{"id":"https://openalex.org/W4390482254","doi":"https://doi.org/10.1109/cis-ram55796.2023.10370014","title":"Adaptive Modelling for Anomaly Detection and Defect Diagnosis in Semiconductor Smart Manufacturing: A Domain-specific AutoML","display_name":"Adaptive Modelling for Anomaly Detection and Defect Diagnosis in Semiconductor Smart Manufacturing: A Domain-specific AutoML","publication_year":2023,"publication_date":"2023-06-09","ids":{"openalex":"https://openalex.org/W4390482254","doi":"https://doi.org/10.1109/cis-ram55796.2023.10370014"},"language":"en","primary_location":{"id":"doi:10.1109/cis-ram55796.2023.10370014","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cis-ram55796.2023.10370014","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108890626","display_name":"Weihong Zhai","orcid":null},"institutions":[{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]},{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Weihong Zhai","raw_affiliation_strings":["Shanghai University (SHU),School of Microelectronics,Shanghai,China","School of Microelectronics, Shanghai University (SHU), Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai University (SHU),School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I4210132426"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University (SHU), Shanghai, China","institution_ids":["https://openalex.org/I113940042"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103232609","display_name":"Xiupeng Shi","orcid":"https://orcid.org/0000-0003-4930-6193"},"institutions":[{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]},{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiupeng Shi","raw_affiliation_strings":["Shanghai University (SHU),School of Microelectronics,Shanghai,China","School of Microelectronics, Shanghai University (SHU), Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai University (SHU),School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I4210132426"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University (SHU), Shanghai, China","institution_ids":["https://openalex.org/I113940042"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010092389","display_name":"Zeng Zeng","orcid":"https://orcid.org/0000-0002-2405-0323"},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zeng Zeng","raw_affiliation_strings":["Shanghai University (SHU),School of Microelectronics,Shanghai,China","School of Microelectronics, Shanghai University (SHU), Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai University (SHU),School of Microelectronics,Shanghai,China","institution_ids":["https://openalex.org/I4210132426"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University (SHU), Shanghai, China","institution_ids":["https://openalex.org/I113940042"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5108890626"],"corresponding_institution_ids":["https://openalex.org/I113940042","https://openalex.org/I4210132426"],"apc_list":null,"apc_paid":null,"fwci":1.2478,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.83117421,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"198","last_page":"203"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11443","display_name":"Advanced Statistical Process Monitoring","score":0.9775999784469604,"subfield":{"id":"https://openalex.org/subfields/1804","display_name":"Statistics, Probability and Uncertainty"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/anomaly-detection","display_name":"Anomaly detection","score":0.7376624941825867},{"id":"https://openalex.org/keywords/anomaly","display_name":"Anomaly (physics)","score":0.5156475305557251},{"id":"https://openalex.org/keywords/domain","display_name":"Domain (mathematical analysis)","score":0.5003488063812256},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4726112186908722},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4640125036239624},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3358033299446106},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3112906813621521},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1591462790966034},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1278264820575714},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10793054103851318},{"id":"https://openalex.org/keywords/condensed-matter-physics","display_name":"Condensed matter physics","score":0.07981964945793152}],"concepts":[{"id":"https://openalex.org/C739882","wikidata":"https://www.wikidata.org/wiki/Q3560506","display_name":"Anomaly detection","level":2,"score":0.7376624941825867},{"id":"https://openalex.org/C12997251","wikidata":"https://www.wikidata.org/wiki/Q567560","display_name":"Anomaly (physics)","level":2,"score":0.5156475305557251},{"id":"https://openalex.org/C36503486","wikidata":"https://www.wikidata.org/wiki/Q11235244","display_name":"Domain (mathematical