435669},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5878772735595703},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5809265375137329},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5602653622627258},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5291227102279663},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.48981401324272156},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.35568180680274963},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.35535335540771484},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25053656101226807},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1744091808795929},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cmpcon.1994.282904","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cmpcon.1994.282904","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of COMPCON '94","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4399999976158142}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W1480457706"],"related_works":["https://openalex.org/W2045348955","https://openalex.org/W2352028719","https://openalex.org/W2584886384","https://openalex.org/W2378667902","https://openalex.org/W2791088446","https://openalex.org/W2098218272","https://openalex.org/W2134640991","https://openalex.org/W3027318491","https://openalex.org/W1979789826","https://openalex.org/W1986774039"],"abstract_inverted_index":{"Describes":[0],"the":[1,5,19,28,31,40,44,57],"I/O":[2,32],"sub-system":[3],"for":[4],"new":[6],"low-end":[7],"of":[8,13,22,30,43,56,64,69,80],"HP's":[9],"Series":[10,58],"700":[11,59],"family":[12],"workstations.":[14],"The":[15],"paper":[16],"focuses":[17],"on":[18,76],"single":[20,78],"piece":[21,79],"custom":[23],"VLSI":[24],"that":[25],"serves":[26],"as":[27],"heart":[29],"sub-system.":[33],"This":[34],"chip":[35],"was":[36,74],"optimized":[37],"to":[38,82],"minimize":[39],"manufacturing":[41,88],"cost":[42],"system":[45],"while":[46],"maintaining":[47],"functional":[48],"compatibility":[49],"and":[50,91],"comparable":[51],"performance":[52],"with":[53],"existing":[54],"members":[55],"family.":[60],"A":[61],"wide":[62],"range":[63],"functionalities":[65],"from":[66],"a":[67,77],"variety":[68],"sources":[70],"(including":[71],"outside":[72],"vendors)":[73],"combined":[75],"silicon":[81],"obtain":[83],"an":[84],"optimal":[85],"balance":[86],"between":[87],"cost,":[89],"performance,":[90],"software":[92],"compatibility.<":[93],"<ETX":[94],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[95],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">&gt;</ETX>":[96]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}