{"id":"https://openalex.org/W2002502409","doi":"https://doi.org/10.1109/cicc.2014.6946048","title":"Enabling flexible datacenter interconnect networks with WDM silicon photonics","display_name":"Enabling flexible datacenter interconnect networks with WDM silicon photonics","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2002502409","doi":"https://doi.org/10.1109/cicc.2014.6946048","mag":"2002502409"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2014.6946048","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2014.6946048","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2014 Custom Integrated Circuits Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109928167","display_name":"G.A. Fish","orcid":null},"institutions":[{"id":"https://openalex.org/I4210108732","display_name":"Aurrion (United States)","ror":"https://ror.org/021a9kk09","country_code":"US","type":"company","lineage":["https://openalex.org/I4210108732"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Gregory A. Fish","raw_affiliation_strings":["Aurrion, Inc., Goleta, CA, USA","Aurrion, Inc., 130 Robin Hill Road STE 300, Goleta, CA 93117, USA"],"affiliations":[{"raw_affiliation_string":"Aurrion, Inc., Goleta, CA, USA","institution_ids":["https://openalex.org/I4210108732"]},{"raw_affiliation_string":"Aurrion, Inc., 130 Robin Hill Road STE 300, Goleta, CA 93117, USA","institution_ids":["https://openalex.org/I4210108732"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108457638","display_name":"Daniel K. Sparacin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210108732","display_name":"Aurrion (United States)","ror":"https://ror.org/021a9kk09","country_code":"US","type":"company","lineage":["https://openalex.org/I4210108732"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daniel K. Sparacin","raw_affiliation_strings":["Aurrion, Inc., Goleta, CA, USA","Aurrion, Inc., 130 Robin Hill Road STE 300, Goleta, CA 93117, USA"],"affiliations":[{"raw_affiliation_string":"Aurrion, Inc., Goleta, CA, USA","institution_ids":["https://openalex.org/I4210108732"]},{"raw_affiliation_string":"Aurrion, Inc., 130 Robin Hill Road STE 300, Goleta, CA 93117, USA","institution_ids":["https://openalex.org/I4210108732"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5109928167"],"corresponding_institution_ids":["https://openalex.org/I4210108732"],"apc_list":null,"apc_paid":null,"fwci":0.8373,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.76524708,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10847","display_name":"Advanced Optical Network Technologies","score":0.9843000173568726,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.7316058874130249},{"id":"https://openalex.org/keywords/silicon-photonics","display_name":"Silicon photonics","score":0.7117364406585693},{"id":"https://openalex.org/keywords/photonics","display_name":"Photonics","score":0.6420496702194214},{"id":"https://openalex.org/keywords/optical-interconnect","display_name":"Optical interconnect","score":0.6190325617790222},{"id":"https://openalex.org/keywords/photonic-integrated-circuit","display_name":"Photonic integrated circuit","score":0.6038506031036377},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5633896589279175},{"id":"https://openalex.org/keywords/wavelength-division-multiplexing","display_name":"Wavelength-division multiplexing","score":0.5264462232589722},{"id":"https://openalex.org/keywords/photodiode","display_name":"Photodiode","score":0.5063928365707397},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4470333456993103},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.4388197064399719},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4219174385070801},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3849390149116516},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.384752094745636},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.37625443935394287},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.23486462235450745},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21801120042800903}],"concepts":[{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.7316058874130249},{"id":"https://openalex.org/C119423029","wikidata":"https://www.wikidata.org/wiki/Q3749103","display_name":"Silicon photonics","level":3,"score":0.7117364406585693},{"id":"https://openalex.org/C20788544","wikidata":"https://www.wikidata.org/wiki/Q467054","display_name":"Photonics","level":2,"score":0.6420496702194214},{"id":"https://openalex.org/C2777759342","wikidata":"https://www.wikidata.org/wiki/Q7098860","display_name":"Optical interconnect","level":3,"score":0.6190325617790222},{"id":"https://openalex.org/C22799297","wikidata":"https://www.wikidata.org/wiki/Q523846","display_name":"Photonic integrated circuit","level":3,"score":0.6038506031036377},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5633896589279175},{"id":"https://openalex.org/C160724564","wikidata":"https://www.wikidata.org/wiki/Q1620670","display_name":"Wavelength-division multiplexing","level":3,"score":0.5264462232589722},{"id":"https://openalex.org/C751236","wikidata":"https://www.wikidata.org/wiki/Q175943","display_name":"Photodiode","level":2,"score":0.5063928365707397},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4470333456993103},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4388197064399719},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4219174385070801},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3849390149116516},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.384752094745636},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.37625443935394287},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.23486462235450745},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21801120042800903},{"id":"https://openalex.org/C6260449","wikidata":"https://www.wikidata.org/wiki/Q41364","display_name":"Wavelength","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2014.6946048","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2014.6946048","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2014 Custom Integrated Circuits Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2054635684","https://openalex.org/W2060333648","https://openalex.org/W4233274709","https://openalex.org/W6664171421"],"related_works":["https://openalex.org/W2900461715","https://openalex.org/W4247164655","https://openalex.org/W2346907559","https://openalex.org/W2014132141","https://openalex.org/W2324620072","https://openalex.org/W2555866978","https://openalex.org/W4239931423","https://openalex.org/W2316964734","https://openalex.org/W2316083522","https://openalex.org/W1575967697"],"abstract_inverted_index":{"Datacenters":[0],"are":[1],"creating":[2],"an":[3],"unprecedented":[4],"challenge":[5],"for":[6,85,91],"optical":[7],"transceivers":[8,89],"requiring":[9],"multiple":[10],"high":[11,54],"performance":[12,55],"lasers,":[13],"modulators":[14],"and":[15,31,37,93],"photodiodes":[16],"in":[17],"a":[18,48,69],"single":[19,82],"module":[20],"to":[21,58,79],"meet":[22],"growing":[23],"bandwidth":[24],"needs":[25],"along":[26],"with":[27],"dramatically":[28],"lower":[29],"power":[30],"cost":[32],"reflecting":[33],"the":[34,81],"higher":[35],"volume":[36],"density":[38],"of":[39,44,71],"interconnections.":[40],"The":[41],"heterogeneous":[42],"integration":[43],"InP":[45],"material":[46],"into":[47],"silicon":[49,63],"photonics":[50],"wafer":[51],"flow":[52],"enables":[53],"integrated":[56],"circuits":[57],"be":[59,77],"fabricated":[60],"using":[61],"established":[62,68],"foundry":[64],"infrastructure.":[65],"Aurrion":[66],"has":[67],"library":[70],"photonic":[72],"circuit":[73],"elements":[74],"which":[75],"can":[76],"combined":[78],"form":[80],"chip":[83],"solutions":[84],"products":[86],"like":[87],"100Gb/s":[88],"needed":[90],"current":[92],"next":[94],"generation":[95],"datacenter":[96],"applications.":[97]},"counts_by_year":[{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}