analysis)","level":2,"score":0.5003488063812256},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4726112186908722},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4640125036239624},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3358033299446106},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3112906813621521},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1591462790966034},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1278264820575714},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10793054103851318},{"id":"https://openalex.org/C26873012","wikidata":"https://www.wikidata.org/wiki/Q214781","display_name":"Condensed matter physics","level":1,"score":0.07981964945793152},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cis-ram55796.2023.10370014","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cis-ram55796.2023.10370014","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W2000651380","https://openalex.org/W2062227835","https://openalex.org/W2131241448","https://openalex.org/W2192203593","https://openalex.org/W2295598076","https://openalex.org/W2524620548","https://openalex.org/W2556522401","https://openalex.org/W2768348081","https://openalex.org/W2945339512","https://openalex.org/W2945790622","https://openalex.org/W2947666609","https://openalex.org/W2960929683","https://openalex.org/W2963351448","https://openalex.org/W2963445059","https://openalex.org/W2963674559","https://openalex.org/W3038712064","https://openalex.org/W3109695503","https://openalex.org/W4211116959","https://openalex.org/W6638209102","https://openalex.org/W6677088747","https://openalex.org/W6678911119","https://openalex.org/W6730169791","https://openalex.org/W6745609711","https://openalex.org/W6751421292","https://openalex.org/W6757844995"],"related_works":["https://openalex.org/W2806741695","https://openalex.org/W4290647774","https://openalex.org/W3189286258","https://openalex.org/W3207797160","https://openalex.org/W3210364259","https://openalex.org/W4300558037","https://openalex.org/W2912112202","https://openalex.org/W2667207928","https://openalex.org/W4377864969","https://openalex.org/W2972971679"],"abstract_inverted_index":{"Early":[0],"detection":[1,49],"and":[2,36,50,78,120,140,160,176,212,215],"diagnosis":[3,52],"of":[4,28,87,178,208],"the":[5,26,55,82,109,122,132,137,147,152,179,189,206],"defect":[6,51],"in":[7,18,170,204],"semiconductor":[8,59,171,217],"wafer":[9,172],"production":[10],"offer":[11],"significant":[12],"advantages":[13],"for":[14,31,47,58],"various":[15],"advanced":[16],"solutions":[17],"smart":[19],"manufacturing.":[20],"However,":[21],"inherent":[22],"challenges":[23,207],"exist,":[24],"including":[25],"absence":[27],"physical":[29],"interpretation":[30],"features,":[32],"data":[33,75,95,168],"imbalance,":[34],"heterogeneous":[35],"missing":[37],"data.":[38],"This":[39],"study":[40],"proposes":[41],"a":[42,85,100],"domain-specific":[43],"AutoML":[44],"(termed":[45],"AutoClassifier)":[46],"anomaly":[48,117],"to":[53,145,195],"self-learn":[54],"optimal":[56],"models":[57],"defects,":[60],"enabling":[61],"end-to-end":[62],"machine":[63],"learning,":[64],"which":[65,73,162,186],"integrates":[66,155],"four":[67],"main":[68],"contributions.":[69],"Firstly,":[70],"feature":[71,101],"engineering,":[72],"includes":[74],"preprocessing,":[76],"extraction,":[77],"selection":[79,102,177],"based":[80,130],"on":[81,131,164],"SECOM":[83],"dataset,":[84],"series":[86],"features":[88,107],"are":[89,143],"extracted":[90],"by":[91],"interpolation":[92],"methods":[93],"after":[94],"cleaning.":[96],"Then,":[97],"we":[98],"use":[99],"approach":[103],"that":[104,200],"pinpoints":[105],"valuable":[106],"through":[108],"elimination-based":[110],"model":[111],"reliance":[112],"importance":[113],"technique.":[114],"Secondly,":[115],"unsupervised":[116],"detection,":[118],"estimate":[119],"judge":[121],"defect\u2019s":[123],"categories,":[124],"Process-induced":[125],"defects":[126],"or":[127],"anomalies.":[128],"Thirdly,":[129],"hyperparameters":[133],"optimization":[134],"algorithm":[135,138,180],"Hyperband,":[136],"auto-selection":[139],"hyperparameter":[141],"auto-tuning":[142],"self-learned":[144],"generate":[146],"best":[148],"defect-classifying":[149],"results.":[150],"Fourthly,":[151],"focal":[153,182],"loss":[154,183],"into":[156],"state-of-the-art":[157],"classifiers":[158],"LightGBM":[159],"XGBoost,":[161],"focus":[163],"settling":[165],"down":[166],"widespread":[167],"imbalance":[169],"production.":[173],"The":[174,197],"comparison":[175],"prove":[181],"is":[184,202],"effective,":[185],"has":[187],"improved":[188],"overall":[190],"F1":[191],"score":[192],"from":[193],"85%":[194],"92.3%.":[196],"results":[198],"show":[199],"AutoClassifier":[201],"useful":[203],"tackling":[205],"imbalanced":[209],"process":[210],"data,":[211],"effectively":[213],"detects":[214],"diagnoses":[216],"defects.":[218]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}