{"id":"https://openalex.org/W4253367659","doi":"https://doi.org/10.1109/cicc.2018.8357060","title":"Analog/mixed-signal design challenges in 7-nm CMOS and beyond","display_name":"Analog/mixed-signal design challenges in 7-nm CMOS and beyond","publication_year":2018,"publication_date":"2018-04-01","ids":{"openalex":"https://openalex.org/W4253367659","doi":"https://doi.org/10.1109/cicc.2018.8357060"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2018.8357060","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2018.8357060","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024702898","display_name":"Alvin L. S. Loke","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Alvin L. S. Loke","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102077773","display_name":"Da Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Da Yang","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042388706","display_name":"Tin Tin Wee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tin Tin Wee","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061745529","display_name":"Jonathan L. Holland","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jonathan L. Holland","raw_affiliation_strings":["Qualcomm Technologies Incorporated, Raleigh, NC, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, Raleigh, NC, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079257040","display_name":"Patrick Isakanian","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Patrick Isakanian","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110419263","display_name":"Kern Rim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kern Rim","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103399629","display_name":"Sam Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sam Yang","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028218111","display_name":"Jacob S. Schneider","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jacob S. Schneider","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076705425","display_name":"Giri Nallapati","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Giri Nallapati","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004276725","display_name":"Sreeker Dundigal","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sreeker Dundigal","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002626327","display_name":"Hasnain Lakdawala","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hasnain Lakdawala","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029728957","display_name":"Behnam Amelifard","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Behnam Amelifard","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112855690","display_name":"Chulkyu Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chulkyu Lee","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071687287","display_name":"B.P. McGovern","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Betty McGovern","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030027738","display_name":"Paul S. Holdaway","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul S. Holdaway","raw_affiliation_strings":["Qualcomm Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055310909","display_name":"Xiaohua Kong","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaohua Kong","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073569808","display_name":"Burton M. Leary","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Burton M. Leary","raw_affiliation_strings":["Qualcomm Technologies Incorporated, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies Incorporated, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":17,"corresponding_author_ids":["https://openalex.org/A5024702898"],"corresponding_institution_ids":["https://openalex.org/I4210087596"],"apc_list":null,"apc_paid":null,"fwci":1.6738,"has_fulltext":false,"cited_by_count":33,"citation_normalized_percentile":{"value":0.85498377,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.6112074851989746},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.600758969783783},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.5909993648529053},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5486061573028564},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5225074887275696},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.46335816383361816},{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.4611212909221649},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4383545517921448},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.42760026454925537},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.38056784868240356},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.37816929817199707},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3416786193847656},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.302640825510025}],"concepts":[{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.6112074851989746},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.600758969783783},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.5909993648529053},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5486061573028564},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5225074887275696},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.46335816383361816},{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.4611212909221649},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4383545517921448},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.42760026454925537},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.38056784868240356},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.37816929817199707},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3416786193847656},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.302640825510025},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2018.8357060","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2018.8357060","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.550000011920929,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1970378538","https://openalex.org/W1974338211","https://openalex.org/W1977509267","https://openalex.org/W2015428081","https://openalex.org/W2021819509","https://openalex.org/W2052822829","https://openalex.org/W2079766271","https://openalex.org/W2097207701","https://openalex.org/W2098569223","https://openalex.org/W2099697258","https://openalex.org/W2120475991","https://openalex.org/W2133201500","https://openalex.org/W2137440475","https://openalex.org/W2141369310","https://openalex.org/W2145117826","https://openalex.org/W2152224839","https://openalex.org/W2162517322","https://openalex.org/W2292498009","https://openalex.org/W2464059327","https://openalex.org/W2523846205","https://openalex.org/W2526988581","https://openalex.org/W2534881376","https://openalex.org/W2584298940","https://openalex.org/W2593061314","https://openalex.org/W2742997206","https://openalex.org/W6682834698","https://openalex.org/W6697025161","https://openalex.org/W6727192802","https://openalex.org/W6727276998","https://openalex.org/W6742536331"],"related_works":["https://openalex.org/W2031235560","https://openalex.org/W2161335888","https://openalex.org/W4242383160","https://openalex.org/W2114773158","https://openalex.org/W2548106609","https://openalex.org/W2154989823","https://openalex.org/W2266281062","https://openalex.org/W2031524324","https://openalex.org/W67308010","https://openalex.org/W1852277090"],"abstract_inverted_index":{"The":[0],"economics":[1],"of":[2,89,99,113],"CMOS":[3],"scaling":[4],"remain":[5],"lucrative":[6],"with":[7,96,102],"7-nm":[8],"mobile":[9],"SoCs":[10],"expected":[11],"to":[12,36,46,51,69,124,137,141],"be":[13],"commercialized":[14],"in":[15,24,83],"2018.":[16],"Driven":[17],"by":[18],"careful":[19],"design/technology":[20],"co-optimization,":[21],"modest":[22],"reduction":[23],"fin,":[25],"gate,":[26],"and":[27,43,49,75,80,122,143],"interconnect":[28],"pitch":[29],"as":[30,32],"well":[31],"process":[33,116],"innovations":[34],"continue":[35],"offer":[37,133],"compelling":[38],"node-to-node":[39],"power,":[40],"performance,":[41],"area,":[42],"cost":[44],"benefits":[45],"advance":[47],"logic":[48],"SRAM":[50],"the":[52,97,114],"next":[53],"foundry":[54],"node.":[55],"However,":[56],"analog/mixed-signal":[57,126],"circuits":[58],"do":[59],"not":[60],"fully":[61],"realize":[62],"these":[63,90],"improvements.":[64],"They":[65],"become":[66],"more":[67],"cumbersome":[68],"design,":[70],"having":[71],"worse":[72],"parasitic":[73],"resistance":[74],"capacitance,":[76],"stronger":[77],"layout-dependent":[78],"effects,":[79],"layout":[81,134],"growth":[82],"some":[84],"situations.":[85],"Furthermore,":[86],"early":[87],"adopters":[88],"cutting-edge":[91],"finFET":[92],"nodes":[93],"must":[94],"cope":[95],"complications":[98],"design":[100,127,139],"concurrent":[101],"technology":[103,117,142],"development":[104],"for":[105],"shorter":[106],"product":[107],"time-to-market.":[108],"We":[109],"provide":[110],"an":[111],"overview":[112],"key":[115],"elements":[118],"enabling":[119],"7":[120],"nm":[121],"beyond":[123],"address":[125],"challenges.":[128],"From":[129],"this":[130],"insight,":[131],"we":[132],"guidelines":[135],"aimed":[136],"reduce":[138],"vulnerability":[140],"model":[144],"immaturity.":[145]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":5},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}