{"id":"https://openalex.org/W2178571280","doi":"https://doi.org/10.1109/cicc.2015.7338400","title":"A novel low cost, high performance and reliable silicon interposer","display_name":"A novel low cost, high performance and reliable silicon interposer","publication_year":2015,"publication_date":"2015-09-01","ids":{"openalex":"https://openalex.org/W2178571280","doi":"https://doi.org/10.1109/cicc.2015.7338400","mag":"2178571280"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2015.7338400","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2015.7338400","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091302811","display_name":"Farhang Yazdani","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Farhang Yazdani","raw_affiliation_strings":["BroadPak Corporation, San Jose, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"BroadPak Corporation, San Jose, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5091302811"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.8235,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.67810651,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.9896852374076843},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.6820476055145264},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6438582539558411},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6175094842910767},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6174121499061584},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.5966158509254456},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5606224536895752},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5358617901802063},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.523327112197876},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.48846521973609924},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.46116986870765686},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.4413938820362091},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3429625630378723},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3403562903404236},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.2896687388420105},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.25847548246383667},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.23973849415779114},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.2111440896987915},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.18513670563697815},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12433171272277832},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.0638224184513092}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9896852374076843},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6820476055145264},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6438582539558411},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6175094842910767},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6174121499061584},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.5966158509254456},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5606224536895752},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5358617901802063},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.523327112197876},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48846521973609924},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.46116986870765686},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.4413938820362091},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3429625630378723},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3403562903404236},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2896687388420105},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.25847548246383667},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.23973849415779114},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.2111440896987915},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.18513670563697815},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12433171272277832},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.0638224184513092},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2015.7338400","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2015.7338400","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1970419561","https://openalex.org/W2038062611","https://openalex.org/W2045697480","https://openalex.org/W2094207420","https://openalex.org/W2128588826","https://openalex.org/W2236873562","https://openalex.org/W2258982327","https://openalex.org/W6692081375","https://openalex.org/W7008668105"],"related_works":["https://openalex.org/W2243331684","https://openalex.org/W2918291679","https://openalex.org/W2149087909","https://openalex.org/W1528217121","https://openalex.org/W2895920022","https://openalex.org/W2138574771","https://openalex.org/W3189070795","https://openalex.org/W1990828594","https://openalex.org/W2090841045","https://openalex.org/W2333804548"],"abstract_inverted_index":{"Silicon":[0],"interposer":[1,35,61,94,116,151],"has":[2],"emerged":[3],"as":[4,74,76],"a":[5,47,124,132,136],"substrate":[6],"of":[7,18,24,39,59,83,92,112,114,148,155],"choice":[8],"for":[9,71],"integrating":[10],"fine":[11],"pitch,":[12],"high":[13],"density":[14],"devices.":[15],"Conventional":[16],"packaging":[17],"2.5D/3D":[19,27,72],"devices":[20,28],"involves":[21],"multiple":[22],"level":[23,44],"assemblies.":[25],"Normally,":[26],"are":[29],"first":[30],"assembled":[31,130],"on":[32,46,62,85,95,105,131,152,157],"thinned":[33],"silicon":[34,60,93,109,150],"with":[36,119],"aspect":[37],"ratio":[38],"10:100":[40],"followed":[41],"by":[42],"second":[43],"assembly":[45,58,91,147],"multi-layer":[48],"organic":[49],"build-up":[50],"substrate.":[51,110],"In":[52],"this":[53],"study":[54],"we":[55],"introduce":[56],"direct":[57,90,146],"PCB,":[63],"resulting":[64],"in":[65],"reduced":[66],"cost":[67,141],"and":[68,103,145,174],"increased":[69],"performance":[70],"applications":[73],"well":[75],"wafer-level":[77],"fan-out":[78],"applications.":[79],"We":[80,139],"investigate":[81],"effect":[82],"under-fill":[84,156],"solder":[86,121,159],"joint":[87,160],"reliability":[88,161],"during":[89,167],"PCB.":[96,153],"A":[97],"10\u00d710mm2interposer":[98],"test":[99],"vehicle":[100],"was":[101,117,128],"designed":[102],"fabricated":[104],"310um":[106],"thick":[107],"rigid":[108,149],"BGA":[111],"side":[113],"the":[115,158,185],"bumped":[118],"eutectic":[120],"balls":[122],"through":[123,135],"reflow":[125,137],"process.":[126,138],"Interposer":[127],"then":[129],"50\u00d750mm2FR-4":[133],"PCB":[134],"present":[140],"analysis,":[142],"design":[143],"flow,":[144],"Effect":[154],"is":[162,178],"demonstrated":[163],"using":[164],"CSAM":[165],"images":[166],"temperature":[168,186],"cycles":[169],"at":[170],"250,":[171],"500,":[172],"750":[173],"1000":[175],"intervals.":[176],"It":[177],"shown":[179],"that":[180],"all":[181],"samples":[182],"successfully":[183],"passed":[184],"cycle":[187],"stress":[188],"test.":[189]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}